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T74LS14C1

Description
LS SERIES, HEX 1-INPUT INVERT GATE, PQCC20, PLASTIC, LCC-20
Categorylogic    logic   
File Size83KB,4 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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T74LS14C1 Overview

LS SERIES, HEX 1-INPUT INVERT GATE, PQCC20, PLASTIC, LCC-20

T74LS14C1 Parametric

Parameter NameAttribute value
MakerSTMicroelectronics
Parts packaging codeQLCC
package instructionQCCJ,
Contacts20
Reach Compliance Codeunknown
seriesLS
JESD-30 codeS-PQCC-J20
length8.9662 mm
Load capacitance (CL)15 pF
Logic integrated circuit typeINVERTER
Number of functions6
Number of entries1
Number of terminals20
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Maximum supply current (ICC)21 mA
propagation delay (tpd)22 ns
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelCOMMERCIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width8.9662 mm
Base Number Matches1

T74LS14C1 Related Products

T74LS14C1 T74LS14D1 T74LS14M1 T74LS14B1
Description LS SERIES, HEX 1-INPUT INVERT GATE, PQCC20, PLASTIC, LCC-20 LS SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14 LS SERIES, HEX 1-INPUT INVERT GATE, PDSO14, MICRO, SO-14 LS SERIES, HEX 1-INPUT INVERT GATE, PDIP14, PLASTIC, DIP-14
Parts packaging code QLCC DIP SOIC DIP
package instruction QCCJ, DIP, DIP14,.3 SOP, SOP14,.25 DIP, DIP14,.3
Contacts 20 14 14 14
Reach Compliance Code unknown not_compliant not_compliant not_compliant
series LS LS LS LS
JESD-30 code S-PQCC-J20 R-GDIP-T14 R-PDSO-G14 R-PDIP-T14
Load capacitance (CL) 15 pF 15 pF 15 pF 15 pF
Logic integrated circuit type INVERTER INVERTER INVERTER INVERTER
Number of functions 6 6 6 6
Number of entries 1 1 1 1
Number of terminals 20 14 14 14
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ DIP SOP DIP
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE SMALL OUTLINE IN-LINE
Maximum supply current (ICC) 21 mA 21 mA 21 mA 21 mA
propagation delay (tpd) 22 ns 22 ns 22 ns 22 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 5.08 mm 1.75 mm 5.1 mm
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO YES NO
technology TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form J BEND THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location QUAD DUAL DUAL DUAL
width 8.9662 mm 7.62 mm 3.9 mm 7.62 mm
Maker STMicroelectronics - STMicroelectronics STMicroelectronics
Is it lead-free? - Contains lead Contains lead Contains lead
Is it Rohs certified? - incompatible incompatible incompatible
JESD-609 code - e0 e0 e0
Encapsulate equivalent code - DIP14,.3 SOP14,.25 DIP14,.3
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 5 V 5 V 5 V
Schmitt trigger - YES YES YES
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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