FH8065801620004S-R23W datasheet, PDF

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FH8065801620004S-R23W: DescriptionCPU - Central Processing Units CORE i7-5500U 2.4GHz 64BIT MPU FCBGA1168; Categorysemiconductor The embedded processor and controller; File Size3MB，133 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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FH8065801620004S-R23W Overview

CPU - Central Processing Units CORE i7-5500U 2.4GHz 64BIT MPU FCBGA1168

FH8065801620004S-R23W Parametric

Parameter Name	Attribute value
Product Category	CPU - Central Processing Units
Manufacturer	Intel
RoHS	Details
Product	Mobile Processors
Package / Case	FCLGA-1151
Family	Intel Core i7
Core	Intel Core i7
Code Name	Broadwell
Embedded Options	Non-Embedded
Number of Cores	2 Core
TDP - Max	15 W
Maximum Clock Frequency	2.4 GHz
Data Bus Width	64 bit
Memory Size	16 GB
Memory Type	DDR3L-1333/1600, LPDDR3-1333/1600
System Bus Type	DMI2
System Bus Speed	5 GT/s
Cache Memory	4 MB
Maximum Operating Temperature	+ 105 C
Packaging	Tray
CPU Configuration - Max	1 Configuration
Intel Hyper-Threading Technology	With HT Technology
Intel Virtualization Technology - VT	With VT
Lithography - Process Technology	14 nm
Moisture Sensitive	Yes
Mounting Style	SMD/SMT
Number of Displays Supported	3 Display
Number of Memory Channels	2 Channel
Number of PCI Express Lanes	12 Lane
Number of Threads	4 Thread
Package / Case Size	40 mm x 24 mm x 1.3 mm
PCIe Configurations	4x1 + 2x4
PCIe Revision	Revision 2.0
Factory Pack Quantity	1
Turbo Frequency - Max	3 GHz

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Desktop 5th Generation Intel

Core

™

Processor Family

Datasheet – Volume 1 of 2

Supporting 5th Generation Intel

Core

™

Processor based on

Desktop H-Processor Line

June 2015

Order No.: 332376-001v1

Contents—Processor

Contents

Revision History..................................................................................................................9

1.0 Introduction................................................................................................................10

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

Supported Technologies.........................................................................................11

Interfaces............................................................................................................ 12

Power Management Support...................................................................................12

Thermal Management Support................................................................................13

Package Support...................................................................................................13

Processor Testability............................................................................................. 13

Terminology.........................................................................................................13

Related Documents............................................................................................... 17

2.0 Interfaces................................................................................................................... 18

2.1 System Memory Interface...................................................................................... 18

2.1.1 System Memory Technology Supported.......................................................19

2.1.2 System Memory Timing Support................................................................. 20

2.1.3 System Memory Organization Modes........................................................... 20

2.1.4 System Memory Frequency........................................................................ 22

2.1.5 Intel

Fast Memory Access (Intel

FMA) Technology Enhancements............... 22

2.1.6 Data Scrambling....................................................................................... 22

2.2 PCI Express* Interface.......................................................................................... 23

2.2.1 PCI Express* Support................................................................................ 23

2.2.2 PCI Express* Architecture.......................................................................... 24

2.2.3 PCI Express* Configuration Mechanism........................................................ 24

2.3 Direct Media Interface (DMI).................................................................................. 26

2.4 Processor Graphics................................................................................................28

2.5 Processor Graphics Controller (GT)..........................................................................28

2.5.1 3D and Video Engines for Graphics Processing.............................................. 29

2.5.2 Multi Graphics Controllers Multi-Monitor Support........................................... 31

2.6 Digital Display Interface (DDI)................................................................................31

2.7 Intel

Flexible Display Interface (Intel

FDI)............................................................ 37

2.8 Platform Environmental Control Interface (PECI)....................................................... 37

2.8.1 PECI Bus Architecture................................................................................37

3.0 Technologies............................................................................................................... 39

3.1 Intel

Virtualization Technology (Intel

VT)............................................................. 39

3.2 Intel

Trusted Execution Technology (Intel

TXT)..................................................... 43

3.3 Intel

Hyper-Threading Technology (Intel

HT Technology)....................................... 44

3.4 Intel

Turbo Boost Technology 2.0..........................................................................45

3.5 Intel

Advanced Vector Extensions 2.0 (Intel

AVX2)................................................45

3.6 Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI).......................46

3.7 Intel

Transactional Synchronization Extensions - New Instructions (Intel

TSX-NI)..... 46

3.8 Intel

64 Architecture x2APIC................................................................................ 47

3.9 Power Aware Interrupt Routing (PAIR).................................................................... 48

3.10 Execute Disable Bit..............................................................................................48

3.11 Supervisor Mode Execution Protection (SMEP)........................................................48

June 2015

Order No.: 332376-001v1

Desktop 5th Generation Intel

Core

™

Processor Family

Datasheet – Volume 1 of 2

Processor—Contents

4.0 Power Management.................................................................................................... 49

4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................... 50

4.2 Processor Core Power Management......................................................................... 51

4.2.1 Enhanced Intel SpeedStep

Technology Key Features....................................51

4.2.2 Low-Power Idle States............................................................................... 52

4.2.3 Requesting Low-Power Idle States...............................................................53

4.2.4 Core C-State Rules....................................................................................54

4.2.5 Package C-States......................................................................................55

4.2.6 Package C-States and Display Resolutions.................................................... 58

4.3 Integrated Memory Controller (IMC) Power Management............................................60

4.3.1 Disabling Unused System Memory Outputs................................................... 60

4.3.2 DRAM Power Management and Initialization..................................................60

4.3.3 DRAM Running Average Power Limitation (RAPL) .........................................63

4.3.4 DDR Electrical Power Gating (EPG).............................................................. 63

4.4 PCI Express* Power Management............................................................................63

4.5 Direct Media Interface (DMI) Power Management...................................................... 63

4.6 Graphics Power Management..................................................................................63

4.6.1 Intel

Rapid Memory Power Management (Intel

RMPM)................................63

4.6.2 Graphics Render C-State............................................................................63

4.6.3 Intel

Graphics Dynamic Frequency............................................................ 64

5.0 Thermal Management................................................................................................. 65

5.1 Desktop Processor Thermal Profiles......................................................................... 66

5.1.1 Processor Thermal Profile........................................................................... 67

5.2 Thermal Metrology................................................................................................ 68

5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1.............................. 68

5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0.............................. 70

5.5 Thermal Specifications...........................................................................................71

5.6 Processor Temperature..........................................................................................72

5.7 Adaptive Thermal Monitor...................................................................................... 72

5.8 THERMTRIP# Signal.............................................................................................. 75

5.9 Digital Thermal Sensor.......................................................................................... 76

5.9.1 Digital Thermal Sensor Accuracy (Taccuracy)................................................76

5.10 Intel

Turbo Boost Technology Thermal Considerations............................................77

5.10.1 Intel

Turbo Boost Technology Power Control and Reporting.........................77

5.10.2 Package Power Control.............................................................................78

6.0 Signal Description....................................................................................................... 79

6.1 System Memory Interface Signals........................................................................... 79

6.2 Memory Reference and Compensation Signals.......................................................... 81

6.3 Reset and Miscellaneous Signals............................................................................. 82

6.4 PCI Express* Interface Signals............................................................................... 83

6.5 Display Interface Signals....................................................................................... 83

6.6 Direct Media Interface (DMI).................................................................................. 83

6.7 Phase Locked Loop (PLL) Signals.............................................................................84

6.8 Testability Signals.................................................................................................84

6.9 Error and Thermal Protection Signals....................................................................... 85

6.10 Power Sequencing Signals.................................................................................... 85

6.11 Processor Power Signals.......................................................................................86

6.12 Sense Signals..................................................................................................... 86

6.13 Ground and Non-Critical to Function (NCTF) Signals.................................................86

Desktop 5th Generation Intel

Core

™

Processor Family

Datasheet – Volume 1 of 2

June 2015

Order No.: 332376-001v1

Contents—Processor

6.14 Processor Internal Pull-Up / Pull-Down Terminations................................................ 87

7.0 Electrical Specifications.............................................................................................. 88

7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

Integrated Voltage Regulator..................................................................................88

Power and Ground Lands ...................................................................................... 88

Voltage Identification (VID).............................................................................. 88

Reserved or Unused Signals................................................................................... 93

Signal Groups.......................................................................................................93

Test Access Port (TAP) Connection.......................................................................... 95

DC Specifications................................................................................................. 95

Voltage and Current Specifications.......................................................................... 96

8.0 Package Specifications..............................................................................................102

8.1 LGA Package Specifications.................................................................................. 102

8.1.1 Package Mechanical Drawing.................................................................... 102

8.1.2 Processor Component Keep-Out Zone........................................................ 102

8.1.3 Package Loading Specifications................................................................. 103

8.1.4 Package Handling Guidelines.................................................................... 103

8.1.5 Package Insertion Specifications................................................................103

8.1.6 Processor Mass Specification.....................................................................104

8.1.7 Processor Materials..................................................................................104

8.1.8 Processor Markings..................................................................................104

8.1.9 Processor Land Coordinates...................................................................... 104

8.1.10 Processor Storage Specifications..............................................................106

8.2 BGA Package Specifications.................................................................................. 107

8.2.1 Package Mechanical Specifications............................................................. 107

8.2.2 Package Loading Specifications................................................................. 108

8.2.3 Package Storage Specifications................................................................. 108

9.0 Processor Ball and Signal Information...................................................................... 109

June 2015

Order No.: 332376-001v1

Desktop 5th Generation Intel

Core

™

Processor Family

Datasheet – Volume 1 of 2

FH8065801620004S-R23W Related Products

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Description	CPU - Central Processing Units CORE i7-5500U 2.4GHz 64BIT MPU FCBGA1168	CPU - Central Processing Units CORE i7-5550U 64BIT MPU FCBGA1168	CPU - Central Processing Units CORE i5-5575R 64BIT MPU FCBGA1364	CPU - Central Processing Units PENTIUM 3805U 64BIT MPU FCBGA1168	CPU - Central Processing Units CELERON 3755U 64BIT MPU FCBGA1168	CPU - Central Processing Units	CPU - Central Processing Units CORE M-5Y10c 64BIT MPU FCBGA1234	CPU - Central Processing Units CORE i5-5675C 64BIT MPU FCLGA1150	CPU - Central Processing Units CORE i5-5200U 64BIT MPU FCBGA1168
Product Category	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units
Manufacturer	Intel	Intel	Intel	Intel	Intel	Intel	Intel	Intel	Intel
RoHS	Details	Details	Details	Details	Details	Details	Details	Details	Details
Product	Mobile Processors	Mobile Processors	Desktop Processors	Mobile Processors	Mobile Processors	Desktop Processors	Mobile Processors	Desktop Processors	Mobile Processors
Package / Case	FCLGA-1151	FCLGA-1151	FCLGA-1150	FCBGA-1168	FCBGA-1168	FCLGA-1151	FCBGA-1234	FCLGA-1150	FCLGA-1150
Family	Intel Core i7	Intel Core i7	Intel Core i5	Intel Pentium	Intel Celeron	Intel Core i7	Intel Core M	Intel Core i5	Intel Core i5
Core	Intel Core i7	Intel Core i7	Intel Core i5	Intel Pentium	Intel Celeron	Intel Core i7	Intel Core M	Intel Core i5	Intel Core i5
Code Name	Broadwell	Broadwell	Broadwell	Broadwell	Broadwell	Broadwell	Broadwell	Broadwell	Broadwell
Embedded Options	Non-Embedded	Non-Embedded	Non-Embedded	Non-Embedded	Non-Embedded	Non-Embedded	Non-Embedded	Non-Embedded	Non-Embedded
Number of Cores	2 Core	2 Core	4 Core	2 Core	2 Core	4 Core	2 Core	4 Core	2 Core
TDP - Max	15 W	15 W	65 W	15 W	15 W	65 W	4.5 W	65 W	15 W
Maximum Clock Frequency	2.4 GHz	2 GHz	2.8 GHz	1.9 GHz	1.7 GHz	3.3 GHz	800 MHz	3.1 GHz	2.2 GHz
Data Bus Width	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit
Memory Size	16 GB	16 GB	32 GB	16 GB	16 GB	32 GB	16 GB	32 GB	16 GB
Memory Type	DDR3L-1333/1600, LPDDR3-1333/1600	DDR3L-1333/1600, LPDDR3-1600/1866	DDR3L-1333/1600/1866	DDR3L-1333/1600, LPDDR3-1333/1600	DDR3L-1333/1600, LPDDR3-1333/1600	DDR3L-1333/1600/1866	DDR3L/DDR3L-RS-1600, LPDDR3-1333/1600	DDR3L-1333/1600/1866	DDR3L-1333/1600, LPDDR3-1333/1600
Cache Memory	4 MB	4 MB	4 MB	2 MB	2 MB	6 MB	4 MB	4 MB	3 MB
Packaging	Tray	Tray	Tray	Tray	Tray	Tray	Tray	Tray	Tray
CPU Configuration - Max	1 Configuration	1 Configuration	1 Configuration	1 Configuration	1 Configuration	1 Configuration	1 Configuration	1 Configuration	1 Configuration
Intel Virtualization Technology - VT	With VT	With VT	With VT	With VT	With VT	With VT	With VT	With VT	With VT
Lithography - Process Technology	14 nm	14 nm	14 nm	14 nm	14 nm	14 nm	14 nm	14 nm	14 nm
Mounting Style	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT
Number of Displays Supported	3 Display	3 Display	3 Display	3 Display	3 Display	3 Display	3 Display	3 Display	3 Display
Number of Memory Channels	2 Channel	2 Channel	2 Channel	2 Channel	2 Channel	2 Channel	2 Channel	2 Channel	2 Channel
Number of PCI Express Lanes	12 Lane	12 Lane	16 Lane	12 Lane	12 Lane	16 Lane	12 Lane	16 Lane	12 Lane
Number of Threads	4 Thread	4 Thread	4 Thread	2 Thread	2 Thread	8 Thread	4 Thread	4 Thread	4 Thread
Package / Case Size	40 mm x 24 mm x 1.3 mm	40 mm x 24 mm x 1.3 mm	37.5 mm x 37.5 mm	40 mm x 24 mm x 1.3 mm	40 mm x 24 mm x 1.3 mm	37.5 mm x 37.5 mm	30 mm x 16.5 mm	37.5 mm x 37.5 mm	40 mm x 24 mm x 1.3 mm
PCIe Configurations	4x1 + 2x4	4x1 + 2x4	1x16/2x8/1x8 + 2x4	4x1 + 2x4	4x1 + 2x4	1x16/2x8/1x8 + 2x4	1x16/2x8/1x8 + 2x4	1x16/2x8/1x8 + 2x4	4x1 + 2x4
PCIe Revision	Revision 2.0	Revision 2.0	Revision 3.0	Revision 2.0	Revision 2.0	Revision 2.0	Revision 2.0	Revision 3.0	Revision 2.0
Factory Pack Quantity	1	1	1	1	1	1	1	1	1
System Bus Type	DMI2	DMI2	DMI2	DMI2	DMI2	DMI2	-	DMI2	DMI2
System Bus Speed	5 GT/s	5 GT/s	5 GT/s	5 GT/s	5 GT/s	5 GT/s	-	5 GT/s	5 GT/s
Maximum Operating Temperature	+ 105 C	+ 105 C	-	+ 105 C	+ 105 C	-	+ 95 C	-	+ 105 C
Intel Hyper-Threading Technology	With HT Technology	With HT Technology	-	Without HT Technology	Without HT Technology	With HT Technology	With HT Technology	-	With HT Technology
Moisture Sensitive	Yes	-	-	Yes	Yes	Yes	Yes	Yes	Yes
Turbo Frequency - Max	3 GHz	3 GHz	3.3 GHz	-	-	3.8 GHz	2 GHz	3.6 GHz	2.7 GHz

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