EEWORLDEEWORLDEEWORLD

Part Number

Search

310-43-123-61-105000

Description
IC u0026 Component Sockets Interconnect Socket
CategoryThe connector   
File Size385KB,1 Pages
ManufacturerMill-Max
Websitehttps://www.mill-max.com
Download Datasheet Parametric View All

310-43-123-61-105000 Online Shopping

Suppliers Part Number Price MOQ In stock  
310-43-123-61-105000 - - View Buy Now

310-43-123-61-105000 Overview

IC u0026 Component Sockets Interconnect Socket

310-43-123-61-105000 Parametric

Parameter NameAttribute value
Product CategoryIC & Component Sockets
ManufacturerMill-Max
RoHSDetails
PackagingBulk
Factory Pack Quantity1
INTERCONNECTS
SERIES 310, 311, 315 • .100” GRID SOLDER TAIL •
SINGLE ROW STRIPS
SIP sockets accept .015 - .025” diameter pins
and standard IC leads
Various solder tails available: standard length,
.015-.025
.010 * .018
.095
.110
.146
long for multi-layer boards, very low and ultra
low pro le. See Mill-Max #1001, #0134, #0501
or #1534 pins. See pages 161, 162 and 165
for details
.165
Hi-Rel, 4- nger BeCu #12 and #30 contact are
rated at 3 amps. See pages 252 and 253 for
details
.020 DIA.
.125
Insulators are high temperature thermoplastic,
FIG. 1
.015-.025
.010
*
.018
suitable for all soldering operations
ORDERING INFORMATION
Series 310...001
Standard Solder Tail
310 XX 1_ _ 41 001000
Specify number of pins
01-64
.165
.103
.110
.150
FIG. 1
Series 311...001
.020 DIA.
.170
Long Solder Tail
311 XX 1_ _ 41 001000
FIG. 2
.015-.025
.010 * .018
FIG. 2
Series 315...001
.122
Specify number of pins
O
O
O
01-64
Very Low Pro le
315 XX 1_ _ 41 001000
.096
.110
.151
FIG. 3
Series 315...003
Specify number of pins
.108
01-64
Ultra Low Pro le
315 XX 1_ _ 41 003000
.030 DIA.
FIG. 4
FIG. 3
.015-.022
.010 * .018
Specify number of pins
01-64
.071
.071
.155
.095
2011/65/EU
RoHS - 2
.095
XX=Plating Code
See Below
13
91
10
µ”
Au
For
Electrical, Mechanical
& Enviromental Data,
See page 264
.030 DIA.
SPECIFY PLATING CODE XX=
11
93
99
41
43
44
47
FIG. 4
Sleeve (Pin)
Contact (Clip)
10
µ”
Au 10
µ”
Au 200
µ”
Sn/Pb 200
µ”
Sn/Pb 200
µ”
Sn/Pb 200
µ”
Sn 200
µ”
Sn 200
µ”
Sn 200
µ”
Sn
10
µ”
Au 30
µ”
Au
30
µ”
Au 100
µ”
Sn/Pb 10
µ”
Au 30
µ”
Au 100
µ”
Sn Au Flash
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
O
41 & 91 Platings Non-Standard
PAGE 65 | INTERCONNECTS
Windows CE system platform builder simulation system black screen problem
I am using WinCE5.0 platform builder. There is no problem in compiling when building the system, but the simulator is black after attaching the device. I have read previous posts and adjusted the reso...
gdxxhe Embedded System
DC bus converter and point-of-load power module technology for next-generation distributed power architectures has been realized
Distributed power architectures have emerged to meet the challenges of power delivery in the face of large system integration, such as telecommunications racks or server rooms. Two topologies have bee...
frozenviolet Automotive Electronics
Ten things an embedded systems engineer should not do
1. Don't say "Give me a code" in the first sentence. You should think about why. When you figure it out by yourself and refer to other people's tips, you will know the difference between your thinking...
eeleader Talking about work
How do landline phones achieve full-duplex communication?
A newbie's question: How do two parallel lines of a telephone achieve full-duplex communication? As the title suggests, I have always been confused about how a landline phone can achieve full-duplex c...
dense2007 Embedded System
The new standard in CAD-CAM data conversion
The automation of electronic manufacturing is a global development trend. The design of electronic products is becoming more complex and the product life cycle is getting shorter and shorter. The appl...
程序天使 PCB Design
Exploring the inside story of Texas Instruments' acquisition of Chengxin's 8-inch fab
Chengxin 8-inch plant will be officially taken over by Texas Instruments of the United States on April 5 and become a wholly-owned subsidiary of Texas Instruments. Chengxin Semiconductor, the first 8-...
天天谈芯 Talking

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2790  1510  1213  2098  1233  57  31  25  43  26 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号