MAX1480E_CPI/MAX1490E_CPI ........................0°C to +70°C
MAX1480E_EPI/MAX1490E_EPI ......................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
New product designs recommend the use of high-performance transceiver series, including CC1120, CC1125, CC1200. Both CC1120 and CC1125 support narrowband applications, and their corresponding RF perfo...
S=time*1.7/100 This is the distance calculation statement in the ultrasonic distance measurement program. However, when I write a decimal point in my program, it reports a syntax error when compiling....
[align=center]Lesson 28: Creating Processes and Threads [attach]245477 [attach] (I) Creating Processes [/align] 1. Overview [/font] There are two main concepts about processes: First, a process is an ...
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
With the rapid development of technology, automotive intelligence is increasing at an unprecedented rate. This not only enhances vehicle functionality and comfort, but also places higher deman...[Details]
For healthcare professionals, accurate diagnosis and treatment are crucial for a clear picture of a person's health. However, healthcare professionals often rely on tests at medical facilities, cli...[Details]
Gross profit margin jumped from 13.6% in the first half of last year to 25.9%, almost doubling year-on-year.
On August 21, RoboSense released its interim performance report, in which the...[Details]
On August 22, South Korean media Nate reported on the 20th local time that Samsung Electronics is introducing Hyper Cell technology into its most advanced 2nm process technology, striving to improv...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
As AI accelerates across industries, the demand for data center infrastructure is also growing rapidly.
Keysight Technologies, in collaboration with Heavy Reading, released the "Beyo...[Details]
Permanent magnets are essential components in a wide range of household and industrial devices. They are particularly crucial in the renewable energy sector, including electric vehicle motors. Curr...[Details]
PowiGaN achieves 95% efficiency at both light and full loads, meeting critical operational and safety requirements.
DARWIN, Australia and SAN JOSE, Calif.,
August 22, 2025 – Powe...[Details]
Renesas Electronics' new ultra-low-power RA4C1 MCU features advanced security and a dedicated peripheral set, making it ideal for metering and other applications.
The new product mee...[Details]
Puttshack's Trackaball uses the Nordic nRF54L15 system-on-chip (SoC) to monitor sensors and enable Bluetooth low energy connectivity, while the nPM2100 power management integrated circuit (PMIC) ...[Details]
On August 20, it was reported that the specifications of Intel's upcoming Panther Lake mobile processor appeared on the Intel GFX CI website, which mainly focuses on Intel's open source Linux drive...[Details]
The Waveshare ESP32-P4-ETH is a compact ESP32-P4 development board with Ethernet and PoE support. It looks very similar to the Olimex ESP32-P4-DevKit, minus the pUEXT connector. However, we've also...[Details]
This article uses the Allwinner T507 quad-core automotive-grade processor as the development board. This article explains how to configure Ethernet for the T507 development board. Other boards may ...[Details]
Munich, Germany, August 19, 2025 –
Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, announced today that its AIROC™ CYW20829 Bluetooth® low e...[Details]
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