ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, UUC16
| Parameter Name | Attribute value |
| package instruction | DIE, |
| Reach Compliance Code | unknown |
| series | ACT |
| JESD-30 code | X-XUUC-N16 |
| Logic integrated circuit type | MULTIPLEXER |
| Number of functions | 4 |
| Number of entries | 2 |
| Output times | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | INVERTED |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| propagation delay (tpd) | 12 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Base Number Matches | 1 |
| 54ACT258MDA | 54AC258LM | 54AC258FM | 54ACT258FM | 54ACT258DM | |
|---|---|---|---|---|---|
| Description | ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, UUC16 | AC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | AC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16 | ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16 | ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16 |
| package instruction | DIE, | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DFP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| series | ACT | AC | AC | ACT | ACT |
| JESD-30 code | X-XUUC-N16 | S-CQCC-N20 | R-GDFP-F16 | R-GDFP-F16 | R-GDIP-T16 |
| Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| Number of functions | 4 | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 | 2 |
| Output times | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 20 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIE | QCCN | DFP | DFP | DIP |
| Package shape | UNSPECIFIED | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | CHIP CARRIER | FLATPACK | FLATPACK | IN-LINE |
| propagation delay (tpd) | 12 ns | 10.5 ns | 10.5 ns | 12 ns | 12 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 6 V | 6 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 2 V | 2 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | NO LEAD | FLAT | FLAT | THROUGH-HOLE |
| Terminal location | UPPER | QUAD | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| length | - | 8.89 mm | 9.6645 mm | 9.6645 mm | 19.43 mm |
| Load capacitance (CL) | - | 50 pF | 50 pF | 50 pF | 50 pF |
| Maximum seat height | - | 1.905 mm | 2.032 mm | 2.032 mm | 5.08 mm |
| Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| width | - | 8.89 mm | 6.604 mm | 6.604 mm | 7.62 mm |