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RTO050F5R600JTE1

Description
Thick Film Resistors - Through Hole RTO 50 F 5U6 5% TU50 e1
CategoryPassive components   
File Size108KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
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Thick Film Resistors - Through Hole RTO 50 F 5U6 5% TU50 e1

RTO050F5R600JTE1 Parametric

Parameter NameAttribute value
Product CategoryThick Film Resistors - Through Hole
ManufacturerVishay
Resistance5.6 Ohms
Power Rating50 W
Tolerance5 %
Temperature Coefficient150 PPM / C
Voltage Rating300 V
Operating Temperature Range- 55 C to + 155 C
Length10.1 mm
Termination StyleRadial
Height15 mm
Lead Spacing5.08 mm
ProductThick Film Resistors Leaded
TypePower Resistor, Thick Film Technology
Width4.5 mm
Unit Weight0.077603 oz
RTO 50
www.vishay.com
Vishay Sfernice
50 W Power Resistor, Thick Film Technology, TO-220
FEATURES
• 50 W at 25 °C heatsink mounted
• Adjusted by sand trimming
• Leaded or surface mount versions
• High power to size ratio
• Non inductive element
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
Because of the knowledge and experience in Thick Film technology, Vishay Sfernice has been able to develop a high power
resistor in a TO-220 package called RTO 50. The special design of this component allows the dissipation of 50 W when mounted
on a heatsink.
DIMENSIONS
in millimeters
RTO 50F - LEADED
4.5
10.1
Ø 3.6
1.3
RTO 50C - FOR SURFACE MOUNTING
4.5
10.1
Ø 3.6
1.3
12.5
15
8.8
12.5
15
8.8
2
3
13.7
1.6
5.08
0.3
Ø 0.8
5.08
2.5
• Only for RTO 50 version C = during surface mount soldering, the
soldering temperature profile must not cause the metal tab of this
device to exceed 220 °C.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
RTO 50
Note
(1)
E24 series
SIZE
TO-220
RESISTANCE RATED POWER
RANGE
P
25 °C
W
0.010 to 550K
(1)
50
LIMITING ELEMENT
VOLTAGE
U
L
V
500
TOLERANCE
±%
1, 2, 5, 10
TEMPERATURE
COEFFICIENT
± ppm/°C
150
CRITICAL
RESISTANCE
5K
MECHANICAL SPECIFICATIONS
Mechanical Protection
Resistive Element
Connections
Weight
Molded
Thick film
Tinned copper alloy
2.2 g max.
TECHNICAL SPECIFICATIONS
Dissipation and Associated
Thermal Resistance
and Nominal Power
Dielectric Strength
MIL STD 202 (301)
Insulation Resistance
Inductance
Onto a heatsink
50 W at +25 °C
R
TH (j - c)
: 2.6 °C/W
Free air: 2.25 W at +25 °C
2000 V
RMS
- 1 min
10 mA max.
10
6
M
0.1 μH
ENVIRONMENTAL SPECIFICATIONS
Temperature Range
Climatic Category
Sealing
Flammability
-55 °C to 155 °C
55 / 155 / 156
Sealed container, solder immersion
IEC 60695-11-5,
2 applications 30 s separated by 60 s
DIMENSIONS
Standard Package
TO-220 insulated case
Note
• Not compatible with RoHS reflow profile
Revision: 17-Oct-2018
Document Number: 50035
1
For technical questions, contact:
sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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