EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AA-01-9090-C

Description
Resistor Networks u0026 Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-B0202AA-01-9090-C Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AA-01-9090-C - - View Buy Now

WBC-B0202AA-01-9090-C Overview

Resistor Networks u0026 Arrays

WBC-B0202AA-01-9090-C Parametric

Parameter NameAttribute value
Product CategoryResistor Networks & Arrays
ManufacturerTT Electronics plc
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
EEWORLD University ---- Improving the robustness of products - a detailed exploration of TI isolation technology
Improving product robustness - Detailed exploration of TI isolation technology : https://training.eeworld.com.cn/course/3672...
wanglan123 Talking
Verilog HDL Implementation of 32×16 Inter-frame Motion Prediction Technology in HEVC
As the title says, in the HEVC standard, using Verilog language to process video, is this achievable? It does not need to be made into hardware. Can it be simulated?...
cmflyme FPGA/CPLD
Help with one-button power on/off solution for embedded devices
Hello everyone: Previously, I designed a one-touch switch using LTC2950, which is a key switch. The key press time can be controlled. It is used to manage the power supply circuit and is completely in...
shanjian13 Embedded System
I am looking for an external open-dog circuit for MSP430F169 and MAX813.
[i=s] This post was last edited by paulhyde on 2014-9-15 09:30 [/i] I am posting this for a netizen. I am looking for an external dog gate circuit for MSP430F169 and MAX813. :)...
小志 Electronics Design Contest
Call daicheng, continue yesterday's question
I now changed to NFS startup, param set linux_cmd_line "console=ttyS0 root=/dev/nfs nfsroot=192.168.1.104:/home/xjli/sbc2410/root ip=192.168.1.230:192.168.1.104:192.168.1.104:255.255.255.0:ssbc2410:et...
wonderglass Embedded System
Has anyone done F28027dspCAN communication?
[i=s] This post was last edited by minjiang on 2014-9-25 22:37 [/i] Has anyone done CAN communication with 28027dsp? Share your experience...
minjiang Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1595  235  2719  2483  2024  33  5  55  50  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号