LESHAN RADIO COMPANY, LTD.
Switching Diode
MMDL6050T1
1
CATHODE
2
ANODE
1
2
CASE 477–02, STYLE 1
SOD-323
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current
Peak Forward Surge Current
Symbol
V
R
I
F
I
FM(surge)
Value
70
200
500
Unit
Vdc
mAdc
mAdc
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-5 Board,*
T
A
= 25°C
Derate above 25°C
Thermal Resistance Junction to Ambient
Junction and Storage Temperature
**FR-4 Minimum Pad
Symbol
P
D
Max
200
1.57
635
150
Unit
mW
mW/°C
°C/W
°C
R
θJA
T
J
, T
stg
DEVICE MARKING
MMDL6050T1 = 5A
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFFCHARACTERISTICS
Reverse Breakdown Voltage (I
(BR)
= 100
µAdc)
Reverse Voltage Leakage Current
(V
R
= 50 Vdc)
Forward Voltage
(I
F
= 1.0 mAdc)
(I
F
= 100 mAdc)
Reverse Recovery Time
(I
F
= I
R
= 10 mAdc, I
R(REC)
= 1.0 mAdc) (Figure 1)
Capacitance (V
R
= 0 V)
V
(BR)
I
R
V
F
70
—
—
0.1
Vdc
µAdc
Vdc
0.55
0.85
t
rr
C
—
—
0.7
1.1
4.0
2.5
ns
pF
S3–1/3
LESHAN RADIO COMPANY, LTD.
MMDL6050T1
+10 V
820
Ω
2.0 k
0.1µF
t
r
t
p
10%
t
I
F
t
rr
t
100
µH
I
F
0.1
µF
50
Ω
OUTPUT
PULSE
GENERATOR
DUT
50
Ω
INPUT
SAMPLING
OSCILLOSCOPE
90%
i
R(REC)
= 1.0 mA
INPUT SIGNAL
V
R
I
R
OUTPUT PULSE
(I
F
= I
R
= 10 mA; MEASURED
at i
R(REC)
= 1.0 mA)
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (I
F
) of 10mA.
Notes:
2. Input pulse is adjusted so I
R(peak)
is equal to 10mA.
Notes:
3. t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
TYPICAL CHARACTERISTICS
100
10
T
A
= 150°C
I
F
, FORWARD CURRENT (mA)
T
A
= 85°C
10
I
R
, REVERSE CURRENT (µA)
T
A
= –40°C
1.0
T
A
= 125°C
T
A
= 85°C
0.1
T
A
= 25°C
1.0
T
A
= 55°C
0.01
T
A
= 25°C
0.001
0
10
20
30
40
50
0.1
0.2
0.4
0.6
0.8
1.0
1.2
V
F
, FORWARD VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
C
D
, DIODE CAPACITANCE (pF)
0.64
0.60
0.56
0.52
0.2
0.4
0.6
0.8
1.0
1.2
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
S3–2/3
LESHAN RADIO COMPANY, LTD.
MMDL6050T1
PACKAGE DIMENSIONS
SOD–323
PLASTIC PACKAGE
CASE 477–02
ISSUE A
K
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH
SOLDER PLATING.
MILLIMETERS
DIM
E
D
1
2
B
INCHES
MIN
MAX
0.063
0.071
0.045
0.053
0.031
0.039
0.010
0.016
0.006 REF
0.000
0.004
0.0035
0.0070
0.091
0.106
C
J
NOTE 3
H
A
B
C
D
E
H
J
K
MIN
MAX
1.60
1.80
1.15
1.35
0.80
1.00
0.25
0.40
0.15 REF
0.00
0.10
0.089
0.177
2.30
2.70
0.63 mm
0.025’’
STYLE 1:
PIN 1. CATHODE
2. ANODE
1.60 mm
0.063’’
2.85 mm
0.112’’
mm
inches
0.83 mm
0.033’’
(
)
SOD–323
Soldering Footprint
S3–3/3
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