RoHS Recast Compliant
M.2 2260 Flash Drive
H200-M Product Specifications
March 6, 2015
Version 1.0
Apacer Technology Inc.
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C
Tel: +886-2-2267-8000
www.apacer.com
Fax: +886-2-2267-2261
M.2 2260 Flash Drive
APM2T60H200xxxxAN-xTMx
Features:
Standard SATA Interface Compliance
–
Serial ATA Revision 3.1 compliance
–
SATA 6.0 Gbps interface
–
ATA-8 command set
Capacities
–
64, 128, 256, 512 GB
Performance*
–
Interface burst read/write:
600
MB/sec
–
Sustained read: up to 520 MB/sec
–
Sustained write: up to 380 MB/sec
Flash Management
–
Built-in hardware ECC, enabling up to 72
bit correction per 1K bytes
–
Static/dynamic wear-leveling
–
Flash bad-block management
–
S.M.A.R.T.
–
Power Failure Management
–
ATA Secure Erase
–
TRIM
NAND Flash Type:
MLC
Temperature ranges
–
Operating:
Standard: 0°C to 70°C
Extended: -40°C to +85°C
–
Storage: -40°C to 85°C
Supply voltage
–
3.3 V
±
5%
Power consumption (typical)*
–
Active mode: 2,250 mW
–
Idle mode: 250 mW
Connector type
–
75-pin SATA-based M.2 module pinout
Form factor
–
M.2 2260 form factor
–
Dimensions: 60.00x 22.00x3.88, unit: mm
Shock & Vibration***
–
Shock:1500 G
–
Vibration: 15 G
MTBF:
>1,000,000 hours
RoHS Recast compliant (complies with
2011/65/EU standard)
*Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash configurations
or platform settings. The term idle refers to the standby state of the device.
**Non-operating
1
© 2015 Apacer Technology Inc.
Rev. 1.0
M.2 2260 Flash Drive
APM2T60H200xxxxAN-xTMx
Table of Contents
1. GENERAL DESCRIPTION .................................................................................................... 3
2. PIN ASSIGNMENTS ............................................................................................................... 3
3. PRODUCT SPECIFICATIONS .............................................................................................. 6
3.1 C
APACITY
............................................................................................................................................................. 6
3.2 P
ERFORMANCE
.....................................................................................................................................................6
3.3 E
NVIRONMENTAL
S
PECIFICATIONS
.......................................................................................................................7
3.4 M
EAN
T
IME
B
ETWEEN
F
AILURES
(MTBF) ...........................................................................................................7
3.5 C
ERTIFICATION AND
C
OMPLIANCE
.......................................................................................................................7
4. FLASH MANAGEMENT ....................................................................................................... 8
4.1 E
RROR
C
ORRECTION
/D
ETECTION
.........................................................................................................................8
4.2 B
AD
B
LOCK
M
ANAGEMENT
.................................................................................................................................8
4.3 W
EAR
L
EVELING
..................................................................................................................................................8
4.4 P
OWER
F
AILURE
M
ANAGEMENT
........................................................................................................................... 8
4.5 ATA S
ECURE
E
RASE
............................................................................................................................................9
4.6 TRIM ...................................................................................................................................................................9
4.7 SATA P
OWER
M
ANAGEMENT
.............................................................................................................................. 9
5. SOFTWARE INTERFACE .................................................................................................. 10
5.1 C
OMMAND
S
ET
................................................................................................................................................... 10
5.2 S.M.A.R.T.......................................................................................................................................................... 11
6. ELECTRICAL SPECIFICATION ...................................................................................... 12
7. MECHANICAL SPECIFICATIONS .................................................................................. 13
8. PRODUCT ORDERING INFORMATION ........................................................................ 14
2
© 2015 Apacer Technology Inc.
Rev. 1.0
M.2 2260 Flash Drive
APM2T60H200xxxxAN-xTMx
1.General Description
Apacer’s H200-M is the next generation modularized Solid State Drive (SSD) with the shape of all new
M.2 form factor, aimed to be the more suitable for mobile and compact computers with standard width at
only 22.00 mm. H200-M appears in M.2 2260 mechanical dimensions and is believed to be the leading
add-in storage solution for future host computing systems.
The M.2 SSD is designed with SATA-based connector pinouts, providing full compliance with the latest
SATA Revision 3.1 interface specifications. Aside from SATA compliance, H200-M delivers exceptional
performance and power efficiency. On the other hand, the extreme thin and light form factor makes H200-
M the ideal choice for mobile computing systems, which appears to be the trend in near future.
Regarding reliability, H200-M is built with a powerful SATA controller that supports on-the-module ECC as
well as efficient wear leveling scheme. In terms of power efficiency, H200-M is compliant with SATA 6.0
Gbps interface standard so that it can operate on SATA power management modes, which greatly save
on power consumption.
2. Pin Assignments
This connector does not support hot plug capability. There are a total of 75 pins. 12 pin locations are used
for mechanical key locations; this allows such a module to plug into both Key B and Key M connectors.
Notch M
Notch B
Pin1
Pin
1
2
3
4
5
6
7
8
9
10
Type
CONFIG_3
3.3V
GND
3.3V
No connect
Not available
Not available
Not available
No connect
DAS/DSS
Description
Ground (according to M.2 configurations for SSD-SATA definition)
Supply Pin, 3.3V
Ground
Supply pin, 3.3V
No connect
No connect (used for other purposes)
No connect (used for other purposes)
No connect (used for other purposes)
No connect
Device Activity Signal/Disable Staggered Spin-up
3
© 2015 Apacer Technology Inc.
Rev. 1.0
M.2 2260 Flash Drive
APM2T60H200xxxxAN-xTMx
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
No connect
Module key
Module key
Module key
Module key
Module key
Module key
Module key
Module key
Not available
CONFIG_0
Not available
Not available
Not available
Not available
Not available
GND
Not available
Not available
Not available
Not available
Not available
GND
Not available
Not available
Not available
Not available
Not available
GND
Not available
SATA-Rx+
Not available
SATA-Rx-
Not available
GND
Not available
SATA-Tx-
No connect (used for other purposes)
No connect (used for other purposes)
Ground (according to M.2 configurations for SSD-SATA definition)
No connect (used for other purposes)
No connect (used for other purposes)
No connect (used for other purposes)
No connect (used for other purposes)
No connect (used for other purposes)
Ground
No connect (used for other purposes)
No connect
No connect (used for other purposes)
No connect
No connect (used for other purposes)
Ground
No connect (used for other purposes)
No connect
No connect (used for other purposes)
No connect
No connect
Ground
No connect (used for other purposes)
Host receiver differential signal pair
No connect (used for other purposes)
Host receiver differential signal pair
No connect (used for other purposes)
Ground
No connect (used for other purposes)
Host transmitter differential pair
4
© 2015 Apacer Technology Inc.
Rev. 1.0
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