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DS26528DK

Description
Networking Development Tools DS26528 Dev Kit
CategoryDevelopment board/suite/development tools   
File Size2MB,276 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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Networking Development Tools DS26528 Dev Kit

DS26528DK Parametric

Parameter NameAttribute value
Product CategoryNetworking Development Tools
ManufacturerMaxim
RoHSNo
PackagingBulk
Factory Pack Quantity1
DS26528
Octal T1/E1/J1 Transceiver
www.maxim-ic.com
GENERAL DESCRIPTION
The DS26528 is a single-chip 8-port framer and line
interface unit (LIU) combination for T1, E1, and J1
applications. Each channel is independently
configurable, supporting both long-haul and short-haul
lines.
FEATURES
Eight Complete T1, E1, or J1 Long-Haul/Short-
Haul Transceivers (LIU plus Framer)
Independent T1, E1, or J1 Selections for Each
Transceiver
Internal Software-Selectable Transmit- and
Receive-Side Termination for 100Ω T1 Twisted
Pair, 110Ω J1 Twisted Pair, 120Ω E1 Twisted
Pair, and 75Ω E1 Coaxial Applications
Crystal-Less Jitter Attenuator can be Selected
for Transmit or Receive Path; Jitter Attenuator
Meets ETS CTR 12/13, ITU-T G.736, G.742,
G.823, and AT&T Pub 62411
External Master Clock can be Multiple of
2.048MHz or 1.544MHz for T1/J1 or E1
Operation; This Clock is Internally Adapted for
T1 or E1 Usage in the Host Mode
Receive-Signal Level Indication from -2.5dB to
-36dB in T1 Mode and -2.5dB to -44dB in E1
Mode in Approximate 2.5dB Increments
Transmit Open- and Short-Circuit Detection
LIU LOS in Accordance with G.775, ETS 300
233, and T1.231
APPLICATIONS
Routers
Channel Service Units (CSUs)
Data Service Units (DSUs)
Muxes
Switches
Channel Banks
T1/E1 Test Equipment
FUNCTIONAL DIAGRAM
DS26528
T1/E1/J1
NETWORK
T1/J1/E1
Transceiver
x8
BACKPLANE
Transmit Synchronizer
Flexible Signaling Extraction and Insertion
Using Either the System Interface or
Microprocessor Port
Alarm Detection and Insertion
T1 Framing Formats of D4, SLC-96, and ESF
TDM
ORDERING INFORMATION
PART
DS26528G
DS26528G+
DS26528GN
DS26528GN+
TEMP RANGE
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
256 TE-CSBGA
256 TE-CSBGA
256 TE-CSBGA
256 TE-CSBGA
J1 Support
E1 G.704 and CRC-4 Multiframe
T1-to-E1 Conversion
Features Continued in Section
2.
+ Denotes lead-free/RoHS compliant device.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here:
www.maxim-ic.com/errata.
1 of 276
REV: 112907

DS26528DK Related Products

DS26528DK DS26528GA5- DS26528GA5 DS26528GNA5- DS26528N DS26528GNA4 DS26528GA3 DS26528GA4 DS26528
Description Networking Development Tools DS26528 Dev Kit Telecom Interface ICs 8-Port E1/T1/J1 Transceiver Telecom Interface ICs 8-Port E1/T1/J1 Transceiver Telecom Interface ICs 8-Port E1/T1/J1 Transceiver Telecom Interface ICs 8-Port E1/T1/J1 Transceiver Telecom Interface ICs Telecom Interface ICs Telecom Interface ICs Telecom Interface ICs 8-Port E1/T1/J1 Transceiver
Is it lead-free? - - Contains lead - Contains lead Contains lead Contains lead - Contains lead
Is it Rohs certified? - - incompatible - incompatible incompatible incompatible - incompatible
Maker - - Maxim - Maxim Maxim Maxim - Maxim
Parts packaging code - - BGA - BGA BGA BGA - BGA
package instruction - - 17 X 17 MM, 1 MM PITCH, CSBGA-256 - 17 X 17 MM, 1 MM PITCH, CSBGA-256 17 X 17 MM, 1 MM PITCH, CSBGA-256 17 X 17 MM, 1 MM PITCH, CSBGA-256 - 17 X 17 MM, 1 MM PITCH, CSBGA-256
Contacts - - 256 - 256 256 256 - 256
Reach Compliance Code - - unknown - compliant compliant not_compliant - compliant
JESD-30 code - - S-PBGA-B256 - S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 - S-PBGA-B256
length - - 17 mm - 17 mm 17 mm 17 mm - 17 mm
Number of functions - - 1 - 1 1 1 - 1
Number of terminals - - 256 - 256 256 256 - 256
Maximum operating temperature - - 70 °C - 85 °C 85 °C 70 °C - 70 °C
Package body material - - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code - - BGA - HBGA BGA BGA - HBGA
Package shape - - SQUARE - SQUARE SQUARE SQUARE - SQUARE
Package form - - GRID ARRAY - GRID ARRAY, HEAT SINK/SLUG GRID ARRAY GRID ARRAY - GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius) - - NOT SPECIFIED - 240 245 240 - 240
Certification status - - Not Qualified - Not Qualified Not Qualified Not Qualified - Not Qualified
Maximum seat height - - 1.76 mm - 1.76 mm 1.76 mm 1.76 mm - 1.76 mm
Nominal supply voltage - - 3.3 V - 3.3 V 3.3 V 3.3 V - 3.3 V
surface mount - - YES - YES YES YES - YES
Telecom integrated circuit types - - FRAMER - FRAMER FRAMER FRAMER - FRAMER
Temperature level - - COMMERCIAL - INDUSTRIAL INDUSTRIAL COMMERCIAL - COMMERCIAL
Terminal form - - BALL - BALL BALL BALL - BALL
Terminal pitch - - 1 mm - 1 mm 1 mm 1 mm - 1 mm
Terminal location - - BOTTOM - BOTTOM BOTTOM BOTTOM - BOTTOM
Maximum time at peak reflow temperature - - NOT SPECIFIED - 20 NOT SPECIFIED 20 - 20
width - - 17 mm - 17 mm 17 mm 17 mm - 17 mm

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