54FCT563ALMX datasheet, PDF - EEWORLD Datasheet

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54FCT563ALMX: DescriptionIC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC; Categorylogic logic; File Size382KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54FCT563ALMX Overview

IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC

54FCT563ALMX Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
package instruction	QCCN, LCC20,.35SQ
Reach Compliance Code	unknown
JESD-30 code	S-XQCC-N20
Load capacitance (CL)	50 pF
Logic integrated circuit type	D LATCH
MaximumI(ol)	0.032 A
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC20,.35SQ
Package shape	SQUARE
Package form	CHIP CARRIER
method of packing	TAPE AND REEL
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

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Description	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,FP,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	74FCT563DCQR	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	54FCT563DMQR	54FCT563LMQR	54FCT563FMQR
package instruction	QCCN, LCC20,.35SQ	DFP, FL20,.3	QCCN, LCC20,.35SQ	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	QCCN, LCC20,.35SQ	DFP, FL20,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-XQCC-N20	R-XDFP-F20	S-XQCC-N20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	S-XQCC-N20	R-XDFP-F20
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
MaximumI(ol)	0.032 A	0.032 A	0.032 A	0.032 A	0.048 A	0.048 A	0.032 A	0.032 A	0.032 A
Number of digits	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-55 °C	-55 °C	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	DFP	QCCN	DIP	DIP	DIP	DIP	QCCN	DFP
Encapsulate equivalent code	LCC20,.35SQ	FL20,.3	LCC20,.35SQ	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	LCC20,.35SQ	FL20,.3
Package shape	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	NO	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	FLAT	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments
Base Number Matches	1	1	1	1	1	1	1	1	-
Is it Rohs certified?	-	-	-	-	incompatible	incompatible	incompatible	incompatible	incompatible
JESD-609 code	-	-	-	-	e0	e0	e0	e0	e0
Terminal surface	-	-	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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