54FCT563AFMQR datasheet, PDF - EEWORLD Datasheet

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54FCT563AFMQR: DescriptionIC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,FP,20PIN,CERAMIC; Categorylogic logic; File Size382KB，8 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54FCT563AFMQR Overview

IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,FP,20PIN,CERAMIC

54FCT563AFMQR Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
package instruction	DFP, FL20,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F20
Load capacitance (CL)	50 pF
Logic integrated circuit type	D LATCH
MaximumI(ol)	0.032 A
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL20,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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Description	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,FP,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	74FCT563DCQR	IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC	54FCT563DMQR	54FCT563LMQR	54FCT563FMQR
package instruction	DFP, FL20,.3	QCCN, LCC20,.35SQ	QCCN, LCC20,.35SQ	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	QCCN, LCC20,.35SQ	DFP, FL20,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F20	S-XQCC-N20	S-XQCC-N20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	S-XQCC-N20	R-XDFP-F20
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH	D LATCH
MaximumI(ol)	0.032 A	0.032 A	0.032 A	0.032 A	0.048 A	0.048 A	0.032 A	0.032 A	0.032 A
Number of digits	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-55 °C	-55 °C	-55 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	QCCN	QCCN	DIP	DIP	DIP	DIP	QCCN	DFP
Encapsulate equivalent code	FL20,.3	LCC20,.35SQ	LCC20,.35SQ	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	LCC20,.35SQ	FL20,.3
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	NO	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments
Base Number Matches	1	1	1	1	1	1	1	1	-
Is it Rohs certified?	-	-	-	-	incompatible	incompatible	incompatible	incompatible	incompatible
JESD-609 code	-	-	-	-	e0	e0	e0	e0	e0
Terminal surface	-	-	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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