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TC4421EMF

Description
Development Boards u0026 Kits - PIC / DSPIC PIC32MZEF Development Board
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size270KB,19 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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TC4421EMF Overview

Development Boards u0026 Kits - PIC / DSPIC PIC32MZEF Development Board

TC4421EMF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeQFN
package instructionHVQCCN, SOLCC8,.25
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
high side driverYES
Interface integrated circuit typeBUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 codeR-PQCC-N8
JESD-609 codee3
length6 mm
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output peak current9 A
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeSOLCC8,.25
Package shapeRECTANGULAR
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
power supply4.5/18 V
Certification statusNot Qualified
Maximum seat height0.95 mm
Maximum supply voltage18 V
Minimum supply voltage4.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
Disconnect time0.08 µs
connection time0.08 µs
width5 mm
Base Number Matches1
TC4421/TC4422
9A High-Speed MOSFET Drivers
Features
• High Peak Output Current: 9A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Continuous Output Current: 2A Max
• Fast Rise and Fall Times:
- 30 ns with 4,700 pF Load
- 180 ns with 47,000 pF Load
• Short Propagation Delays: 30 ns (typ)
• Low Supply Current:
- With Logic ‘1’ Input – 200 µA (typ)
- With Logic ‘0’ Input – 55 µA (typ)
• Low Output Impedance: 1.4Ω (typ)
• Latch-Up Protected: Will Withstand 1.5A Output
Reverse Current
• Input Will Withstand Negative Inputs Up To 5V
• Pin-Compatible with the TC4420/TC4429
6A MOSFET Driver
• Space-saving 8-Pin 6x5 DFN Package
General Description
The TC4421/TC4422 are high-current buffer/drivers
capable of driving large MOSFETs and IGBTs.
These devices are essentially immune to any form of
upset, except direct overvoltage or over-dissipation.
They cannot be latched under any conditions within
their power and voltage ratings. These parts are not
subject to damage or improper operation when up to
5V of ground bounce is present on their ground termi-
nals. They can accept, without damage or logic upset,
more than 1A inductive current of either polarity being
forced back into their outputs. In addition, all terminals
are fully protected against up to 4 kV of electrostatic
discharge.
The TC4421/TC4422 inputs may be driven directly
from either TTL or CMOS (3V to 18V). In addition,
300 mV of hysteresis is built into the input, providing
noise immunity and allowing the device to be driven
from slowly rising or falling waveforms.
With both surface-mount and pin-through-hole
packages and four operating temperature range offer-
ings, the TC4421/22 family of 9A MOSFET drivers fit
into most any application where high gate/line
capacitance drive is required.
Applications
Line Drivers for Extra Heavily-Loaded Lines
Pulse Generators
Driving the Largest MOSFETs and IGBTs
Local Power ON/OFF Switch
Motor and Solenoid Driver
Package Types
(1)
8-Pin PDIP/ TC4421 TC4422
SOIC
V
DD
INPUT
NC
GND
1
8 V
DD
2
TC4421
7 OUTPUT
3
TC4422
6 OUTPUT
4
5 GND
V
DD
OUTPUT
OUTPUT
GND
V
DD
1
INPUT
2
NC
3
GND
4
8-Pin DFN
(2)
8
TC4421 TC4422
V
DD
V
DD
5-Pin TO-220
Tab is
Common
to V
DD
TC4421
TC4422
7
6
5
OUTPUT OUTPUT
OUTPUT OUTPUT
GND
GND
TC4421
TC4422
Note 1:
Duplicate pins must both be connected for proper operation.
2:
Exposed pad of the DFN package is electrically isolated.
2004 Microchip Technology Inc.
INPUT
GND
V
DD
GND
OUTPUT
DS21420D-page 1

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Description Development Boards u0026 Kits - PIC / DSPIC PIC32MZEF Development Board Bluetooth / 802.15.1 Modules USB BTv4.0 Dual Mode ft. smartBASIC Operational Amplifiers - Op Amps CMOS DUAL RRIO OP AMP FFC u0026 FPC Connectors 0.5 FPC ZIF SMT R/AU prCont40CktEmbsTpPkg Gate Drivers 9A Sngl MOSFET Drvr Gate Drivers 9A Sngl Gate Drivers 4.5V Single Mosfet Gate Drivers 9A Sngl MOSFET Drvr
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Interface integrated circuit type BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 code R-PQCC-N8 R-PSFM-T5 R-PDSO-N8 R-PDSO-G8 R-PDSO-G8 R-PQCC-N8 R-PDIP-T8 R-PDSO-N8
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3
Number of terminals 8 5 8 8 8 8 8 8
Maximum operating temperature 85 °C 70 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVQCCN TO-220 VSON SOP SOP HVQCCN DIP SON
Encapsulate equivalent code SOLCC8,.25 SIP5,.1,67TB SOLCC8,.25 SOP8,.25 SOP8,.25 SOLCC8,.25 DIP8,.3 SOLCC8,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE FLANGE MOUNT SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 NOT APPLICABLE 260 260 260 260 NOT APPLICABLE 260
power supply 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES NO YES YES YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) - annealed
Terminal form NO LEAD THROUGH-HOLE NO LEAD GULL WING GULL WING NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 1.27 mm 1.7 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location QUAD SINGLE DUAL DUAL DUAL QUAD DUAL DUAL
Maximum time at peak reflow temperature 40 NOT APPLICABLE 40 40 40 40 NOT APPLICABLE 40
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free -
Parts packaging code QFN SFM QFN SOIC SOIC QFN MO-001 -
package instruction HVQCCN, SOLCC8,.25 TO-220, SIP5,.1,67TB 6 X 8 MM, LEAD FREE, PLASTIC, MO-220, DFN-8 0.150 INCH, LEAD FREE, PLASTIC, MO-012, SOIC-8 SOP, SOP8,.25 HVQCCN, SOLCC8,.25 0.300 INCH, LEAD FREE, PLASTIC, MO-001, DIP-8 -
Contacts 8 3 8 8 8 8 8 -
high side driver YES YES NO NO NO YES NO -
length 6 mm - 6 mm 4.9 mm 4.9 mm 6 mm 9.46 mm -
Number of functions 1 1 1 1 1 1 1 -
Nominal output peak current 9 A 9 A 10 A 10 A 10 A 9 A 10 A -
Maximum seat height 0.95 mm - 0.95 mm 1.75 mm 1.75 mm 0.95 mm 4.32 mm -
Maximum supply voltage 18 V 18 V 18 V 18 V 18 V 18 V 18 V -
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V -
Disconnect time 0.08 µs 0.08 µs 0.06 µs 0.06 µs 0.06 µs 0.08 µs 0.06 µs -
connection time 0.08 µs 0.08 µs 0.06 µs 0.06 µs 0.06 µs 0.08 µs 0.06 µs -
width 5 mm - 5 mm 3.91 mm 3.91 mm 5 mm 7.62 mm -
Base Number Matches 1 1 - 1 - 1 1 -
Maker - Microchip Microchip Microchip Microchip - Microchip Microchip
Factory Lead Time - 9 weeks 4 weeks 8 weeks 8 weeks - 7 weeks 4 weeks
Humidity sensitivity level - - 3 1 3 3 - 3
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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