NX5P2924B
Logic controlled high-side power switch
Rev. 1 — 24 February 2014
Product data sheet
1. General description
The NX5P2924B is a high-side load switch which features a low ON resistance N-channel
MOSFET with controlled slew rate that supports 2.5 A of continuous current. Designed for
operation from 0.8 V to 5.5 V, it is used in power domain isolation applications to reduce
power dissipation and extend battery life. The enable logic includes integrated logic level
translation making the device compatible with lower voltage processors and controllers.
The NX5P2924B is ideal for portable, battery operated applications due to low ground
current.
2. Features and benefits
Wide supply voltage range from 0.8 V to 5.5 V
Very low ON resistance:
14 m (typical) at a supply voltage of 1.2 V
14 m (typical) at a supply voltage of 1.8 V
High noise immunity
High current handling capability (2.5 A continuous current)
Turn-on slew rate limiting
ESD protection:
HBM JESD22-A114F Class 3A exceeds 4000 V
CDM AEC-Q100-011 revision B exceeds 1000 V
Specified from
40 C
to +85
C
3. Applications
Cell phone
Digital cameras and audio devices
Portable and battery-powered equipment
NXP Semiconductors
NX5P2924B
Logic controlled high-side power switch
4. Ordering information
Table 1.
Ordering information
Package
Temperature range
NX5P2924BUK
40 C
to +85
C
Name
WLCSP6
Description
wafer level chip-scale package; 6 bumps;
0.87 x 1.37 x 0.5 mm
Version
NX5P2924B
Type number
5. Marking
Table 2.
Marking codes
Marking code
4B
Type number
NX5P2924BUK
6. Functional diagram
EN
VIN
001aao342
VOUT
Fig 1.
Logic symbol
Fig 2.
Logic diagram
NX5P2924B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 24 February 2014
2 of 18
NXP Semiconductors
NX5P2924B
Logic controlled high-side power switch
7. Pinning information
7.1 Pinning
Fig 3.
Pin configuration for WLCSP6
Fig 4.
Ball mapping for WLCSP6
7.2 Pin description
Table 3.
Symbol
VIN
GND
EN
VOUT
Pin description
Pin
A2, B2
C1
C2
A1, B1
Description
input voltage
ground (0 V)
enable input (active HIGH)
output voltage
8. Functional description
Table 4.
Input EN
L
H
[1]
H = HIGH voltage level; L = LOW voltage level.
Function table
[1]
Switch
switch OFF
switch ON
NX5P2924B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 24 February 2014
3 of 18
NXP Semiconductors
NX5P2924B
Logic controlled high-side power switch
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
I
V
SW
I
IK
I
SK
Parameter
input voltage
switch voltage
input clamping current
switch clamping current
Conditions
input EN
input VIN
output VOUT
input EN: V
I(EN)
<
0.5
V
input VIN: V
I(VIN)
<
0.5
V
output VOUT: V
O(VOUT)
<
0.5
V
output VOUT: V
O(VOUT)
> V
I(VIN)
0.5
V
I
SW
T
j(max)
T
stg
P
tot
[1]
[2]
[3]
[1]
[2]
[2]
Min
0.5
0.5
0.5
50
50
50
-
-
40
65
[3]
Max
+6.0
+6.0
V
I(VIN)
-
-
-
50
2500
+125
+150
470
Unit
V
V
V
mA
mA
mA
mA
mA
C
C
mW
switch current
maximum junction
temperature
storage temperature
total power dissipation
V
SW
>
0.5
V
-
The minimum input voltage rating may be exceeded if the input current rating is observed.
The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.
The (absolute) maximum power dissipation depends on the junction temperature T
j
. Higher power dissipation is allowed with lower
ambient temperatures. The conditions to determine the specified values are T
amb
= 85 °C and the use of a two layer PCB.
10. Recommended operating conditions
Table 6.
V
I
T
amb
Recommended operating conditions
Conditions
Min
0.8
40
Max
5.5
+85
Unit
V
C
input voltage
ambient temperature
Symbol Parameter
NX5P2924B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 24 February 2014
4 of 18
NXP Semiconductors
NX5P2924B
Logic controlled high-side power switch
11. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
[1]
Thermal characteristics
Parameter
thermal resistance from junction to ambient
Conditions
[1]
Typ
139
Unit
K/W
R
th(j-a)
is dependent upon board layout. To minimize R
th(j-a)
, ensure that all pins have a solid connection to larger copper layer areas. In
multi-layer PCBs, the second layer should be used to create a large heat spreader area below the device. Avoid using solder-stop
varnish under the device.
12. Static characteristics
Table 8.
Static characteristics
V
I(VIN)
= 1.0 V to 5.5 V, unless otherwise specified; Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
V
IH
HIGH-level input
voltage
Conditions
EN input; V
I(VIN)
= 0.8 V
EN input; V
I(VIN)
= 1.0 V to 1.2 V
EN input; V
I(VIN)
= 1.2 V to 2.5 V
EN input; V
I(VIN)
= 2.5 V to 5.5 V
V
IL
LOW-level input
voltage
EN input; V
I(VIN)
= 0.8 V
EN input; V
I(VIN)
= 1.0 V to 1.2 V
EN input; V
I(VIN)
= 1.2 V to 2.5 V
EN input; V
I(VIN)
= 2.5 V to 5.5 V
I
I
R
dch
input leakage
current
discharge
resistance
EN input; V
I(EN)
= 0.9 V to 5.5 V
VOUT output; V
I(VIN)
= 0.8 V
VOUT output; V
I(VIN)
= 1.0 V
VOUT output; V
I(VIN)
= 1.2 V
VOUT output; V
I(VIN)
= 1.8 V
VOUT output; V
I(VIN)
= 3.3 V
VOUT output; V
I(VIN)
= 5.5 V
-
0.9
1.2
1.2
-
-
-
-
-
-
-
-
-
-
-
T
amb
= 25
C
Min Typ
[1]
Max
0.7
-
-
-
0.25
-
-
-
-
4.00
1.40
1.30
1.27
1.25
1.25
-
-
-
-
-
0.3
0.4
0.6
-
-
-
-
1.50
1.50
1.50
T
amb
=
40 C
to +85
C
Min
-
0.9
1.2
1.2
-
-
-
-
-
-
-
-
-
-
-
Max
-
-
-
-
-
0.3
0.4
0.6
0.1
-
-
-
-
-
-
V
V
V
V
V
V
V
V
A
k
k
k
k
k
k
Unit
NX5P2924B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 24 February 2014
5 of 18
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