MPC8572ECVTAVNE datasheet, PDF

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MPC8572ECVTAVNE: DescriptionMicroprocessors - MPU R211 Enc NoPb 1500 Ext; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，138 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MPC8572ECVTAVNE Overview

Microprocessors - MPU R211 Enc NoPb 1500 Ext

MPC8572ECVTAVNE Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	conform to
Maker	NXP
package instruction	BGA, BGA1023,32X32,40
Reach Compliance Code	not_compliant
Address bus width	16
bit size	32
boundary scan	YES
External data bus width	64
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B1023
JESD-609 code	e2
length	33 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	1023
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA1023,32X32,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	245
power supply	1.1,1.8/3.3 V
Certification status	Not Qualified
Maximum seat height	3.38 mm
speed	1500 MHz
Maximum supply voltage	1.155 V
Minimum supply voltage	1.045 V
Nominal supply voltage	1.1 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN COPPER/TIN SILVER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	33 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Freescale Semiconductor

Technical Data

Document Number: MPC8572EEC

Rev. 6, 06/2014

MPC8572E PowerQUICC III

Integrated Processor

Hardware Specifications

Overview

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Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . 10

Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15

Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 18

DDR2 and DDR3 SDRAM Controller . . . . . . . . . . . 19

DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Ethernet: Enhanced Three-Speed Ethernet (eTSEC) 28

Ethernet Management Interface

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 50

Local Bus Controller (eLBC) . . . . . . . . . . . . . . . . . . 53

Programmable Interrupt Controller . . . . . . . . . . . . . 65

JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 71

PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Serial RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 99

Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

System Design Information . . . . . . . . . . . . . . . . . . 123

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 134

Document Revision History . . . . . . . . . . . . . . . . . . 136

This section provides a high-level overview of the features

of the MPC8572E processor.

Figure 1

shows the major

functional units within the MPC8572E.

1.1

Key Features

The following list provides an overview of the MPC8572E

feature set:

• Two high-performance, 32-bit, Book E-enhanced

cores that implement the Power Architecture

technology:

— Each core is identical to the core within the

MPC8572E processor.

— 32-Kbyte L1 instruction cache and 32-Kbyte L1

data cache with parity protection. Caches can be

locked entirely or on a per-line basis, with

separate locking for instructions and data.

— Signal-processing engine (SPE) APU (auxiliary

processing unit). Provides an extensive

instruction set for vector (64-bit) integer and

fractional operations. These instructions use both

Freescale reserves the right to change the detail specifications as may be required

to permit improvements in the design of its products.

2008-2011,

Overview

•

the upper and lower words of the 64-bit GPRs as they are defined by the SPE APU.

— Embedded vector and scalar single-precision floating-point APUs. Provide an instruction set

for single-precision (32-bit) floating-point instructions.

— Double-precision floating-point APU. Provides an instruction set for double-precision (64-bit)

floating-point instructions that use the 64-bit GPRs.

— 36-bit real addressing

— Memory management unit (MMU). Especially designed for embedded applications. Supports

4-Kbyte to 4-Gbyte page sizes.

— Enhanced hardware and software debug support

— Performance monitor facility that is similar to, but separate from, the MPC8572E performance

monitor

The e500 defines features that are not implemented on this device. It also generally defines some

features that this device implements more specifically. An understanding of these differences can

be critical to ensure proper operation.

1 Mbyte L2 cache/SRAM

— Shared by both cores.

— Flexible configuration and individually configurable per core.

— Full ECC support on 64-bit boundary in both cache and SRAM modes

— Cache mode supports instruction caching, data caching, or both.

— External masters can force data to be allocated into the cache through programmed memory

ranges or special transaction types (stashing).

– 1, 2, or 4 ways can be configured for stashing only.

— Eight-way set-associative cache organization (32-byte cache lines)

— Supports locking entire cache or selected lines. Individual line locks are set and cleared through

Book E instructions or by externally mastered transactions.

— Global locking and Flash clearing done through writes to L2 configuration registers

— Instruction and data locks can be Flash cleared separately.

— Per-way allocation of cache region to a given processor.

— SRAM features include the following:

– 1, 2, 4, or 8 ways can be configured as SRAM.

– I/O devices access SRAM regions by marking transactions as snoopable (global).

– Regions can reside at any aligned location in the memory map.

– Byte-accessible ECC is protected using read-modify-write transaction accesses for

smaller-than-cache-line accesses.

e500 coherency module (ECM) manages core and intrasystem transactions

Address translation and mapping unit (ATMU)

— Twelve local access windows define mapping within local 36-bit address space.

— Inbound and outbound ATMUs map to larger external address spaces.

– Three inbound windows plus a configuration window on PCI Express

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6

Freescale Semiconductor

MPC8572ECVTAVNE Related Products

	MPC8572ECVTAVNE	MPC8572LVTAVND
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