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STRUCTURE
PRODUCT NAME
TYPE
FEATURES
Silicon Monolithic Integrated Circuit
Multi-Channel Power IC
ＢＤ８１６５ＭＵＶ
・Built-in
5-channel outputs for TFT-LCD Display
・Built-in
VCOM AMP
●
ABSOLUTE MAXIMUM RATINGS (Ta=25℃)
PARAMETER
Supply Voltage
1
Supply Voltage
2
Supply Voltage
3
SW1 Voltage
SYMBOL
VCC,PVCC2,3
LDVCC1
HVCC
VSW1
LIMITS
15
7
20
22
UNIT
V
V
V
V
Tjmax
150
℃
Junction Temperature
Pd
4826*1
mW
Power Dissipation
Operating Temperature Range
Topr
-40½105
℃
Storage Temperature Range
Tstg
-55½150
℃
*1
Decreased in done 38.6mW/℃ for operating above Ta≧25℃,
mounted on 70×70×1.6mm 4 layer Glass-epoxy PCB.(back foil 70.0mm×70.0mm)
●
OPERATING CONDITIONS
(Ta=-40℃½+105℃)
Parameter
Supply Voltage
1
Supply Voltage
2
Supply Voltage
3
SW1 Voltage
Symbol
VCC,PVCC2,3
LDVCC1
HVCC
VSW1
MIN
4.2
-
6
-
MAX
14
5.5
18
18
Unit
V
V
V
V
Status of this document
The Japanese version of this document is the formal specification.
A customer may use this translation version only for a reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
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●
ELECTRICAL CHARACTERISTICS
（
Unless otherwise specified
, Ta=25℃,VCC=12V,HVCC=15V）
Limit
Parameter
Symbol
Unit
Condition
MIN
TYP
MAX
【DC/DC
BLOCK】
Feed Back Voltage 1
VFB1
1.230
1.250
1.270
V
Feed Back Voltage 2
VFB2
1.225
1.250
1.275
V
Feed Back Voltage 3
VFB3
0.882
0.900
0.918
V
FB Input Bias Current
IFB
-1.2
0.1
1.2
uA
COMP Source Current
ICSO
15
40
65
uA
COMP Sink Current
ICSI
-65
-40
-15
uA
MAX Duty
MDT
80
90
-
%
【LDO1,LDO3 BLOCK】
LDO Feed Back Voltage
LDFB
1.231
1.25
1.269
V
Drop Voltage 1
DPLD1
-
0.3
1.0
V
LDFB1=1.0V, Io=500mA
Drop Voltage H
-
0.4
0.9
V
DPLDH
LDFB_H=1.0V, Io=100mA
【Charge Pump BLOCK】
Feed Back Voltage
CPFB
1.225
1.25
1.275
V
Drop Voltage 1
DPCPP
0.14
0.35
0.78
V
Io=100mA
Drop Voltage 2
DPCPN
0.28
0.7
1.55
V
Io=100mA
【Operational Amplifier BLOCK】
Input Offset Voltage
VOFF
-15
0
15
mV
VCOM Output Current
ICOM
60
150
-
mA
Load Regulation
⊿Vo
-15
1
15
mV Io=+1mA½-1mA
Maximum Output Voltage
VoH
HVCC-1.0 HVCC-0.8
-
V
Io=-1mA, IN=HVCC-0.8V
Minimum Output Voltage
VoL
-
0.1
0.16
V
Io=1mA, IN=0V
【WHOLE】
Reference Voltage
VREF
2.46
2.53
2.60
V
Oscillation Frequency
FSW
550
650
750
kHz
UVLO Voltage
UVLO
0.88
-
1.17
V
Average Supply Current (
VCC,PVCC2,3)
ICC
-
5
11
mA No Switching
Average Supply Current (HVCC)
HICC
-
1.0
4
mA No Switching
○This product is not designed for protection against radioactive rays.
●
PHYSICAL DIMENSION・MARKING
(VQFN048V7070)
BD8165
LOT NO
Marking
(UNIT:mm)
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●
BLOCK DIAGRAM
COMP1
COMP2
BOOT2
PG2
STEP DOWN
降圧
SW2
CTL2
POSITIVE
正チャージ
REG
LDFB1
LDCTL1
LDPG1
LDVCC1
VCP2
LDO1
GND
OSC
CHARGE PUMP
ポンプ
負チャージ
NEGATIVE
C2
LDO 1
HVCC
VCP1
REG
CHARGE PUMP
ポンプ
CONVERTER
コンバータ
VREF
PROTECT
STEP UP
昇圧
CONVERTER
コンバータ
PGND1
CPFB1
CPPG
PG1
CTL3
SW3
BOOT3
PGATE
PVCC2
PVCC2
PG3
VREF
UVLO
DTC1
STEP DOWN
降圧コンバータ
CONVERTER
DTC2
DTC3
DTC3
CTL1
CTL1
SW1
SW1
VCC
SCP
FB2
FB2
FB3
FB3
PVCC3
FB1
C1
CPFB2
LDO 3
HVCC
COMP3
LDFB_H
LDD_H
IN-
VCOM
IN+
●
PIN No. & FUNCTION TABLE
PIN
NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
PIN NAME
BOOT3
PG3
DTC3
COMP3
FB3
PVCC3
LDFB_H
LDO_H
IN+
IN-
VCOM
CPFB2
C2
VCP2
HVCC
VCP1
C1
CPPG
CPFB1
PGND1
PG1
SW1
PGATE
DTC1
FUNCTION
Boot strap Terminal 3
Power Good Output 3
DUTY Control Input 3
Error Amp Output 3
Feed Back Input 3
Power Supply Input
LDO Feed Back Input H
LDO Output H
COM Input +
COM Input -
COM Output
Charge Pump Feed Back Input 2
Charge Pump Input2
Charge Pump LDO Output 2
Power Supply Input
Charge Pump LDO Output 1
Charge Pump Output 1
CP Power Good Output
Charge Pump Feed Back Input 1
Ground
Power Good Output 1
Power Switch Output 1
Pch Gate Drive Output
DUTY Control Input 1
PIN
NO.
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
PIN NAME
COMP1
FB1
CTL1
SCP
VCC
UVLO
VREF
FB2
COMP2
DTC2
PVCC2
BOOT2
PG2
SW2
CTL2
REG
LDFB1
LDCTL1
LDPG1
LDO1
LDVCC1
GND
CTL3
SW3
FUNCTION
Error Amp Output 1
Feed Back Input 1
Control Input 1
Short Protection Current Output
Power Supply Input
UVLO Input
Reference Voltage Output
Feed Back Input 2
Error Amp Output 2
DUTY Control Input 2
Power Supply Input
Boot strap Terminal 2
Power Good Output 2
Power Switch Output 2
Control Input 2
Boot strap Regulator Output
LDO Feed Back Input 1
LDO1 Control Input
LDO1 Power Good Output
LDO Output 1
Power Supply Input
Ground
Control Input 3
Power Switch Output 3
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Operation
Notes
1. Absolute maximum range
This product are produced with strict quality control, but might be destroyed in using beyond absolute maximum ratings. Open IC
destroyed a failure mode cannot be defined (like Short mode, or Open mode).
Therefore physical security countermeasure, like fuse, is to be given when a specified mode to be beyond absolute maximum ratings
is considered.
2. Ground potential
GND terminal should be a lowest voltage potential every state.
Please make sure all pins which is over ground even if include transient feature.
3. Setting of heat
Use a setting of heat that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions..
4 . Short Circuit between Terminal and Soldering
Don’t short-circuit between Output pin and the power supply pin, Output pin and GND pin, or the power supply pin and GND pin.When soldering
the IC on circuit board, please be unusually cautious about the orientation and the
position of the IC. When the orientation is mistaken the IC may be destroyed.
5 . Electromagnetic Field
Mal-function may happen when the device is used in the strong electromagnetic field.
6. Ground wiring patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a
single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused
by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring patterns
of any external components.
7. This IC is a monolithic IC which has P+ isolation in the P substrate and between the various pins.
A P-N junction is formed from this P layer and the N layer of each pin.
For example, when a resistor and a transistor is connected to a pin.
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits as well as operation faults and physical damage. Accordingly, you must not use methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin.
resister
（PinＡ）
（PinＢ）
Ｃ
Ｅ
（PinＢ）
½
½
Ｂ
Ｃ
½
½
ＧＮＤ
Ｂ
Ｅ
ＧＮＤ
parasitic diode or transistor
SIMPLIFIED STRUCTURE OF
BI-POLAR IC
Ｎ
Ｐ
＋
Ｐ
＋
Ｐ
＋
Ｎ
Ｎ
parasitic diode
Ｎ
Ｐsubstrate
Ｎ
（PinＡ）
Ｐ
Ｐ
＋
near-by other element
Parasitic diode
ＧＮＤ
parasitic diode or transistor
ＧＮＤ
8. Over current protection circuit
The over-current protection circuits are built in at output, according to their respective current outputs and prevent the IC
from being damaged when the load is short-circuited or over-current. But, these protection circuits are effective for preventing
destruction by unexpected accident. When it’s in continuous protection circuit moving period don’t use please. And for ability,
because this chip has minus characteristic, be careful for heat plan.
9. Built-in thermal circuit
A temperature control circuit is built in the IC to prevent the damage due to overheat.
Therefore, all the outputs are turned off when the thermal circuit works and are turned on when the temperature goes down to
the specified level.
10.Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance
subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC
during assembly steps as an antistatic measure, and use similar caution when transporting or storing the
IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture
during the inspection process.
11.Discontiguous mode
The DC/DC converters of this IC are designed for being used in contiguous current mode, normally. The special consideration on adjusting
the inductance or the resistive output load to avoid the discontiguous current mode should be properly done.
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Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
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The Products specified in this document are intended to be used with general-use electronic
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While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
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