K8A2815ET(B)B
NOR FLASH MEMORY
128Mb B-die SLC NOR Specification
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AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
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ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
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2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
1
Revision 1.2
September, 2006
K8A2815ET(B)B
NOR FLASH MEMORY
128M Bit (8M x16) Synchronous Burst , Multi Bank NOR Flash Memory
FEATURES
•
Single Voltage, 1.7V to 1.95V for Read and Write operations
•
Organization
- 8,386,108 x 16 bit ( Word Mode Only)
•
Read While Program/Erase Operation
•
Multiple Bank Architecture
- 16 Banks (8Mb Partition)
•
OTP Block : Extra 256Byte block
•
Read Access Time (@ C
L
=30pF)
- Asynchronous Random Access Time :
90ns (54MHz) / 80ns (66MHz)
- Synchronous Random Access Time :
88.5ns (54MHz) / 70ns (66MHz)
- Burst Access Time :
14.5ns (54MHz) / 11ns (66MHz)
•
Burst Length :
- Continuous Linear Burst
- Linear Burst : 8-word & 16-word with No-wrap & Wrap
•
Block Architecture
- Eight 4Kword blocks and two hundreds fifty-five 32Kword
blocks
- Bank 0 contains eight 4 Kword blocks and fifteen 32Kword
blocks
- Bank 1 ~ Bank 15 contain two hundred forty 32Kword blocks
•
Reduce program time using the V
PP
•
Support Single word accelerate program
•
Power Consumption (Typical value, C
L
=30pF)
- Burst Access Current : 30mA
- Program/Erase Current : 15mA
- Read While Program/Erase Current : 40mA
- Standby Mode/Auto Sleep Mode : 25uA
•
Block Protection/Unprotection
- Using the software command sequence
- Last two boot blocks are protected by WP=V
IL
- All blocks are protected by V
PP
=V
IL
•
Handshaking Feature
- Provides host system with minimum latency by monitoring
RDY
•
Erase Suspend/Resume
•
Program Suspend/Resume
•
Unlock Bypass Program/Erase
•
Hardware Reset (RESET)
•
Data Polling and Toggle Bits
- Provides a software method of detecting the status of program
or erase completion
•
Endurance
100K Program/Erase Cycles Minimum
•
Data Retention : 10 years
•
Extended Temperature : -25°C ~ 85°C
•
Support Common Flash Memory Interface
•
Low Vcc Write Inhibit
•
Package : TBD
GENERAL DESCRIPTION
The K8A2815E featuring single 1.8V power supply is a 128Mbit
Synchronous Burst Multi Bank Flash Memory organized as
16Mx16. The memory architecture of the device is designed to
divide its memory arrays into 263 blocks with independent hard-
ware protection. This block architecture provides highly flexible
erase and program capability. The K8A2815E NOR Flash con-
sists of sixteen banks. This device is capable of reading data
from one bank while programming or erasing in the other bank.
Regarding read access time, the K8A2815E provides an 14.5ns
burst access time and an 88.5ns initial access time at 54MHz.
At 66MHz, the K8A2815E provides an 11ns burst access time
and 70ns initial access time. The device performs a program
operation in units of 16 bits (Word) and an erase operation in
units of a block. Single or multiple blocks can be erased. The
block erase operation is completed within typically 0.7 sec. The
device requires 15mA as program/erase current in the
extended temperature ranges.
The K8A2815E NOR Flash Memory is created by using Sam-
sung's advanced CMOS process technology.
PIN DESCRIPTION
Pin Name
A0 - A22
DQ0 - DQ15
CE
OE
RESET
V
PP
WE
WP
CLK
RDY
AVD
Vcc
V
SS
Pin Function
Address Inputs
Data input/output
Chip Enable
Output Enable
Hardware Reset Pin
Accelerates Programming
Write Enable
Hardware Write Protection Input
Clock
Ready Output
Address Valid Input
Power Supply
Ground
SAMSUNG ELECTRONICS CO., LTD.
reserves the right to change products and specifications without notice.
3
Revision 1.2
September, 2006