MIH Series
5mm X 7mm Ceramic SMD
• Ceramic SMD Package
• 5.0, 3.3, 2.5, and 1.8 Volt
• HCMOS/TTL Compatible Output
• Stability to ±10ppm
• Tape and Reel Packaging
Electrical Specifications
Frequency Range
5V and 3.3V
2.5V
1.8V
Frequency Stability (Inclusive of Temperature, Load, Voltage and Aging)
Operating Temperature Range
Storage Temperature Range
Supply Voltage (Vdd)
±5%
Supply Current
Vdd = 5V
Vdd = 3.3V
Vdd = 2.5V
Vdd = 1.8V
Output Voltage HCMOS
Logic 0
Logic 1
Duty Cycle
50% of waveform
Load Drive Capability
5V(less than 50MHz)
5V(greater than 50MHz)
3.3V(less than 50MHz)
3.3V(greater than 50MHz)
2.5V
1.8V
Rise / Fall Time
Start Up Time
Jitter
RMS
*Please contact your MMD representative for up-to-date typical jitter information
1.500MHz to 156.250MHz
1.500MHz to 70.000MHz
1.544MHz to 40.000MHz
±100ppm to ±10ppm
0°C - 70°C to -40°C - 85°C
-55°C - 125°C
5.0Vdc, 3.3Vdc, 2.5Vdc, or 1.8Vdc
70mA max.
40mA max.
35mA max.
15mA max.
10% Vdd max.
90% Vdd min.
40%/60% max. or 45%/55% max.
10 TTL Gates or 50pF
10 TTL Gates or 15pF
10 TTL Gates or 30pF
10 TTL Gates or 15pF
10 TTL Gates or 15pF
10 TTL Gates or 15pF
4nSec max.
10mSec max.
10pSec max.*
www.mmdcomp.com
phone: 949-709-5075 / fax: 949-709-3536
Specifications subject to change without notice
OS11
Revision: 4/20/04 I
Part Numbering Guide
MI
5X7 Ceramic SMD
H
Frequency Stability
100 = ±100ppm
050 = ±50ppm
025 = ±25ppm
020 = ±20ppm
015 = ±15ppm
010 = ±10ppm**
Operating Temperature
Blank = 0°C to 70°C
27 = -20°C to 70°C**
48 = -40°C to 85°C**
Output
H = HCMOS
H
Frequency
Pin 1 Connection
H = Tri-state
T&R
Supply Voltage
Blank = 5 Volt
3 = 3.3 Volt
2 = 2.5 Volt***
1 = 1.8 Volt****
Packaging*
Blank = Bulk
T&R = Tape and Reel
Symmetry
Blank = 40%/60%
A = 45%/55%
*See page VA4 for Tape Specifications
**Not available in 2.5V and 1.8V
*** Available to 70MHz only
**** Available to 40MHz only
Mechanical Dimensions
2.6 ±0.15
.102 ±.006
4
1
3.68 ±0.15
.145 ±.006
2.88
.113
4
5.0 ±0.2
.197 ±.008
7.0 ±0.2
.278 ±.008
3
1.7 max
.067 max
5.08 ±0.15
.200 ±.006
1.2 ±0.2
.047 ±.008
2
1.4 ±0.1
.055 ±.004
Markings
1
3
2
Pad Connections
Tri-state Operation
Logic 1 or NC = Oscillation
Logic 0 or GND = High Impedance
Suggested Solder Pad Layout
Pin 2: Ground / Case
Pin 3: Output
P i n 4 : S u p p l y Vo l ta g e
2.0
.079
2.2
.087
Environmental / Mechanical
Markings
Shock: MIL-STD-883, Method 2002, Condition B
Solderability: MIL-STD-883, Method 2003
Solvent Resistance: MIL-STD-202, Method 215
Vibration: MIL-STD-883, Method 2007, Condition A
Gross Leak Test: MIL-STD-883, Method 1014, Condition C
Fine Leak Test: MIL-STD-883, Method 1014, Condition A2
Line 1: MMD “Date Code”
Line 2: Frequency
www.mmdcomp.com
phone: 949-709-5075 / fax: 949-709-3536
OS11
Specifications subject to change without notice
Revision: 4/20/04 I
1.81
.071
P i n 1 : Tr i - Sta t e
Solder Pad
(X4)
MCU
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