ZAMC4100GA2R datasheet, PDF - EEWORLD Datasheet

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ZAMC4100GA2R: DescriptionARM Microcontrollers - MCU Acuator and Motor controller; Categorysemiconductor The embedded processor and controller; File Size3MB，155 Pages; ManufacturerIDT (Integrated Device Technology, Inc.); Websitehttp://www.idt.com/

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ZAMC4100GA2R Overview

ARM Microcontrollers - MCU Acuator and Motor controller

ZAMC4100GA2R Parametric

Parameter Name	Attribute value
Product Category	ARM Microcontrollers - MCU
Manufacturer	IDT (Integrated Device Technology, Inc.)
RoHS	Details
Mounting Style	SMD/SMT
Package / Case	QFN-64
Core	ARM Cortex M0
Data Bus Width	32 bit
Program Memory Size	32 kB
Data RAM Size	2 kB
ADC Resolution	10 bit
Operating Supply Voltage	6 V to 18 V
Maximum Operating Temperature	+ 85 C
Packaging	Reel
DAC Resolution	6 bit
Data RAM Type	SRAM
Minimum Operating Temperature	- 40 C
Moisture Sensitive	Yes
Number of Timers/Counters	1 Timer
Processor Series	ZAMC4100
Product	MCU
Program Memory Type	Flash
Factory Pack Quantity	2800
Supply Voltage - Max	18 V
Supply Voltage - Min	6 V
Watchdog Timers	Watchdog Timer
Unit Weight	0.007277 oz

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Actuator and Motor Controller

ZAMC4100

Datasheet

Brief Description

The

ZAMC4100 Actuator and Motor Controller

is an

integrated, single package solution that features a

high-performance ARM Cortex™-M0* microcon-

troller (MCU), a 10-bit ADC, four general purpose

analog inputs, four half-bridge drivers, four high-side

switches, one output buffer for electrochromatic (EC)

mirror control with programmable output voltage (6

bit DAC), current source for external diode-based

temperature measurements, switchable voltage

source for external resistive sensors, and LIN (Local

Interconnect Network) bus interface.

This single-package solution with its rich diagnostic

features, optimized thermal performance, and LIN

bus interface, is well suited for automotive applica-

tions, such as high-end automotive exterior mirror

controllers, where small form-factor circuit board

designs and light wiring harnesses are required.

Benefits

•

Multi-chip-module concept with high functional

integrity

Low number of external components

Small footprint plastic QFN package with

exposed pad allowing better thermal

management

AEC-Q100 qualified product, optimized for

automotive environment

Smart power management concept for achieving

low sleep current consumption (<80µA)

Available Support

•

Data sheet and application notes

Evaluation and Application Kits

Software Development Kit (SDK)

Features

•

Physical Characteristics

•

Two main operation modes

NORMAL Mode with all functionality

available

SLEEP Mode with very low current

consumption (less than 80µA)

10-bit ADC for measuring various parameters

4 general purpose ADC inputs configurable for

absolute or ratiometric mode

4 low RDS (ON) half-bridge drivers and 4 low

RDS (ON) high-side switches

Analog EC mirror output controlled via 6-bit DAC

All outputs short circuit protected

Hardware 8-bit PWM control for half-bridge and

high-side drivers

Over-temperature protection with automatic

driver shut-down

Over-voltage and under-voltage detection with

automatic driver shut-down

Overload and open/short diagnostic for all

outputs

Embedded LIN 2.2/SAE J2602-2 transceiver

Embedded ARM Cortex™-M0 microcontroller

8 user-configurable GPIO pins

Ambient operation temperature: -40°C to +85°C

Wide power supply voltage range: 6V to 18V

Plastic QFN64 9x9mm package; exposed die pad

ZAMC4100

PQFN64 TOP VIEW

VDDE1

n.c.

VSS4

HB3

EC_RES

EC_M

VSS5

HS4

CAP_CP

LIN

VSS_LIN

VSS_IO

STO

VSSD2

TEST

TRSTN

HB2a

VSS3

HB1b

VDDE2

VDDE3

HS1a

VDDE4

VDDE5

HS2

HS1b

VDDE6

VDDE7

HB1a

HS3

VSS2

HB2b

EXPOSED PAD

(pin 65)

TCK

TMS

TDO

TDI

GPIO0

GPIO1

GPIO2

GPIO3

GPIO4

GPIO5

GPIO6

GPIO7

n.c.

CAP_MCU

CAP_3V3

CAP_1V8

* Note:

The ARM® and Cortex™ trademarks are owned by ARM, Ltd.

VDDE

VSSD1

CAP_5V0

S_P

AIN1

AIN2

S_N

AIN4/TEMP2

VSSA

AIN3/TEMP1

n.c.

HB4

VSS1

n.c.

VDDE8

January 26, 2016

ZAMC4100 Datasheet

Contents

IC Characteristics .......................................................................................................................................... 14

1.1.

Absolute Maximum Ratings .................................................................................................................... 14

1.2.

Electrical Parameters ............................................................................................................................. 15

1.2.1.

Supply and Supply Monitoring ......................................................................................................... 15

1.2.2.

Digital Interface (GPIOs) .................................................................................................................. 17

1.2.3.

LIN Physical Layer ........................................................................................................................... 17

1.2.4.

Output Drivers .................................................................................................................................. 18

1.2.5.

Internal Reference Sources and Sensors ........................................................................................ 21

1.2.6.

Analog-to-Digital Converter .............................................................................................................. 22

1.3.

Timing Parameters ................................................................................................................................. 22

1.3.1.

Oscillators (OSCL and OSCH) ......................................................................................................... 22

1.3.2.

Analog-to-Digital Converter .............................................................................................................. 23

1.3.3.

SPI Bus Timing ................................................................................................................................ 24

1.3.4.

System Power-up Timing ................................................................................................................. 25

1.4.

MCU Flash Memory Parameters ............................................................................................................ 26

System Blocks Description ............................................................................................................................ 27

2.1.

Power Supply ......................................................................................................................................... 27

2.2.

High-Frequency and Low-Frequency Oscillator ..................................................................................... 28

2.3.

Watchdog Timer ..................................................................................................................................... 28

2.4.

Analog-to-Digital Converter .................................................................................................................... 28

2.5.

Output Drivers ........................................................................................................................................ 29

2.6.

Driver’s Power Capability and Package Temperature ............................................................................ 29

2.7.

LIN Interface ........................................................................................................................................... 30

2.8.

SPI Bus .................................................................................................................................................. 31

2.9.

Diagnostic Functionalities ....................................................................................................................... 31

2.10.

Microcontroller ARM® Cortex™ M0 ....................................................................................................... 31

2.10.1.

MCU GPIOs ..................................................................................................................................... 32

2.10.2.

MCU Timer Module .......................................................................................................................... 32

2.10.3.

MCU SPI Master .............................................................................................................................. 32

2.10.4.

MCU LIN Controller .......................................................................................................................... 32

ZAMC4100 SBC Functional Description ....................................................................................................... 33

3.1.

System Power-Up Sequence ................................................................................................................. 33

3.2.

Clock and Reset Sources of the ZAMC4100 .......................................................................................... 34

3.2.1.

Clock Sources .................................................................................................................................. 34

3.2.2.

Reset Sources ................................................................................................................................. 35

3.3.

Watchdog Timer (WDT).......................................................................................................................... 38

3.3.1.

WDT Structure and Operation Principals ......................................................................................... 38

January 26, 2016

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