74HC365DB datasheet, PDF - EEWORLD Datasheet

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74HC365DB: DescriptionBuffers u0026 Line Drivers HEX BUFFER W/COMMON ENABLE 3-S; Categorylogic logic; File Size44KB，8 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HC365DB Overview

Buffers u0026 Line Drivers HEX BUFFER W/COMMON ENABLE 3-S

74HC365DB Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SOIC
package instruction	PLASTIC, SSOP-16
Contacts	16
Reach Compliance Code	unknown
Other features	WITH DUAL OUTPUT ENABLE
Control type	ENABLE LOW
series	HC/UH
JESD-30 code	R-PDSO-G16
JESD-609 code	e4
length	6.2 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUS DRIVER
MaximumI(ol)	0.006 A
Humidity sensitivity level	1
Number of digits	6
Number of functions	1
Number of ports	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP16,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2/6 V
Prop。Delay @ Nom-Sup	29 ns
propagation delay (tpd)	29 ns
Certification status	Not Qualified
Maximum seat height	2 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	5.3 mm

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INTEGRATED CIRCUITS

DATA SHEET

For a complete data sheet, please also download:

•

The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications

•

The IC06 74HC/HCT/HCU/HCMOS Logic Package Information

•

The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines

74HC/HCT365

Hex buffer/line driver; 3-state

Product speciﬁcation

File under Integrated Circuits, IC06

December 1990

74HC365DB Related Products

	74HC365DB	74HC365DB-T	74HCT365DB	74HCT365D	74HC365PW-T	74HCT365DB-T
Description	Buffers u0026 Line Drivers HEX BUFFER W/COMMON ENABLE 3-S	Buffers u0026 Line Drivers HEX BUFFER W/COMMON ENABLE 3-S		Buffers & Line Drivers HEX BUFF/DRVR 3ST	Buffers & Line Drivers HEX BUFFER W/COMMON ENABLE 3-S	Buffers & Line Drivers HEX BUFFER W/COMMON ENABLE 3-S
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	SOIC	SOIC	SOIC	SOIC	TSSOP	SOIC
package instruction	PLASTIC, SSOP-16	PLASTIC, SSOP-16	SSOP, SSOP16,.3	PLASTIC, SO-16	TSSOP,	SSOP,
Contacts	16	16	16	16	16	16
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Other features	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE	WITH DUAL OUTPUT ENABLE
series	HC/UH	HC/UH	HCT	HCT	HC/UH	HCT
JESD-30 code	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e4	e4	e4	e4	e4	e4
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
Humidity sensitivity level	1	1	1	1	1	1
Number of digits	6	6	6	6	6	6
Number of functions	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	SSOP	SSOP	SOP	TSSOP	SSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	NOT SPECIFIED	260
propagation delay (tpd)	29 ns	29 ns	38 ns	38 ns	29 ns	38 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	6 V	6 V	5.5 V	5.5 V	6 V	5.5 V
Minimum supply voltage (Vsup)	2 V	2 V	4.5 V	4.5 V	2 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	NOT SPECIFIED	30
Maker	NXP	NXP	NXP	NXP	NXP	-
length	6.2 mm	6.2 mm	6.2 mm	-	5 mm	6.2 mm
Maximum seat height	2 mm	2 mm	2 mm	-	1.1 mm	2 mm
width	5.3 mm	5.3 mm	5.3 mm	-	4.4 mm	5.3 mm

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