19-4644; Rev 1; 8/10
KIT
ATION
EVALU
BLE
AVAILA
Internal-Switch Boost Regulator with Integrated Scan
Driver, VCOM Calibrator, and Op Amp for TFT LCDs
General Description
The MAX17100 includes a high-voltage step-up regula-
tor, three high-performance operational amplifiers, two
linear regulators, two high-voltage switch control blocks
for gate-driver supply modulation, a digital VCOM cali-
brator, and six independent scan drivers.
The DC-DC converter is a 1.2MHz current-mode step-
up regulator with a built-in power MOSFET and pro-
vides the regulated supply voltage for the panel source
driver ICs. The built-in power MOSFET allows output
voltages to be as high as 18V from inputs of 2.5V to 6V.
A built-in 7-bit digital soft-start function limits inrush cur-
rents during startup. The step-up regulator provides
fast transient response to pulsed loads while producing
efficiencies over 87%.
Three operational amplifiers, typically used as the
gamma correction divider string, are configured as
unity-gain buffers and feature high output short-circuit
current (200mA), fast slew rate (45V/µs), and wide
bandwidth (20MHz). Their rail-to-rail inputs and outputs
maximize application flexibility.
Two linear regulators provide regulated gate-on and
gate-off supplies for TFT panel. The two high-voltage
switch control blocks modulate the shape of the gate-
on supply with adjustable startup delay.
One operational amplifier is designed to drive the LCD
backplane (VCOM). It features high short-circuit current
of 200mA. The programmable VCOM calibrator adjusts
the VCOM output-voltage level through serial interface
by sinking a programmable current from the VCOM
resistor-divider. The calibrator includes nonvolatile
memory cells that store the desired VCOM voltage level.
The six independent high-voltage level-shifting scan
drivers are designed to drive the TFT panel gate lines.
The outputs swing from +35V (maximum) to -15V (mini-
mum) and can swiftly drive capacitive loads.
The MAX17100 is available in a lead-free, 48-pin, thin
QFN package with 0.4mm lead spacing. The package
is a 6mm x 6mm square with a maximum thickness of
0.8mm for ultra-thin LCD panel design.
o
2.5V to 6V Input Supply Range
o
1.2MHz Current-Mode Step-Up Converter
Fast Transient Response to Pulsed Load
High-Accuracy Output Voltage (1%)
Built-In 20V, 3A, 0.16Ω n-Channel Power
MOSFET
Cycle-by-Cycle Current Limit
High Efficiency (87%)
o
Three High-Performance Operational Amplifiers
200mA Output Short-Circuit Current
45V/µs Slew Rate
20MHz, -3dB Bandwidth
Rail-to-Rail Inputs and Outputs
o
Linear Regulator for Gate-On and Gate-Off Supply
o
Two Logic-Controlled High-Voltage Switches with
Adjustable Delay
o
Programmable VCOM Calibrator
7-Bit Adjustable Current-Sink Output
Serial Interface
Nonvolatile Setting Memory
o
Six Independent Level-Shifting Scan Drivers
o
Built-In Sequencing
o
Soft-Start and Timer-Delayed Fault Latch for All
Regulator Outputs
o
Thermal-Overload Protection
o
Gate Driver for External Input-Side Series MOSFET
Features
MAX17100
Ordering Information
PART
MAX17100ETM+
TEMP RANGE
-40°C to +85°C
PIN-PACKAGE
48 Thin QFN-EP*
Applications
LCD Monitors
LCD TVs
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*EP
= Exposed pad.
Pin Configuration and Minimal Operating Circuit appear at
end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Internal-Switch Boost Regulator with Integrated Scan
Driver, VCOM Calibrator, and Op Amp for TFT LCDs
MAX17100
ABSOLUTE MAXIMUM RATINGS
IN, YV1C_, GATE to AGND ...................................-0.3V to +7.5V
SCL, SDA,
WR, RST,
RSET, ST_, CK_,
CKB_ to AGND ...................................................-0.3V to +7.5V
TGS, REF, COMP, FB, FBN, FBP,
to AGND ...................................................-0.3V to (V
IN
+ 0.3V)
PGND, OGND to AGND ........................................-0.3V to +0.3V
LX to PGND ............................................................-0.3V to +20V
SUP to OGND.........................................................-0.3V to +20V
DRVN to AGND ...................................(V
IN
- 30V) to (V
IN
+ 0.3V)
DRVP to AGND.......................................................-0.3V to +40V
GHON to AGND .....................................................-0.3V to +40V
GOFF to AGND.......................................................-20V to +0.3V
GHON to GOFF ......................................................-0.3V to +50V
GHD_ to AGND......................................-0.3V to (V
GHON
+ 0.3V)
STH_, CKH_, CKBH_............(-0.3V + V
GOFF
) to (V
GHON
+ 0.3V)
POS_, OUT_, COMFB, COMADJ,
VCOM to OGND.....................................-0.3V to (V
SUP
+ 0.3V)
COMADJ to COMFB....................................................-6V to +6V
OUT_ Maximum Continuous Output Current....................±75mA
GHON, GOFF RMS Current Rating...................................130mA
LX, PGND RMS Current Rating.............................................2.4A
Continuous Power Dissipation (T
A
= +70°C)
48-Pin TQFN (derate 27mW/°C above +70°C) ...........2150mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
IN
= +3V, Circuit of Figure 2, V
MAIN
= V
SUP
= +14V,
T
A
= 0°C to +85°C,
unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
IN Input Supply Range
IN Undervoltage Lockout Threshold
IN Quiescent Current
(Note 1)
V
IN
rising, hysteresis = 140mV
V
FB
= V
FBP
= 1.3V, V
FBN
= 0V, LX not switching
V
FB
= 1.2V, V
FBP
= 1.4V, V
FBN
= 0V,
LX switching
FB or FBP below threshold or FBN above
threshold; V
FB
= 1.14V, V
FBP
= 1V, V
FBN
= 420mV
Temperature rising
Hysteresis
No external load
0V < I
LOAD
< 50µA
Rising edge, hysteresis = 120mV
V
S
1000
90
No load, T
A
= 0°C to +85°C
Falling edge
0V < I
LOAD
< 500mA, transient only
V
IN
= 2.5V to 6V
V
FB
= 1.233V, T
A
= +25°C
I = ±2.5µA, FB = COMP
FB to COMP
V
FB
= 1.2V, duty cycle = 75%
2.5
80
1.221
1.10
1200
91.5
1.233
1.14
-0.2
0.1
100
190
2500
3
3.5
0.4
200
300
1.0
1.238
CONDITIONS
MIN
2.5
2.05
2.25
1
3
218
160
15
1.250
1.262
10
1.15
18
1400
93
1.245
1.17
TYP
MAX
6
2.45
3
5
mA
UNITS
V
V
Duration to Trigger Fault Condition
Thermal Shutdown
REFERENCE
REF Output Voltage
REF Load Regulation
REF Undervoltage Lockout Threshold
STEP-UP REGULATOR
Output-Voltage Range
Frequency
Oscillator Maximum Duty Cycle
FB Regulation Voltage
FB Fault Trip Level
FB Load Regulation
FB Line Regulation
FB Input Bias Current
FB Transconductance
FB Voltage Gain
LX Current Limit
ms
°C
V
mV
V
V
kHz
%
V
V
%
%/V
nA
µS
V/V
A
2
_______________________________________________________________________________________
Internal-Switch Boost Regulator with Integrated Scan
Driver, VCOM Calibrator, and Op Amp for TFT LCDs
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= +3V, Circuit of Figure 2, V
MAIN
= V
SUP
= +14V,
T
A
= 0°C to +85°C,
unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
LX On-Resistance
LX Bias Current
Current-Sense Transresistance
GATE-ON LINEAR REGULATOR CONTROLLER
FBP Fault Trip Level
FBP Regulation Voltage
FBP Line Regulation Error
FBP Input Bias Current
FBP Effective Load Regulation Error
(Transconductance)
DRVP Sink Current
DRVP Off-Leakage Current
Soft-Start Period
Soft-Start Step Size
GATE-OFF LINEAR REGULATOR CONTROLLER
FBN Fault Trip Level
FBN Regulation Voltage
FBN Line Regulation Error
FBN Input Bias Current
FBN Effective Load Regulation Error
(Transconductance)
DRVN Source Current
DRVN Off-Leakage Current
Soft-Start Period
Soft-Start Step Size
POSITIVE GATE-DRIVER TIMING AND CONTROL SWITCHES
TGS Capacitor Charge Current
TGS Turn-On Threshold
TGS Discharge Switch On-Resistance
YV1C_ Input Low Voltage
YV1C_ Input High Voltage
YV1C_ Input Leakage Current
YV1C_-to-GHON Propagation Delay
GHON Input-Voltage Range
V
IN
< 4.5V
V
IN
> 4.5V
YV1C_ = AGND or IN, T
A
= +25°C
Rising
Falling
1.75
2.1
-1
100
300
35
+1
During UVLO, V
IN
= 2V
During startup, V
TGS
= 1V
4
1.19
5
1.25
14
0.6
V
V
µA
ns
V
6
1.31
µA
V
V
FBN
rising
I
DRVN
= 100µA, V
REF
- V
FBN
V
IN
= 2.5V to 6V, I
DRVN
= 100µA
V
FBN
= 0.25V, T
A
= +25°C
V
DRVN
= -10V, I
DRVN
= 50µA to 1mA
V
FBN
= 300mV, V
DRVN
= -10V
V
FBN
= 0V, V
DRVN
= -25V, T
A
= +25°C
1
370
0.985
-5
-50
11
5
0.01
14
(V
REF
- V
FBN
)
/128
10
420
1
470
1.015
+5
+50
25
mV
V
mV
nA
mV
mA
µA
ms
V
V
FBP
falling
I
DRVP
= 100µA
V
IN
= 2.5V to 6V, I
DRVP
= 100µA
V
FBP
= 1.25V, T
A
= +25°C
V
DRVP
= 10V, I
DRVP
= 50µA to 1mA
V
FBP
= 1.1V, V
DRVP
= 10V
V
FBP
= 1.4V, V
DRVP
= 34V, T
A
= +25°C
1
0.96
1.231
-10
-50
-1
5
0.01
14
V
REF
/
128
10
1.00
1.250
1.04
1.269
+10
+50
-1.5
V
V
mV
nA
%
mA
µA
ms
V
I
LX
= 200mA
V
LX
= 19V, T
A
= +25°C
0.10
CONDITIONS
MIN
TYP
0.12
10
0.20
MAX
0.25
20
0.30
µA
V/A
UNITS
MAX17100
_______________________________________________________________________________________
3
Internal-Switch Boost Regulator with Integrated Scan
Driver, VCOM Calibrator, and Op Amp for TFT LCDs
MAX17100
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= +3V, Circuit of Figure 2, V
MAIN
= V
SUP
= +14V,
T
A
= 0°C to +85°C,
unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
GHON Input Current
GHON to GHC_ Switch On-Resistance
GHD_ to GHC_ Switch On-Resistance
INPUT SERIES SWITCH CONTROL
GATE Output Sink Current
GATE Done Voltage Threshold
GATE-On Voltage
BUFFER AMPLIFIERS
SUP Supply Range
SUP Overvoltage Fault Threshold
SUP Supply Current
Input Offset Voltage
Input Bias Current
Input Common-Mode Voltage Range
Output-Voltage Swing High
Output-Voltage Swing Low
Slew Rate
-3dB Bandwidth
Short-Circuit Current
Power-Supply Rejection Ratio (Note 4)
VCOM OPERATIONAL AMPLIFIER
Input Bias Current
SUP Supply Current
Input Offset Voltage
Output-Voltage Swing High
Output-Voltage Swing Low
Slew Rate
-3dB Bandwidth
R
L
= 10k , C
L
= 10pF, buffer configuration
Buffer configuration, Source:
V
COMADJ
= V
SUP
- 3V, V
VCOM
= V
SUP
- 4V
Buffer configuration, Sink:
V
COMADJ
= 3V, V
VCOM
= 4V
I
VCOM
= 75mA
I
VCOM
= -75mA
V
COMFB
= V
COMADJ
= V
SUP
/2, T
A
= +25°C
Buffer configuration, V
COMADJ
= V
SUP
/2,
no load
-8
V
SUP
-
1.5
-50
3
+4
V
SUP
-
0.6
0.4
100
20
1.5
+50
4
+16
nA
mA
mV
V
V
V/µs
MHz
R
L
= 10k , C
L
= 10pF, buffer configuration
Source: V
POS_
= V
SUP
- 3V,
V
OUT_
= V
SUP
- 4V
Sink: V
POS_
= 3V, V
OUT_
= 4V
DC, 10V
V
SUP
18V, V
POS_
= 7V
115
115
I
OUT_
= 5mA
I
OUT_
= -5mA
100
20
200
200
100
dB
All op amps are no load with V
POS
= V
SUP
/2
V
POS_
= V
SUP
/2, T
A
= +25°C
V
POS_
= V
SUP
/2, T
A
= +25°C
6
18.1
-8
-50
0
V
SUP
-
100
100
19.0
13
+4
18
19.9
16
+16
+50
V
SUP
V
V
mA
mV
nA
V
mV
mV
V/µs
MHz
mA
GATE = IN
V
IN
- V
GATE
V
IN
= 5V
45
50
1.5
55
2.2
0.5
µA
V
V
CONDITIONS
YV1C_ is high, CK_, CKB_, ST_ are low,
(V
GHON
= 32.5V, V
GOFF
= -12.5V)
V
TGS
= 1.5V, YV1C_ = IN
V
TGS
= 1.5V, YV1C_ = AGND
MIN
TYP
820
6
30
MAX
1550
12
60
UNITS
µA
Short-Circuit Current
115
200
mA
4
_______________________________________________________________________________________
Internal-Switch Boost Regulator with Integrated Scan
Driver, VCOM Calibrator, and Op Amp for TFT LCDs
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= +3V, Circuit of Figure 2, V
MAIN
= V
SUP
= +14V,
T
A
= 0°C to +85°C,
unless otherwise noted. Typical values are at T
A
= +25°C.)
PARAMETER
PROGRAMMABLE VCOM CALIBRATOR
SUP Input Range
RSET Voltage Resolution
RSET Differential Nonlinearity
RSET Zero-Scale Error
RSET Full-Scale Error
RSET Current
RSET External Resistance (Note 2)
V
RSET
/V
SUP
Voltage Ratio
COMADJ Settling Time
Memory Write Cycles
WR
Input Low Voltage
WR
Input High Voltage
WR
Leakage Current
MTP Write Time
SERIAL INTERFACE
Logic-Input Low Voltage
Logic-Input High Voltage
Logic-Output Low Sink Current (SDA)
Logic-Input Current
SDA and SCL Input Capacitance
SCL Frequency (f
CLK
)
SCL High Time (t
CLH
)
SCL Low Time (t
CLL
)
SDA and SCL Rise Time (t
R
)
SDA and SCL Fall Time (t
F
)
START Condition Hold Time (t
HDSTT
)
START Condition Setup Time (t
SUSTT
)
Data Input Hold Time (t
HDDAT
)
Data Input Setup Time (t
SUDAT
)
STOP Condition Setup Time (t
SUST
)
Bus Free Time (t
BF
)
Input Filter Spike Suppression
SDA, SCL, not tested
C
b
= total capacitance of bus line in pF
C
b
= total capacitance of bus line in pF
10% of SDA to 90% of SCL
SDA, SCL
SDA, SCL
SDA sink 3mA
SDA, SCL, T
A
= +25°C
SDA, SCL
DC
600
1300
20 +
0.1 x Cb
20 +
0.1 x Cb
600
600
200
100
600
1300
50
900
300
300
0.7 x V
IN
0
-1
5
400
0.4
+1
0.3 x V
IN
V
V
V
µA
pF
kHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
WR
= AGND or IN, T
A
= +25°C
2
-1
160
218
+1
250
V
COMADJ
= 4V, VCOM DAC code = 7FH
To AGND, V
SUP
= 18V
To AGND, V
SUP
= 6V
DAC full scale
To ±0.5 LSB error band
30
1
8.5
3.3
0.05
20
Monotonic overtemperature
For MEMORY writing
8
7
-1
-1
-4
+1
+1
+2
+4
120
170
50
18
V
Bits
LSB
LSB
LSB
µA
k
V/V
µs
Cycles
V
V
µA
ms
CONDITIONS
MIN
TYP
MAX
UNITS
MAX17100
_______________________________________________________________________________________
5
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