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MC68030FE16C

Description
Microprocessors - MPU 32B ON-CHIP CACHE MMU
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size553KB,19 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MC68030FE16C Overview

Microprocessors - MPU 32B ON-CHIP CACHE MMU

MC68030FE16C Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFP
package instructionQFP,
Contacts132
Reach Compliance Codeunknown
ECCN code3A991
Other featuresDYNAMIC BUS SIZING;UPTO 9.2 MIPS
Address bus width32
bit size32
boundary scanNO
maximum clock frequency16 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-CQFP-G132
JESD-609 codee3
length24.13 mm
low power modeNO
Humidity sensitivity level1
Number of terminals132
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height3.175 mm
speed16 MHz
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyHCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width24.13 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
MOTOROLA
Order this document
by MC68030EC/D
m SEMICONDUCTOR
TECHNICAL DATA
MC68030
ELECTRICAL SPECIFICATIONS
( •
(~)MOTOROLA INC., 1990
MOTOROLA
Rev 1
m:

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Description Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE MMU IC MPU M680X0 25MHZ 132CQFP
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP NXP
Parts packaging code QFP QFP PGA QFP PGA QFP QFP
package instruction QFP, QFP, QFP132,1.2SQ LEAD FREE, PGA-128 QFP, LEAD FREE, PGA-128 QFP, QFP132,1.2SQ QFP,
Contacts 132 132 128 132 128 132 132
Reach Compliance Code unknown compliant unknown unknown unknown compliant compliant
ECCN code 3A991 3A991 EAR99 3A991 EAR99 3A991 EAR99
Address bus width 32 32 32 32 32 32 32
bit size 32 32 32 32 32 32 32
boundary scan NO NO NO NO NO NO NO
maximum clock frequency 16 MHz 25 MHz 16 MHz 40 MHz 40 MHz 20 MHz 25 MHz
External data bus width 32 32 32 32 32 32 32
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES YES YES YES
JESD-30 code S-CQFP-G132 S-CQFP-G132 S-CPGA-P128 S-CQFP-G132 S-CPGA-P128 S-CQFP-G132 S-CQFP-G132
length 24.13 mm 24.13 mm 34.545 mm 24.13 mm 34.545 mm 24.13 mm 24.13 mm
low power mode NO NO NO NO NO NO NO
Number of terminals 132 132 128 132 128 132 132
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QFP QFP PGA QFP PGA QFP QFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK GRID ARRAY FLATPACK GRID ARRAY FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) 260 260 NOT SPECIFIED 260 NOT SPECIFIED 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.175 mm 3.175 mm 4.7 mm 3.175 mm 4.7 mm 3.175 mm 3.175 mm
speed 16 MHz 25 MHz 16 MHz 40 MHz 40 MHz 20 MHz 25 MHz
Maximum supply voltage 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO YES NO YES YES
technology HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING PIN/PEG GULL WING PIN/PEG GULL WING GULL WING
Terminal pitch 0.635 mm 0.635 mm 2.54 mm 0.635 mm 2.54 mm 0.635 mm 0.635 mm
Terminal location QUAD QUAD PERPENDICULAR QUAD PERPENDICULAR QUAD QUAD
Maximum time at peak reflow temperature 40 40 NOT SPECIFIED 40 NOT SPECIFIED 40 NOT SPECIFIED
width 24.13 mm 24.13 mm 34.545 mm 24.13 mm 34.545 mm 24.13 mm 24.13 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
JESD-609 code e3 e3 - e3 - e3 e3
Humidity sensitivity level 1 1 - 1 - 1 1
Terminal surface Matte Tin (Sn) Matte Tin (Sn) - Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn)
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