EEWORLDEEWORLDEEWORLD

Part Number

Search

MC68EC030FE25CB1

Description
IC MPU M680X0 25MHZ 132CQFP
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size553KB,19 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

MC68EC030FE25CB1 Overview

IC MPU M680X0 25MHZ 132CQFP

MC68EC030FE25CB1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFP
package instructionQFP,
Contacts132
Reach Compliance Codecompliant
ECCN codeEAR99
Address bus width32
bit size32
boundary scanNO
maximum clock frequency25 MHz
External data bus width32
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-CQFP-G132
JESD-609 codee3
length24.13 mm
low power modeNO
Humidity sensitivity level1
Number of terminals132
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height3.175 mm
speed25 MHz
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyHCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width24.13 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR
MOTOROLA
Order this document
by MC68030EC/D
m SEMICONDUCTOR
TECHNICAL DATA
MC68030
ELECTRICAL SPECIFICATIONS
( •
(~)MOTOROLA INC., 1990
MOTOROLA
Rev 1
m:

MC68EC030FE25CB1 Related Products

MC68EC030FE25CB1 MC68030FE25C MC68030RC16C MC68EC030FE40C MC68030FE16C MC68030RC40C MC68030FE20C
Description IC MPU M680X0 25MHZ 132CQFP Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE MMU Microprocessors - MPU 32B ON-CHIP CACHE MMU
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP NXP
Parts packaging code QFP QFP PGA QFP QFP PGA QFP
package instruction QFP, QFP, QFP132,1.2SQ LEAD FREE, PGA-128 QFP, QFP, LEAD FREE, PGA-128 QFP, QFP132,1.2SQ
Contacts 132 132 128 132 132 128 132
Reach Compliance Code compliant compliant unknown unknown unknown unknown compliant
ECCN code EAR99 3A991 EAR99 3A991 3A991 EAR99 3A991
Address bus width 32 32 32 32 32 32 32
bit size 32 32 32 32 32 32 32
boundary scan NO NO NO NO NO NO NO
maximum clock frequency 25 MHz 25 MHz 16 MHz 40 MHz 16 MHz 40 MHz 20 MHz
External data bus width 32 32 32 32 32 32 32
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES YES YES YES YES
JESD-30 code S-CQFP-G132 S-CQFP-G132 S-CPGA-P128 S-CQFP-G132 S-CQFP-G132 S-CPGA-P128 S-CQFP-G132
length 24.13 mm 24.13 mm 34.545 mm 24.13 mm 24.13 mm 34.545 mm 24.13 mm
low power mode NO NO NO NO NO NO NO
Number of terminals 132 132 128 132 132 128 132
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QFP QFP PGA QFP QFP PGA QFP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK GRID ARRAY FLATPACK FLATPACK GRID ARRAY FLATPACK
Peak Reflow Temperature (Celsius) 260 260 NOT SPECIFIED 260 260 NOT SPECIFIED 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.175 mm 3.175 mm 4.7 mm 3.175 mm 3.175 mm 4.7 mm 3.175 mm
speed 25 MHz 25 MHz 16 MHz 40 MHz 16 MHz 40 MHz 20 MHz
Maximum supply voltage 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO YES YES NO YES
technology HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS HCMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING PIN/PEG GULL WING GULL WING PIN/PEG GULL WING
Terminal pitch 0.635 mm 0.635 mm 2.54 mm 0.635 mm 0.635 mm 2.54 mm 0.635 mm
Terminal location QUAD QUAD PERPENDICULAR QUAD QUAD PERPENDICULAR QUAD
Maximum time at peak reflow temperature NOT SPECIFIED 40 NOT SPECIFIED 40 40 NOT SPECIFIED 40
width 24.13 mm 24.13 mm 34.545 mm 24.13 mm 24.13 mm 34.545 mm 24.13 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
JESD-609 code e3 e3 - e3 e3 - e3
Humidity sensitivity level 1 1 - 1 1 - 1
Terminal surface Matte Tin (Sn) Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn) - Matte Tin (Sn)
How to install Stellaris peripheral drivers?
Please help. I have been installing for an hour but still can't build it. . . . I think it may be because I don't know how to install it. . ....
mariawjy Microcontroller MCU
Using the camera with serfox and spcavie in S3C2410
No image after servfox runs~~ Problems when using the camera with 301 chip on 2410 development board: I use servfox as the acquisition end of the development board and spcaview as the receiving end of...
nddz Embedded System
External memory address allocation problem of STM32F429IGT--SDRAM
Let's look at two pictures first:Now the external SDRAM is connected, and the SDNE! (PH6) chip select is used. From the second picture, it can be seen that it should start at 0x7000 0000? I have looke...
dontium stm32/stm8
[SAM R21] Some sensors and devices prepared for the event
For this event, I prepared some sensors and devices. Some of them were purchased from Taobao, and some of them were DIY because I didn't have the right ones. The DIY ones are not ready yet, so I will ...
dcexpert Energy Infrastructure?
[Audio recognizer based on GD32F350RB] 1. Preparation before development
[align=center][size=5]Audio Recognizer Based on GD32F350RB[/size][/align] [align=center][size=5]——Preparation before Development[/size][/align] [Overview] The preparation work includes software develo...
北方 GD32 MCU
beg
I want to buy a digital camera, do you have any recommendations?...
rain Mobile and portable

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1129  1480  634  1184  2884  23  30  13  24  59 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号