MC74VHC1GT66
SPST (NO) Normally Open
Analog Switch
The MC74VHC1GT66 is a Single Pole Single Throw (SPST)
analog switch. It achieves high speed propagation delays and low ON
resistances while maintaining low power dissipation. This bilateral
switch controls analog and digital voltages that may vary across the
full power−supply range (from V
CC
to GND).
The MC74VHC1GT66 is compatible in function to a single gate of
the High Speed CMOS MC74VHCT4066 and the metal−gate CMOS
MC14066. The device has been designed so that the ON resistances
(R
ON
) are much lower and more linear over input voltage than R
ON
of
the metal−gate CMOS or High Speed CMOS analog switches.
The ON/OFF Control input is compatible with TTL−type input
thresholds allowing the device to be used as a logic−level translator
from 3 V CMOS logic to 5 V CMOS logic or from 1.8 V CMOS logic
to 3 V CMOS logic while operating at the high−voltage power supply.
The input protection circuitry on this device allows overvoltage
tolerance on the input, which provides protection when voltages of up
to 7 V are applied, regardless of the supply voltage. This allows the
MC74VHC1GT66 to be used to interface 5 V circuits to 3 V circuits.
Features
http://onsemi.com
MARKING
DIAGRAMS
5
1
SC−88A
DF SUFFIX
CASE 419A
5
VE MG
G
M
1
5
VE MG
G
1
5
1
TSOP−5
DT SUFFIX
CASE 483
•
•
•
•
•
•
•
High Speed: t
PD
= 20 ns (Typ) at V
CC
= 5 V
Low Power Dissipation: I
CC
= 1.0
mA
(Max) at T
A
= 25°C
Diode Protection Provided on Inputs and Outputs
Improved Linearity and Lower ON Resistance over Input Voltage
On/Off Control Input Has OVT
Chip Complexity: FETs = 11; Equivalent Gates = 3
Pb−Free Packages are Available
VE
= Device Code
M
= Date Code*
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
1
2
3
4
5
IN/OUT X
A
OUT/IN Y
A
GND
ON/OFF CONTROL
V
CC
FUNCTION TABLE
On/Off Control Input
L
H
State of Analog Switch
Off
On
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
©
Semiconductor Components Industries, LLC, 2011
August, 2011
−
Rev. 15
1
Publication Order Number:
MC74VHC1GT66/D
MC74VHC1GT66
IN/OUT X
A
1
5
V
CC
OUT/IN Y
A
2
GND
3
4
ON/OFF
CONTROL
(SC−88A, TSOP−5)
Figure 1. Pinout Diagram
ON/OFF CONTROL
IN/OUT X
A
U
X1
1
1
U
OUT/IN Y
A
Figure 2. Logic Symbol
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
IS
I
IK
I
CC
T
STG
T
L
T
J
q
JA
P
D
MSL
F
R
V
ESD
DC Supply Voltage
DC Input Voltage
Analog Output Voltage
Input Diode Current
DC Supply Current, V
CC
and GND
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
Power Dissipation in Still Air at 85°C
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Above V
CC
and Below GND at 125°C (Note 5)
SC70−5 (Note 1)
SOT23−5
SC70−5
SOT23−5
Characteristics
Value
−0.5
to +7.0
−0.5
to +7.0
−0.5
to 7.0
−20
+25
*65
to
)150
260
)150
350
230
150
200
Level 1
UL 94 V−0 @ 0.125 in
u2000
u200
N/A
$500
V
Unit
V
V
V
mA
mA
°C
°C
°C
°C/W
mW
I
Latchup
Latchup Performance
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
http://onsemi.com
2
MC74VHC1GT66
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
IS
T
A
t
r
, t
f
DC Supply Voltage
Digital Input Voltage
Analog Input Voltage
Operating Temperature Range
Input Rise and Fall Time
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
Characteristics
Min
2.0
GND
GND
−55
0
0
Max
5.5
5.5
V
CC
+125
100
20
Unit
V
V
V
°C
ns/V
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature
°C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
NORMALIZED FAILURE RATE
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
T
J
=120
°
C
T
J
=100
°
C
T
J
= 90
°
C
T
J
= 80
°
C
100
T
J
= 130
°
C
T
J
=110
°
C
10
TIME, YEARS
1
1
1000
Figure 3. Failure Rate vs. Time Junction Temperature
http://onsemi.com
3
MC74VHC1GT66
DC ELECTRICAL CHARACTERISTICS
Symbol
V
IH
Parameter
Minimum High−Level
Input Voltage
ON/OFF Control Input
Maximum Low−Level
Input Voltage
ON/OFF Control Input
Maximum Input
Leakage Current
ON/OFF Control Input
Maximum Quiescent
Supply Current
Quiescent
Supply Current
Maximum ”ON”
Resistance
Maximum Off−Channel
Leakage Current
Test Conditions
R
ON
= Per Spec
V
CC
(V)
3.0
4.5
5.5
3.0
4.5
5.5
0 to
5.5
5.5
5.5
3.0
4.5
5.5
5.5
T
A
= 25°C
Min
1.2
2.0
2.0
0.53
0.8
0.8
±0.1
Max
T
A
≤
85°C
Min
1.2
2.0
2.0
0.53
0.8
0.8
±1.0
Max
−55°C
≤
T
A
≤
125°C
Min
1.2
2.0
2.0
0.53
0.8
0.8
±1.0
Max
Unit
V
V
IL
R
ON
= Per Spec
V
I
IN
V
IN
= V
CC
or GND
mA
I
CC
I
CCT
R
ON
V
IN
= V
CC
or GND
V
IO
= 0 V
ON/OFF Control at
3.4 V
V
IN
= V
IH
V
IS
= V
CC
or GND
|I
IS
|
≤
10 mA (Figure 4)
V
IN
= V
IL
V
IS
= V
CC
or GND
Switch Off (Figure 5)
1.0
1.35
60
45
40
0.1
20
1.5
70
50
45
0.5
40
1.65
100
60
55
1.0
mA
mA
W
I
OFF
mA
AC ELECTRICAL CHARACTERISTICS
C
load
= 50 pF, Input t
r
/t
f
= 3.0 ns
Symbol
t
PLH
,
t
PHL
Parameter
Maximum Propagation
Delay, Input X to Y
Test Conditions
Y
A
= Open
(Figures 7, 14)
R
L
= 1000
W
(Figures 8, 15)
R
L
= 1000
W
(Figures 8, 15)
ON/OFF Control Input
Control Input = GND
Analog I/O
Feedthrough
V
CC
(V)
2.0
3.0
4.5
5.5
2.0
3.0
4.5
5.5
2.0
3.0
4.5
5.5
0.0
5.0
T
A
= 25°C
Min
Typ
1
0.6
0.6
0.6
32
28
24
20
32
28
24
20
3
4
4
Max
5
2
1
1
40
35
30
25
40
35
30
25
10
10
10
T
A
≤
85°C
Min
Max
6
3
1
1
45
40
35
30
45
40
35
30
10
10
10
−55°C
≤
T
A
≤
125°C
Min
Max
7
4
2
1
50
45
40
35
50
45
40
35
10
10
10
Unit
ns
t
PLZ
,
t
PHZ
Maximum Propagation
Delay, ON/OFF Control
to Analog Output
Maximum Propagation
Delay, ON/OFF Control
to Analog Output
Maximum Input
Capacitance
ns
t
PZL
,
t
PZH
ns
C
IN
pF
Typical @ 25°C, V
CC
= 5.0 V
C
PD
Power Dissipation Capacitance (Note 6)
18
pF
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC2
f
in
+ I
CC
V
CC
.
http://onsemi.com
4
MC74VHC1GT66
ADDITIONAL APPLICATION CHARACTERISTICS
(Voltages Referenced to GND Unless Noted)
Symbol
BW
Parameter
Maximum On−Channel Bandwidth
or Minimum Frequency Response
(Figure 10)
Off−Channel Feedthrough Isolation
(Figure 11)
Feedthrough Noise Control to
Switch
(Figure 12)
Total Harmonic Distortion
(Figure 13)
Test Conditions
f
in
= 1 MHz Sine Wave
Adjust f
in
voltage to obtain 0 dBm at V
OS
Increase f
in
= frequency until dB meter reads
−3
dB
R
L
= 50
W
f
in
= Sine Wave
Adjust f
in
voltage to obtain 0 dBm at V
IS
f
in
= 10 kHz, R
L
= 600
W
V
in
≤
1 MHz Square Wave (t
r
= t
f
= 2ns)
R
L
= 600
W
f
in
= 1 kHz, R
L
= 10 kW
THD = THD
Measured
−
THD
Source
V
IS
= 3.0 V
PP
sine wave
V
IS
= 5.0 V
PP
sine wave
V
CC
3.0
4.5
5.5
3.0
4.5
5.5
3.0
4.5
5.5
Limit 25°C
150
175
180
−80
−80
−80
45
60
130
Unit
MHz
ISO
off
dB
NOISE
feed
mV
PP
THD
%
3.3
5.5
0.30
0.15
PLOTTER
POWER
SUPPLY
−
+
V
CC
1
2
3
4
5
1
V
IH
2
V
CC
A
3
4
V
IL
5
V
CC
V
CC
DC PARAMETER
ANALYZER
COMPUTER
Figure 4. On Resistance Test Set−Up
Figure 5. Maximum Off−Channel Leakage Current
Test Set−Up
V
CC
A
N/C
1
2
3
4
5
V
CC
1
V
IH
TEST
POINT
2
3
4
5
V
CC
V
IH
Figure 6. Maximum On−Channel Leakage Current
Test Set−Up
Figure 7. Propagation Delay Test Set−Up
http://onsemi.com
5
京公网安备 11010802033920号
EEWORLD
