TC58FVB160AXB-10 datasheet, PDF

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TC58FVB160AXB-10: DescriptionTOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS; Categorystorage storage; File Size517KB，41 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TC58FVB160AXB-10 Overview

TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS

TC58FVB160AXB-10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	6 X 8 MM, 0.80 MM PITCH, TFBGA-48
Contacts	48
Reach Compliance Code	unknow
Maximum access time	100 ns
Spare memory width	8
JESD-30 code	R-PBGA-B48
JESD-609 code	e0
length	8 mm
memory density	16777216 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6 mm
Base Number Matches	1

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TC58FVT160/B160AFT/AXB-70,-10

TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS

16-MBIT (2M

8 BITS / 1M

16 BITS) CMOS FLASH MEMORY

DESCRIPTION

The TC58FVT160/B160A is a 16,777,216-bit, 3.0-V read-only electrically erasable and programmable flash

memory organized as 2,097,152 words

8 bits or as 1,048,576 words

16 bits. The TC58FVT160/B160A features

commands for Read, Program and Erase operations to allow easy interfacing with microprocessors. The commands

are based on the JEDEC standard. The Program and Erase operations are automatically executed in the chip.

FEATURES

•

Power supply voltage

2.7 V~3.6 V

Operating temperature

= −40°C~85°C

Organization

8 bits / 1M

16 bits

Functions

Auto Program, Auto Erase

Fast Program Mode

Program Suspend/Resume

Erase Suspend/Resume

data polling / Toggle bit

block protection

Automatic Sleep, support for hidden ROM area

common flash memory interface (CFI)

Byte/Word Modes

•

Block erase architecture

16 Kbytes / 2

8 Kbytes

32 Kbytes / 31

64 Kbytes

Boot block architecture

TC58FVT160AFT/AXB: top boot block

TC58FVB160AFT/AXB: bottom boot block

Mode control

Compatible with JEDEC standard commands

Erase/Program cycles

cycles typ.

Access time

70 ns

: 30 pF)

100 ns

: 100 pF)

Power consumption

µA

(Standby)

30 mA

(Read operation)

15 mA

(Program/Erase operations)

Package

TC58FVT160/B160AFT:

TSOPI48-P-1220-0.50 (weight: 0.51 g)

TC58FVT160/B160AXB:

P-TFBGA48-0608-0.80AZ (weight: 0.090 g)

•

000630EBA1

•

TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general

can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,

when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid

situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to

property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most

recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide

for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..

•

The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal

equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Toshiba products are

neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or

failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control

instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control

instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed in this document

shall be made at the customer’s own risk.

•

The products described in this document are subject to the foreign exchange and foreign trade laws.

•

The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by

TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its

use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or

others.

•

The information contained herein is subject to change without notice.

2002-08-06 1/41

TC58FVB160AXB-10 Related Products

	TC58FVB160AXB-10	TC58FVB160AXB	TC58FVB160AFT-70	TC58FVB160AFT-10	TC58FVB160AFT
Description	TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS	TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS	TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS	TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS	TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
Is it Rohs certified?	incompatible	-	incompatible	incompatible	-
Parts packaging code	BGA	-	TSOP1	TSOP1	-
package instruction	6 X 8 MM, 0.80 MM PITCH, TFBGA-48	-	12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48	12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48	-
Contacts	48	-	48	48	-
Reach Compliance Code	unknow	-	unknow	unknow	-
Maximum access time	100 ns	-	80 ns	100 ns	-
Spare memory width	8	-	8	8	-
JESD-30 code	R-PBGA-B48	-	R-PDSO-G48	R-PDSO-G48	-
length	8 mm	-	18.4 mm	18.4 mm	-
memory density	16777216 bi	-	16777216 bi	16777216 bi	-
Memory IC Type	FLASH	-	FLASH	FLASH	-
memory width	16	-	16	16	-
Number of functions	1	-	1	1	-
Number of terminals	48	-	48	48	-
word count	1048576 words	-	1048576 words	1048576 words	-
character code	1000000	-	1000000	1000000	-
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	85 °C	-	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-
organize	1MX16	-	1MX16	1MX16	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TFBGA	-	TSOP1	TSOP1	-
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	-
Peak Reflow Temperature (Celsius)	240	-	240	NOT SPECIFIED	-
Programming voltage	3 V	-	3 V	3 V	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	-
Maximum seat height	1.2 mm	-	1.2 mm	1.2 mm	-
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V	-
Nominal supply voltage (Vsup)	3 V	-	3 V	3 V	-
surface mount	YES	-	YES	YES	-
technology	CMOS	-	CMOS	CMOS	-
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	-
Terminal form	BALL	-	GULL WING	GULL WING	-
Terminal pitch	0.8 mm	-	0.5 mm	0.5 mm	-
Terminal location	BOTTOM	-	DUAL	DUAL	-
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-
width	6 mm	-	12 mm	12 mm	-
Base Number Matches	1	-	1	1	-

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