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TC58FVB160AFT

Description
TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
File Size517KB,41 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TC58FVB160AFT Overview

TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS

TC58FVT160/B160AFT/AXB-70,-10
TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
16-MBIT (2M
×
8 BITS / 1M
×
16 BITS) CMOS FLASH MEMORY
DESCRIPTION
The TC58FVT160/B160A is a 16,777,216-bit, 3.0-V read-only electrically erasable and programmable flash
memory organized as 2,097,152 words
×
8 bits or as 1,048,576 words
×
16 bits. The TC58FVT160/B160A features
commands for Read, Program and Erase operations to allow easy interfacing with microprocessors. The commands
are based on the JEDEC standard. The Program and Erase operations are automatically executed in the chip.
FEATURES
Power supply voltage
V
DD
=
2.7 V~3.6 V
Operating temperature
Ta
= −40°C~85°C
Organization
2M
×
8 bits / 1M
×
16 bits
Functions
Auto Program, Auto Erase
Fast Program Mode
Program Suspend/Resume
Erase Suspend/Resume
data polling / Toggle bit
block protection
Automatic Sleep, support for hidden ROM area
common flash memory interface (CFI)
Byte/Word Modes
Block erase architecture
1
×
16 Kbytes / 2
×
8 Kbytes
1
×
32 Kbytes / 31
×
64 Kbytes
Boot block architecture
TC58FVT160AFT/AXB: top boot block
TC58FVB160AFT/AXB: bottom boot block
Mode control
Compatible with JEDEC standard commands
Erase/Program cycles
10
5
cycles typ.
Access time
70 ns
(C
L
: 30 pF)
100 ns
(C
L
: 100 pF)
Power consumption
5
µA
(Standby)
30 mA
(Read operation)
15 mA
(Program/Erase operations)
Package
TC58FVT160/B160AFT:
TSOPI48-P-1220-0.50 (weight: 0.51 g)
TC58FVT160/B160AXB:
P-TFBGA48-0608-0.80AZ (weight: 0.090 g)
000630EBA1
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid
situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to
property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most
recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide
for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Toshiba products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed in this document
shall be made at the customer’s own risk.
The products described in this document are subject to the foreign exchange and foreign trade laws.
The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or
others.
The information contained herein is subject to change without notice.
2002-08-06 1/41

TC58FVB160AFT Related Products

TC58FVB160AFT TC58FVB160AXB TC58FVB160AXB-10 TC58FVB160AFT-70 TC58FVB160AFT-10
Description TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
Is it Rohs certified? - - incompatible incompatible incompatible
Parts packaging code - - BGA TSOP1 TSOP1
package instruction - - 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Contacts - - 48 48 48
Reach Compliance Code - - unknow unknow unknow
Maximum access time - - 100 ns 80 ns 100 ns
Spare memory width - - 8 8 8
JESD-30 code - - R-PBGA-B48 R-PDSO-G48 R-PDSO-G48
length - - 8 mm 18.4 mm 18.4 mm
memory density - - 16777216 bi 16777216 bi 16777216 bi
Memory IC Type - - FLASH FLASH FLASH
memory width - - 16 16 16
Number of functions - - 1 1 1
Number of terminals - - 48 48 48
word count - - 1048576 words 1048576 words 1048576 words
character code - - 1000000 1000000 1000000
Operating mode - - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature - - 85 °C 85 °C 85 °C
Minimum operating temperature - - -40 °C -40 °C -40 °C
organize - - 1MX16 1MX16 1MX16
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - TFBGA TSOP1 TSOP1
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial - - PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - - 240 240 NOT SPECIFIED
Programming voltage - - 3 V 3 V 3 V
Certification status - - Not Qualified Not Qualified Not Qualified
Maximum seat height - - 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) - - 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) - - 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) - - 3 V 3 V 3 V
surface mount - - YES YES YES
technology - - CMOS CMOS CMOS
Temperature level - - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - - BALL GULL WING GULL WING
Terminal pitch - - 0.8 mm 0.5 mm 0.5 mm
Terminal location - - BOTTOM DUAL DUAL
Maximum time at peak reflow temperature - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - - 6 mm 12 mm 12 mm
Base Number Matches - - 1 1 1

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