Changes to Product Overview Section .......................................... 1
Changes to Figure 1.......................................................................... 1
Changes to Electrical Characteristics Section .............................. 3
Changes to Absolute Maximum Ratings Section......................... 5
Changes to Pin Configuration and Function Description.......... 6
Changes to Typical Performance Characteristics Section........... 8
Changes to Applications Notes Section ....................................... 12
Changes to Figure 28, Typical Applications Circuit................... 16
Added Development Circuit Section ........................................... 17
Added Tap Point and Regulator Voltage Request Form............ 19
Changes to Ordering Guide .......................................................... 20
7/04—Revision 0: Initial Version
Rev. A | Page 2 of 20
ADD8707
ELECTRICAL CHARACTERISTICS
V
DD
= 16 V, T
A
@ +25
o
C, unless otherwise noted.
Table 1.
Parameter
GAMMA CURVE CHARACTERISTICS
Accuracy
Programming Resolution
Total Resistor String Value
BUFFER CHARACTERISTICS
OUTPUTS
Output Voltage Range (Ch12 to Ch7)
Output Voltage Range (Ch6 to Ch1)
Output vs. Load (Ch12, Ch11, Ch2, Ch1)
Output vs. Load (Ch10 to Ch3)
INPUTS
Offset Voltage
Offset Voltage Drift
Input Bias Current
Input Voltage Range (Ch12 to Ch7)
Input Voltage Range (Ch6 to Ch1)
V
COM
CHARACTERISTICS
Offset Voltage
Input Range
Peak Output Current
Continuous Output Current
Output vs. Load
BUFFER AND V
COM
DYNAMIC PERFORMANCE
Slew Rate
Bandwidth
Settling Time to 0.1%
Phase Margin
Power Supply Rejection Ratio
VOLTAGE REGULATOR
Programmable Range
Initial Regulator Accuracy
Dropout Voltage
Line Regulation
Load Regulation
Maximum Load Current
Feedback Reference Voltage
Feedback Input Bias Current
Symbol
R
ACC1
R
RES
R
TOTAL
Condition
Min
Typ
0.1
0.2
15
Max
0.4
Unit
%
%
kΩ
500 segments
V
OUT
V
OUT
∆V
OUT
∆V
OUT2
2
I
L
= 100
µA
I
L
= 100
µA
I
L
= 20 mA
I
L
= 5 mA
1.4
0
15
5
5
20
0.5
1.4
0
5
1.4
250
50
10
4
6
4.5
1.1
55
90
V
DD
V
DD
−
1.4
V
V
mV
mV
mV
µV/°C
µA
V
V
mV
V
mA
mA
mV
V/µs
MHz
µs
Degrees
dB
V
OS
∆V
OS
/∆T
I
B
V
IN
V
IN
V
OS
V
IN
I
PK
I
OUT
∆V
COM2
SR
BW
15
1.5
V
DD
V
DD
−
1.4
15
V
DD
−
1.4
−40°C
≤
T
A
≤
+105°C
−40°C
≤
T
A
≤
+105°C
I
L
= 30 mA
R
L
= 10 kΩ, CL = 200 pF
−3dB, R
L
= 10 kΩ, CL = 200 pF
1V step, R
L
= 10 kΩ, CL = 200 pF
R
L
= 10 kΩ, CL = 200 pF
V
DD
= 7 V to 17 V,
−40°C
≤
T
A
≤
+105°C
t
S
φ
o
PSRR
V
REG OUT
V
ACC
V
DO
REG
LINE
REG
LOAD
I
O
V
REF
I
B FB
68
5
No Load. V
REG OUT
= 14.4V
I
L
= 100
µA
I
L
= 5 mA
V
IN
= 8.5 V to 16.5 V, V
OUT
= 8V
I
O
= 100
µA
to 5 mA
−40°C
≤ T
A
≤ +105°C
−40°C
≤ T
A
≤ +105°C
0.4
100
310
0.01
0.02
5
−150
1.2
10
V
DD
−
0.6
1.5
150
350
0.20
0.10
150
V
%
mV
mV
%/V
%/mA
mA
V
nA
Rev. A | Page 3 of 20
ADD8707
Parameter
SYSTEM ACCURACY
Total Error
3, 4
POWER SUPPLY
Supply Voltage
Supply Current
Symbol
V
TOTAL ERROR
V
DD
I
SY
Condition
–40°C ≤ T
A
≤ +105°C
7.5
No load, –40°C ≤ T
A
≤ +105°C
8.3
Min
Typ
10
0.5
Max
3
16
15
Unit
%
V
mA
1
2
Gamma curve accuracy includes resistor matching and buffer errors, but excludes the regulator error.
∆V
COM
is the shift from the desired output voltage under the specified current load.
3
Total error is defined as the difference between the designed and actual output voltage divided by the actual regulator output voltage or full-scale voltage.
4
Total error includes regulator error, resistor string error, bias current effects, and buffer offset voltage.
Rev. A | Page 4 of 20
ADD8707
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage (V
DD
)
Input Voltage
Storage Temperature Range
Operating Temperature Range
1
Lead Temperature Range (Soldering 10 sec)
Junction Temperature
ESD Tolerance (HBM)
ESD Tolerance (MM)
Rating
18 V
−0.5
V to V
DD
−65°C
to +150°C
−40°C
to +105°C
300°C
150°C
±3000 V
±100 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 3. Thermal Resistance
Package Type
48-Lead LFCSP (CP)
θ
JA2
28.3
θ
JA3
47.7
Unit
°C/W
1
2
See the Applications Information section.
θ
JA
for exposed pad soldered to JEDEC 4-layer board.
3
θ
JA
for exposed pad not soldered down.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
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