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BD179G

Description
Phone Connectors Audio Jacks
CategoryDiscrete semiconductor    The transistor   
File Size95KB,4 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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BD179G Overview

Phone Connectors Audio Jacks

BD179G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
Parts packaging codeTO-225AA
package instructionROHS COMPLIANT, PLASTIC, CASE 77-09, TO-225, 3 PIN
Contacts3
Manufacturer packaging code77-09
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time1 week
Maximum collector current (IC)3 A
Collector-emitter maximum voltage80 V
ConfigurationSINGLE
Minimum DC current gain (hFE)15
JEDEC-95 codeTO-225AA
JESD-30 codeR-PSFM-T3
JESD-609 codee3
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)260
Polarity/channel typeNPN
Maximum power dissipation(Abs)30 W
Certification statusNot Qualified
surface mountNO
Terminal surfaceTin (Sn)
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperature40
transistor applicationsAMPLIFIER
Transistor component materialsSILICON
Nominal transition frequency (fT)3 MHz
Base Number Matches1
BD179G
Plastic Medium-Power
Silicon NPN Transistor
This device is designed for use in 5.0 to 10 Watt audio amplifiers
and drivers utilizing complementary or quasi complementary circuits.
Features
http://onsemi.com
High DC Current Gain
BD179 is complementary with BD180
These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current
Base Current
Total Power Dissipation
@ T
C
= 25_C
Derate above 25_C
Operating and Storage Junction
Temperature Range
Symbol
V
CEO
V
CBO
V
EBO
I
C
I
B
P
D
Value
80
80
5.0
3.0
1.0
30
240
–65 to +150
Unit
Vdc
Vdc
Vdc
Adc
Adc
W
mW/_C
_C
3.0 AMPERES
POWER TRANSISTORS
NPN SILICON
80 VOLTS, 30 WATTS
COLLECTOR
2
3
BASE
1
EMITTER
T
J
, T
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Symbol
R
qJC
Max
4.16
Unit
_C/W
3 2
1
TO−225
CASE 77
STYLE 1
MARKING DIAGRAM
YWW
BD179G
Y
WW
BD179
G
= Year
= Work Week
= Device Code
= Pb−Free Package
ORDERING INFORMATION
Device
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
BD179G
Package
TO−225
(Pb−Free)
Shipping
500 Units/Box
©
Semiconductor Components Industries, LLC, 2013
Noember, 2013
Rev. 15
1
Publication Order Number:
BD179/D
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