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MMSZ5267B-E3-08

Description
Bluetooth / 802.15.1 Modules BGM121 BLE SIP MOD. 8 dBm TX w/Antenna
CategoryDiscrete semiconductor    diode   
File Size96KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
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MMSZ5267B-E3-08 Overview

Bluetooth / 802.15.1 Modules BGM121 BLE SIP MOD. 8 dBm TX w/Antenna

MMSZ5267B-E3-08 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
package instructionR-PDSO-G2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time10 weeks
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance270 Ω
JESD-30 codeR-PDSO-G2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Nominal reference voltage75 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current1.7 mA
MMSZ5225 to MMSZ5267
www.vishay.com
Vishay Semiconductors
Small Signal Zener Diodes
FEATURES
• Silicon planar Zener diodes
• Standard Zener voltage tolerance is ± 5 %
with a “B” suffix (e.g.: MMSZ5225B), suffix “C”
is ± 2 % tolerance
• AEC-Q101 qualified available
• ESD capability according to AEC-Q101:
Human body model > 8 kV
Machine model > 800 V
Available
PRIMARY CHARACTERISTICS
PARAMETER
V
Z
range nom.
Test current I
ZT
V
Z
specification
Int. construction
VALUE
3.3 to 75
1.7 to 20
Thermal equilibrium
Single
UNIT
V
mA
• Base P/N-E3 - RoHS-compliant, commercial grade
• Base P/N-HE3 - RoHS-compliant, AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
MMSZ5225B-E3-08 to MMSZ5267B-E3-08
MMSZ5225C-E3-08 to MMSZ5267C-E3-08
3000 (8 mm tape on 7" reel)
MMSZ5225B-HE3-08 to MMSZ5267B-HE3-08
MMSZ5225 to
MMSZ5267
MMSZ5225C-HE3-08 to MMSZ5267C-HE3-08
MMSZ5225B-E3-18 to MMSZ5267B-E3-18
MMSZ5225C-E3-18 to MMSZ5267C-E3-18
10 000 (8 mm tape on 13" reel)
MMSZ5225B-HE3-18 to MMSZ5267B-HE3-18
MMSZ5225C-HE3-18 to MMSZ5267C-HE3-18
10 000/box
15 000/box
TAPED UNITS PER REEL
MINIMUM ORDER QUANTITY
PACKAGE
PACKAGE NAME
SOD-123
WEIGHT
10.3 mg
MOLDING COMPOUND
FLAMMABILITY RATING
UL 94 V-0
MOISTURE SENSITIVITY
LEVEL
MSL level 1
(according J-STD-020)
SOLDERING CONDITIONS
260 °C/10 s at terminals
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Power dissipation
Zener current
Thermal resistance junction to ambient air
Junction temperature
Storage temperature range
Operating temperature range
TEST CONDITION
T
L
= 75 °C, on FR - 4 or FR - 5 board with
minimum recommended solder pad layout
See table “Electrical Characteristics”
On FR - 4 or FR - 5
board
with minimum
recommended solder pad layout
R
thJA
T
j
T
stg
T
op
340
150
-65 to +150
-55 to +150
°C
K/W
SYMBOL
P
tot
VALUE
500
UNIT
mW
Rev. 2.0, 08-Nov-16
Document Number: 85774
1
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
11
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