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M29W160EB70N6T

Description
Flash Memory STD FLASH
Categorystorage    storage   
File Size250KB,40 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
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M29W160EB70N6T Overview

Flash Memory STD FLASH

M29W160EB70N6T Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSTMicroelectronics
Parts packaging codeTSOP
package instruction12 X 20 MM, PLASTIC, TSOP-48
Contacts48
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time70 ns
Other featuresBOTTOM BOOT BLOCK
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G48
JESD-609 codee0
length18.4 mm
memory density16777216 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size1,2,1,31
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size16K,8K,32K,64K
Maximum standby current0.0001 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
switch bitYES
typeNOR TYPE
width12 mm
Base Number Matches1
M29W160ET
M29W160EB
16 Mbit (2Mb x8 or 1Mb x16, Boot Block)
3V Supply Flash Memory
FEATURES SUMMARY
SUPPLY VOLTAGE
– V
CC
= 2.7V to 3.6V for Program, Erase
and Read
ACCESS TIMES: 70, 90ns
PROGRAMMING TIME
– 10µs per Byte/Word typical
35 MEMORY BLOCKS
– 1 Boot Block (Top or Bottom Location)
– 2 Parameter and 32 Main Blocks
PROGRAM/ERASE CONTROLLER
– Embedded Byte/Word Program
algorithms
ERASE SUSPEND and RESUME MODES
– Read and Program another Block during
Erase Suspend
UNLOCK BYPASS PROGRAM COMMAND
– Faster Production/Batch Programming
TEMPORARY BLOCK UNPROTECTION
MODE
COMMON FLASH INTERFACE
– 64 bit Security Code
LOW POWER CONSUMPTION
– Standby and Automatic Standby
100,000 PROGRAM/ERASE CYCLES per
BLOCK
ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h
– Top Device Code M29W160ET: 22C4h
– Bottom Device Code M29W160EB: 2249h
Figure 1. Packages
TSOP48 (N)
12 x 20mm
FBGA
TFBGA48 (ZA)
6 x 8mm
January 2004
1/40

M29W160EB70N6T Related Products

M29W160EB70N6T M29W160EB70ZA6F
Description Flash Memory STD FLASH Flash Memory STD FLASH
Is it Rohs certified? conform to conform to
Maker STMicroelectronics STMicroelectronics
Parts packaging code TSOP BGA
package instruction 12 X 20 MM, PLASTIC, TSOP-48 6 X 8 MM, 0.80 MM PITCH, TFBGA-48
Contacts 48 48
Reach Compliance Code compliant unknown
ECCN code EAR99 EAR99
Maximum access time 70 ns 70 ns
Other features BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK
Spare memory width 8 8
startup block BOTTOM BOTTOM
command user interface YES YES
Universal Flash Interface YES YES
Data polling YES YES
JESD-30 code R-PDSO-G48 R-PBGA-B48
JESD-609 code e0 e1
length 18.4 mm 8 mm
memory density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
memory width 16 16
Number of functions 1 1
Number of departments/size 1,2,1,31 1,2,1,31
Number of terminals 48 48
word count 1048576 words 1048576 words
character code 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 1MX16 1MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TFBGA
Encapsulate equivalent code TSSOP48,.8,20 BGA48,6X8,32
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
power supply 3/3.3 V 3/3.3 V
Programming voltage 3 V 3 V
Certification status Not Qualified Not Qualified
ready/busy YES YES
Maximum seat height 1.2 mm 1.2 mm
Department size 16K,8K,32K,64K 16K,8K,32K,64K
Maximum standby current 0.0001 A 0.0001 A
Maximum slew rate 0.02 mA 0.02 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form GULL WING BALL
Terminal pitch 0.5 mm 0.8 mm
Terminal location DUAL BOTTOM
switch bit YES YES
type NOR TYPE NOR TYPE
width 12 mm 6 mm
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