SN74AUP1G125DBVR datasheet, PDF

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SN74AUP1G125DBVR: DescriptionBuffer/Line Driver 1-CH Non-Inverting 3-ST CMOS 5-Pin SOT-23 T/R; CategoryBuffer and line drives; File Size3MB，50 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74AUP1G125DBVR Overview

Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS 5-Pin SOT-23 T/R

SN74AUP1G125DBVR Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.39.00.01
SVHC	Yes
Logic Family	AUP
Logic Function	Buffer/Line Driver
Number of Elements per Chip	1
Number of Channels per Chip	1
Number of Inputs per Chip	1
Number of Input Enables per Chip	0
Number of Outputs per Chip	1
Number of Output Enables per Chip	1 Low
Bus Hold	No
Polarity	Non-Inverting
Maximum Propagation Delay Time @ Maximum CL (ns)	18.7@1.2V\|12.5@1.5V\|10.1@1.8V\|7.2@2.5V\|6@3.3V
Absolute Propagation Delay Time (ns)	25.5
Process Technology	CMOS
Input Signal Type	Single-Ended
Output Type	3-State
Maximum Low Level Output Current (mA)	4
Maximum High Level Output Current (mA)	-4
Minimum Operating Supply Voltage (V)	0.8
Typical Operating Supply Voltage (V)	1.8\|2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Tolerant I/Os (V)	3.6
Maximum Quiescent Current (uA)	0.5
Propagation Delay Test Condition (pF)	30
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Packaging	Tape and Reel
Standard Package Name	SOT
Pin Count	5
Supplier Package	SOT-23
Mounting	Surface Mount
Package Height	1.1
Package Length	3.05(Max)
Package Width	1.75(Max)
PCB changed	5
Lead Shape	Gull-wing

SN74AUP1G125DBVR Related Products

	SN74AUP1G125DBVR	SN74AUP1G125YZPR	SN74AUP1G125YZTR	SN74AUP1G125DRLR
Description	Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS 5-Pin SOT-23 T/R	Low-Power Single Bus Buffer Gate with 3-State Output 5-DSBGA -40 to 85	Low-Power Single Bus Buffer Gate with 3-State Output 5-DSBGA -40 to 85	Low-Power Single Bus Buffer Gate with 3-State Output 5-SOT-5X3 -40 to 85
Brand Name	-	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	-	conform to	conform to	conform to
Parts packaging code	-	BGA	BGA	SOT
package instruction	-	DSBGA-5	DSBGA-5	VSOF, FL6,.047,20
Contacts	-	5	5	5
Reach Compliance Code	-	compliant	compliant	compliant
ECCN code	-	EAR99	EAR99	EAR99
Factory Lead Time	-	1 week	1 week	1 week
Control type	-	ENABLE LOW	ENABLE LOW	ENABLE LOW
series	-	AUP/ULP/V	AUP/ULP/V	AUP/ULP/V
JESD-30 code	-	R-XBGA-B5	R-XBGA-B5	R-PDSO-F5
JESD-609 code	-	e1	e1	e4
length	-	1.4 mm	1.4 mm	1.6 mm
Load capacitance (CL)	-	30 pF	30 pF	30 pF
Logic integrated circuit type	-	BUS DRIVER	BUS DRIVER	BUS DRIVER
MaximumI(ol)	-	0.004 A	0.0017 A	0.004 A
Humidity sensitivity level	-	1	1	1
Number of digits	-	1	1	1
Number of functions	-	1	1	1
Number of ports	-	2	2	2
Number of terminals	-	5	5	5
Maximum operating temperature	-	85 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-40 °C	-40 °C
Output characteristics	-	3-STATE	3-STATE	3-STATE
Output polarity	-	TRUE	TRUE	TRUE
Package body material	-	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	-	VFBGA	VFBGA	VSOF
Encapsulate equivalent code	-	BGA5,2X3,20	BGA5,2X3,20	FL6,.047,20
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, VERY THIN PROFILE
method of packing	-	TR	TAPE AND REEL	TR
Peak Reflow Temperature (Celsius)	-	260	260	260
power supply	-	1.2/3.3 V	1.2/3.3 V	1.2/3.3 V
Prop。Delay @ Nom-Sup	-	21.4 ns	21.4 ns	21.4 ns
propagation delay (tpd)	-	21.4 ns	21.4 ns	21.4 ns
Certification status	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	0.5 mm	0.625 mm	0.6 mm
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	0.8 V	0.8 V	0.8 V
Nominal supply voltage (Vsup)	-	1.2 V	1.2 V	1.2 V
surface mount	-	YES	YES	YES
technology	-	CMOS	CMOS	CMOS
Temperature level	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	-	BALL	BALL	FLAT
Terminal pitch	-	0.5 mm	0.5 mm	0.5 mm
Terminal location	-	BOTTOM	BOTTOM	DUAL
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	0.9 mm	0.9 mm	1.2 mm

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