EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AA-02-2371-D

Description
Resistor Networks u0026 Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-B0202AA-02-2371-D Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AA-02-2371-D - - View Buy Now

WBC-B0202AA-02-2371-D Overview

Resistor Networks u0026 Arrays

WBC-B0202AA-02-2371-D Parametric

Parameter NameAttribute value
Product CategoryResistor Networks & Arrays
ManufacturerTT Electronics plc
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
PCB engineer classification basis
Job position: Entry-level PCB engineer Competency requirements: 1. Able to make simple packages, such as DIP10, etc.; 2. Master the basic operation of at least one PCB design software, and be able to ...
yuandayuan6999 PCB Design
EEWORLD website system upgrade announcement
[font=微软雅黑][size=4] Dear EEWORLD netizens: Hello everyone! In order to provide you with better service and improve the user experience of the website, EEWORLD will carry out system maintenance and upg...
EEWORLD社区 Suggestions & Announcements
PIC microcontroller learning and communication in progress
I am a beginner of PIC16F877A microcontroller. I have learned 51 before. Can you please give me some advice? Also, if anyone has the PIC8.05 version of the compiler, please send it to me. Thank you in...
飓风狂飙 Microchip MCU
ZIGBEE AD conversion chip temperature learning summary
/* This program explains AD control (on-chip thermometer) Lecturer Wang Jiahui*/ #include #include"stdio.h" #define uchar unsigned char #define uint unsigned int void init_UART0(void)/*Initialize the ...
王加辉 RF/Wirelessly
Cortex-M3 Definitive Guide Cn
Chinese version of the information. Study[[i] This post was last edited by wuxiujiang on 2010-3-1 11:01 [/i]]...
wuxiujiang Embedded System
Problems in debugging DSP5509A EMIF_SDRAM
[i=s] This post was last edited by YXQWXN on 2014-5-1 17:47 [/i] [b][color=Red] I have recently learned EMIF_SDRAM. Although I have succeeded, the problems that have arisen are difficult for me to und...
YXQWXN Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2843  174  889  1264  2617  58  4  18  26  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号