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MLG0603Q3N8ST

Description
Fixed Inductors Multilayer chip inductor for High Frequency
CategoryPassive components    inductor   
File Size82KB,6 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
Environmental Compliance
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MLG0603Q3N8ST Overview

Fixed Inductors Multilayer chip inductor for High Frequency

MLG0603Q3N8ST Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerTDK Corporation
package instruction0603
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes0603
core materialCERAMIC
DC Resistance0.4 Ω
Nominal inductance(L)0.0038 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee3
Number of functions1
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Minimum quality factor (at nominal inductance)5
Maximum rated current0.3 A
self resonant frequency5800 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
special characteristicsINDUCTANCE TOLERANCE IS 0.3 NANO HENRY
surface mountYES
Terminal surfaceMatte Tin (Sn)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency100 MHz
Tolerance7.895%
(1/5)
SMD Inductors(Coils)
For High Frequency(Multilayer)
MLG Series MLG0603Q Type
FEATURES
• It serializes a product of inductance 0.2 to100nH. In a product of
0.2 to 4.0nH, it realizes line up in a 0.1nH steps.
• By the most suitable design, Q is higher than competing in a
conventional product MLG0603S type. In particular, Q in more
than 800MHz largely improved.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
0.6±0.03
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLG 0603 Q 2N2 S T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions
0603
0.6× 0.3mm (L× W)
(3) Material code
(4) Inductance value
2N2
12N
2.2nH
12nH
(5) Inductance tolerance
B
C
S
H
J
±0.1nH
±0.2nH
±0.3nH
±3%
±5%
0.3±0.03
(6) Packaging style
T
0.06±0.04
Taping (reel)
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C
0.3±0.03
Weight: 0.2mg
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
15000 pieces/reel
0.15±0.05
Dimensions in mm
RECOMMENDED PC BOARD PATTERN
0.25
0.3
0.25
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
0.3
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
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