OM
PL
IA
N
Features
n
0805 size
n
Available in E12 series
n
High Q up to 80 typ.
n
High operating temperature of 125 °C
n
Small size of only 2.0 mm
F
RE
E
Applications
n
Mobile phones
n
Cellular phones
n
CTV, VCR, HIC, FDD
*R
oH
S
C
T
n
RoHS compliant*
LE
AD
CW201212 Series - High Q Chip Inductors
General Specifications
Test Freq.
(MHz)
Q
SRF
(MHz)
Min.
RDC
(Ohms)
Max.
I rms
(mA)
Max.
Electrical Specifications
Bourns
®
Part No.
Inductance
nH
Tol.
%
Q
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Min.
L
CW201212-2N2J
CW201212-2N7J
CW201212-2N8J
CW201212-3N3J
CW201212-3N9J
CW201212-4N7J
CW201212-5N6J
CW201212-6N8J
CW201212-8N2J
CW201212-10NJ
CW201212-12NJ
CW201212-15NJ
CW201212-18NJ
CW201212-22NJ
CW201212-27NJ
CW201212-33NJ
CW201212-39NJ
CW201212-47NJ
CW201212-56NJ
CW201212-68NJ
CW201212-82NJ
CW201212-R10J
CW201212-R12J
CW201212-R15J
CW201212-R18J
CW201212-R22J
CW201212-R27J
CW201212-R33J
CW201212-R39J
CW201212-R47J
CW201212-R56J
CW201212-R68J
CW201212-R82J
CW201212-R91J
2.2
2.7
2.8
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
910
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
50
35
32
30
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
50
50
50
50
45
45
45
33
23
23
23
22
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
150
150
150
100
100
100
100
100
100
250
50
25
25
22
1000
1000
1000
1500
1000
1000
1000
1000
1000
500
500
500
500
500
500
500
500
500
500
500
500
500
250
250
250
250
250
250
250
100
50
50
50
50
6000
6000
6000
6000
6000
5800
5800
5800
5500
4800
4100
3600
3400
3300
2600
2400
2100
1700
1600
1450
1350
1200
1100
950
900
860
850
800
780
375
340
270
230
220
0.06
0.08
0.06
0.08
0.06
0.06
0.08
0.06
0.06
0.08
0.08
0.08
0.08
0.10
0.12
0.15
0.18
0.15
0.25
0.27
0.32
0.43
0.48
0.67
0.85
1.10
1.46
1.65
2.20
1.72
1.90
2.05
2.30
2.50
600
600
800
600
600
600
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
400
400
400
350
300
250
200
170
250
230
190
180
150
Temperature Rise
.................40 °C max. at rated current
Operating Temperature
................................-40 °C to +125 °C
Storage Temperature
................................-40 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
............................ +260 °C, 5 seconds
Materials
Core Material
-2N2J through -R39J ..............Ceramic
-R47J through -R91J .................Ferrite
Wire ........ Enameled copper (1W1E180)
Terminal ...........................Mo/Mn+Ni+Au
Packaging ................. 2,000 pcs. per reel
Product Dimensions
0.5
(.020)
1.3 ± 0.2
(.051 ± .008)
2.1 ± 0.2
(.083 ± .008)
1.5 ± 0.2
(.059 ± .008)
0.5
(.020)
0.5
(.020)
Recommended Layout
REF.
1.02
(.040)
1.02
REF.
(.040)
Note: 2 % tolerance available for inductance ranges of 12 nH and above.
Replace “J” with “G”.
REF.
0.76
(.030)
1.78
REF.
(.070)
DIMENSIONS:
MM
(INCHES)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CW201212 Series - High Q Chip Inductors
Soldering Profile
Temperature
Rising Area
+4.0 °C / sec. max.
Preheat Area
150~200 °C / 60~120 sec.
Reflow Area
+2.0~4.0 °C /
sec. max.
Forced Cooling Area
-(1.0~5.0) °C / sec. max.
250
230 °C
50 sec. max.
70 sec. max.
Temperature (°C)
200
150
100
50
Peak Temperature:
260 °C max.
Time Above 230 °C:
50 sec. max.
Time Above 200 °C:
70 sec. max.
0
50
100
150
200
250
Time (Seconds)
Packaging Specifications
178.0
(7.00)
DIA.
178.0
(7.00)
DIA.
2.0 ± 0.5
(.079 ± .020)
2.0
±
0.5
(.079
±
.020)
12.5
(.492)
12.5
(.492)
21.0 ± 0.8
(.827 ± .031)
21.0
±
0.8
(.827
±
.031)
13.0 ± 0.5
(.512 ± .020)
13.0
±
0.5
(.512
±
.020)
DIA.
DIA.
50.0
(1.969)
50.0
(1.969)
THICKNESS
0.10
(.004)
MAX.
EMBOSSED
CAVITY
13.0 ± 0.5
DIA.
(.512 ± .020)
13.0
±
0.5 DIA.
(.512
±
.020)
10.0
(.393)
EMBOSSED
CARRIER
10.0
(.393)
8.0
(.315)
DIMENSIONS:
MM
(INCHES)
REV. 01/17
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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