HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6415
Issued Date : 1992.11.25
Revised Date : 2002.02.05
Page No. : 1/4
HBC337
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBC337 is designed for driver and output-stage of audio
amplifiers.
Features
•
High DC Current Gain: 100-600 at IC=100mA,VCE=1V
•
Complementary to HBC327
TO-92
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature .................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 625 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ......................................................................................... 50 V
VCEO Collector to Emitter Voltage ...................................................................................... 45 V
VEBO Emitter to Base Voltage .............................................................................................. 5 V
IC Collector Current ....................................................................................................... 800 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
*VCE(sat)
VBE(on)
*hFE1
*hFE2
fT
Cob
Min.
50
45
5
-
-
-
100
40
-
-
Typ.
-
-
-
-
-
-
-
-
210
4
Max.
-
-
-
100
0.7
1.2
600
-
-
-
Unit
V
V
V
nA
V
V
Test Conditions
IC=100uA, IE=0
IC=10mA, IB=0
IE=10uA, IC=0
VCB=45V, IE=0
IB=500mA, IB=50mA
IC=300mA, VCE=1V
VCE=1V, IC=100mA
VCE=1V, IC=300mA
VCE=5V, IC=10mA, f=100MHZ
VCB=10V, IE=0, f=1MHZ
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
MHZ
pF
Classification of hFE1
Rank
Range
16
100-250
25
160-400
40
250-600
HBC337
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
125 C
o
Spec. No. : HE6415
Issued Date : 1992.11.25
Revised Date : 2002.02.05
Page No. : 2/4
Saturation Voltage & Collector Current
1000
V
CE(s at)
@ I
C
=10I
B
25 C
o
75 C
o
100
Saturation Voltage (mV)
hFE
100
75 C
o
125 C
o
o
hFE @ V
CE
=1V
10
1
10
100
1000
10
0.1
1
25 C
10
100
1000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
ON Voltage & Collector Current
1000
Capacitance & Reverse-Biased Voltage
100
25 C
o
75 C
125 C
o
o
Capacitance (pF)
ON Voltage (mV)
10
Cob
V
BE(ON)
@ V
CE
=1V
100
0.1
1
10
100
1000
1
0.1
1
10
100
Collector Current-I
C
(mA)
Reverse-Biased Voltage (V)
Cutoff Frequency & Collector Current
1000
10000
Safe Operating Area
PT=1ms
PT=100ms
Cutoff Frequency (MHz)
..
.
Collector Current-I
C
(mA)
1000
PT=1s
V
CE
=5V
100
100
10
10
1
10
100
1000
1
1
10
100
Collector Current (mA)
Forward Voltage-V
CE
(V)
HBC337
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6415
Issued Date : 1992.11.25
Revised Date : 2002.02.05
Page No. : 3/4
PD-Ta
700
600
Power Dissipation-PD (mW)
500
400
300
200
100
0
0
50
100
o
150
200
Ambient Temperature-Ta ( C)
HBC337
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1
2
3
Date Code
Spec. No. : HE6415
Issued Date : 1992.11.25
Revised Date : 2002.02.05
Page No. : 4/4
α
2
Marking:
H
BC
3 3 7
Control Code
α
3
C
Style: Pin 1.Collector 2.Base 3.Emitter
D
H
I
E
F
G
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code: A
*: Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*
0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*
1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*
0.1000
-
*
0.0500
-
*
5°
-
*
2°
-
*
2°
Millimeters
Min.
Max.
0.36
0.56
-
*
2.54
-
*
1.27
-
*
5°
-
*
2°
-
*
2°
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC337
HSMC Product Specification
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