SN54LS170FK datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> SN54LS170FK

SN54LS170FK: DescriptionStandard SRAM, 4X4, 40ns, CMOS, CQCC20,; Categorystorage storage; File Size911KB，11 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

Download Datasheet Parametric Compare View All

SN54LS170FK Overview

Standard SRAM, 4X4, 40ns, CMOS, CQCC20,

SN54LS170FK Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
package instruction	QCCN,
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	40 ns
JESD-30 code	S-CQCC-N20
JESD-609 code	e0
length	8.89 mm
memory density	16 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	20
word count	4 words
character code	4
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	4X4
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.03 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.89 mm
Base Number Matches	1

Preview

Download Datasheet

View All

D ts e t

aa h e

R c e t r lc r nc

o h se Ee to is

Ma u a t r dCo o e t

n fc u e

mp n n s

R c e tr b a d d c mp n ns ae

o h se rn e

o oet r

ma ua trd u ig ete dewaes

n fcue sn i r i/ fr

p rh s d f m te oiia s p l r

uc a e r

o h r n l u pi s

o R c e tr waes rce td f m

r o h se

fr e rae r

te oiia I. Al rce t n ae

r nl P

l e rai s r

d n wi tea p o a o teOC

o e t h p rv l f h

P r aetse u igoiia fcoy

at r e td sn r n la tr

ts p o rmso R c e tr e eo e

e t rga

r o h se d v lp d

ts s lt n t g aa te p o u t

e t oui s o u rne

rd c

me t o e c e teOC d t s e t

es r x e d h

M aa h e.

Qu l yOv riw

e ve

• IO- 0 1

S 90

•A 92 cr ct n

S 1 0 et ai

• Qu l e Ma ua trr Ls (

ai d

n fcues it QML MI- R -

) LP F

385

•C a sQ Mitr

lay

•C a sVS a eL v l

p c ee

• Qu l e S p l r Ls o D sr uos( L )

ai d u pi s it f it b tr QS D

•R c e trsacic l u pir oD A a d

o h se i

r ia s p l t L n

me t aln u t a dD A sa d r s

es lid sr n L tn ad .

R c e tr lcrnc , L i c mmi e t

o h se Ee t is L C s o

tdo

s p ligp o u t ta s t f c so r x e t-

u pyn rd cs h t ai y u tme e p ca

t n fr u lya daee u loto eoiial

i s o q ai n r q a t h s r n l

s p l db id sr ma ua trr.

u pi

e yn ut

y n fcues

T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e

h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c

a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n

n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -

isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -

c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a

t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g

i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu

r xmu ai s

ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig

y e a e n rd c c aa tr t , e in smuai , r a l e t .

z o

0 3 ohs E cr i , L . lRg s eevd 7 1 0 3

e e oc

T l r m r, l s v iw wrcl . m

o e n oe p ae it w . e c o

o ec

SN54LS170FK Related Products

	SN54LS170FK	SN54LS170W	SNJ54LS170FK	SN54170J	SN54170W	SNJ54170J	SNJ54170W
Description	Standard SRAM, 4X4, 40ns, CMOS, CQCC20,	Standard SRAM, 4X4, 40ns, CMOS, CDFP16,	Standard SRAM, 4X4, CMOS, CQCC20	Standard SRAM, 4X4, 40ns, CMOS, CDIP16,	Standard SRAM, 4X4, 40ns, CMOS, CDFP16,	Standard SRAM, 4X4, CMOS, CDIP16,	Standard SRAM, 4X4, CMOS, CDFP16
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
JESD-30 code	S-CQCC-N20	R-CDFP-F16	S-CQCC-N20	R-CDIP-T16	R-CDFP-F16	R-CDIP-T16	R-CDFP-F16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	8.89 mm	10.2 mm	8.89 mm	19.56 mm	10.2 mm	19.56 mm	10.2 mm
memory density	16 bit	16 bit	16 bit	16 bit	16 bit	16 bit	16 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1
Number of terminals	20	16	20	16	16	16	16
word count	4 words	4 words	4 words	4 words	4 words	4 words	4 words
character code	4	4	4	4	4	4	4
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	4X4	4X4	4X4	4X4	4X4	4X4	4X4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	DFP	QCCN	DIP	DFP	DIP	DFP
Package shape	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	CHIP CARRIER	IN-LINE	FLATPACK	IN-LINE	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.03 mm	2.03 mm	2.03 mm	5.08 mm	2.03 mm	5.08 mm	2.03 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	FLAT	NO LEAD	THROUGH-HOLE	FLAT	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8.89 mm	6.73 mm	8.89 mm	7.62 mm	6.73 mm	7.62 mm	6.73 mm
package instruction	QCCN,	DFP,	-	DIP,	DFP,	DIP,	DFP,
Maximum access time	40 ns	40 ns	-	40 ns	40 ns	-	-
Base Number Matches	1	1	1	1	1	-	-

Recommended Resources

Zero-crossing trigger circuit design based on thyristor

Inverter power circuit

μPC1473/HA (VCR and TV) infrared remote control receiving preamplifier circuit

SIM card data line protection circuit diagram

Electromechanical control push-pull power amplifier circuit

AD7711 LC²MOS signal conditioning ADC circuit with RTD current source

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components