SN54LS170W datasheet, PDF - EEWORLD Datasheet

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SN54LS170W: DescriptionStandard SRAM, 4X4, 40ns, CMOS, CDFP16,; Categorystorage storage; File Size911KB，11 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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SN54LS170W Overview

Standard SRAM, 4X4, 40ns, CMOS, CDFP16,

SN54LS170W Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
package instruction	DFP,
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	40 ns
JESD-30 code	R-CDFP-F16
JESD-609 code	e0
length	10.2 mm
memory density	16 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	16
word count	4 words
character code	4
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	4X4
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.03 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6.73 mm
Base Number Matches	1

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SN54LS170W Related Products

	SN54LS170W	SNJ54LS170FK	SN54170J	SN54LS170FK	SN54170W	SNJ54170J	SNJ54170W
Description	Standard SRAM, 4X4, 40ns, CMOS, CDFP16,	Standard SRAM, 4X4, CMOS, CQCC20	Standard SRAM, 4X4, 40ns, CMOS, CDIP16,	Standard SRAM, 4X4, 40ns, CMOS, CQCC20,	Standard SRAM, 4X4, 40ns, CMOS, CDFP16,	Standard SRAM, 4X4, CMOS, CDIP16,	Standard SRAM, 4X4, CMOS, CDFP16
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
JESD-30 code	R-CDFP-F16	S-CQCC-N20	R-CDIP-T16	S-CQCC-N20	R-CDFP-F16	R-CDIP-T16	R-CDFP-F16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	10.2 mm	8.89 mm	19.56 mm	8.89 mm	10.2 mm	19.56 mm	10.2 mm
memory density	16 bit	16 bit	16 bit	16 bit	16 bit	16 bit	16 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1
Number of terminals	16	20	16	20	16	16	16
word count	4 words	4 words	4 words	4 words	4 words	4 words	4 words
character code	4	4	4	4	4	4	4
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	4X4	4X4	4X4	4X4	4X4	4X4	4X4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP	QCCN	DIP	QCCN	DFP	DIP	DFP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	IN-LINE	CHIP CARRIER	FLATPACK	IN-LINE	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.03 mm	2.03 mm	5.08 mm	2.03 mm	2.03 mm	5.08 mm	2.03 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	Tin/Lead (Sn/Pb)
Terminal form	FLAT	NO LEAD	THROUGH-HOLE	NO LEAD	FLAT	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	6.73 mm	8.89 mm	7.62 mm	8.89 mm	6.73 mm	7.62 mm	6.73 mm
package instruction	DFP,	-	DIP,	QCCN,	DFP,	DIP,	DFP,
Maximum access time	40 ns	-	40 ns	40 ns	40 ns	-	-
Base Number Matches	1	1	1	1	1	-	-

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