A42MX09-2PQG100 datasheet, PDF

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A42MX09-2PQG100: DescriptionDevelopment Software; CategoryProgrammable logic devices Programmable logic; File Size5MB，82 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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A42MX09-2PQG100 Overview

Development Software

A42MX09-2PQG100 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	QFP,
Reach Compliance Code	compliant
Other features	ALSO OPERATES AT 5V SUPPLY
maximum clock frequency	146 MHz
Combined latency of CLB-Max	1.8 ns
JESD-30 code	R-PQFP-G100
JESD-609 code	e3
length	20 mm
Humidity sensitivity level	3
Configurable number of logic blocks	684
Equivalent number of gates	14000
Number of terminals	100
Maximum operating temperature	70 °C
Minimum operating temperature
organize	684 CLBS, 14000 GATES
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	245
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum seat height	3.4 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	14 mm
Base Number Matches	1

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Revision 3

40MX and 42MX Automotive FPGA Families

Features

High Capacity

•

Single-Chip

Applications

ASIC

Alternative

for

Automotive

3,000 to 54,000 System Gates

Up to 2.5 kbits Configurable Dual-Port SRAM

Fast Wide-Decode Circuitry

Up to 202 User-Programmable I/O Pins

•

Ease of Integration

•

Up to 100% Resource Utilization and 100% Pin Locking

Deterministic, User-Controllable Timing

Unique In-System Diagnostic and Verification Capability

with Silicon Explorer II

Low Power Consumption

IEEE Standard 1149.1 (JTAG) Boundary Scan Testing

Product Profile

Device

Capacity

System Gates

SRAM Bits

Logic Modules

Sequential

Combinatorial

Decode

SRAM Modules

(64x4 or 32x8)

Dedicated Flip-Flops

Maximum Flip-Flops

Clocks

Maximum User I/Os

Boundary Scan Test (BST)

Packages (by pin count)

PLCC

PQFP

VQFP

TQFP

A40MX02

3,000

–

295

–

147

–

PL68

PQ100

VQ80

–

A40MX04

6,000

–

547

–

273

–

PL84

PQ100

VQ80

–

A42MX09

14,000

–

348

336

–

348

516

104

–

PL84

PQ100,

PQ160

VQ100

TQ176

A42MX16

24,000

–

624

608

–

624

928

140

–

PL208

PQ100

VQ176

A42MX24

36,000

–

954

912

–

954

1,410

176

Yes

–

PQ160,

PQ208

–

TQ176

A42MX36

54,000

2,560

1,230

1,184

1,230

1,822

202

Yes

–

PQ208,

PQ240

–

Note:

While the automotive-grade MX devices are offered in standard speed grade only, the MX family is also offered in commercial,

industrial and military temperature grades with -F, Std, -1, -2 and -3 speed grades. Refer to the

40MX and 42MX Family

FPGAs

datasheet for more details.

May 2012

40MX and 42MX Automotive FPGA Families

Table of Contents

40MX and 42MX Automotive FPGA Families

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

MX Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Other Architectural Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

Development Tool Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12

5.0 V Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17

Timing Information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18

Parameter Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21

Sequential Timing Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22

Predictable Performance: Tight Delay Distributions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28

Temperature and Voltage Derating Factors

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-29

Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-31

Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-47

Package Pin Assignments

PL68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

PL84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

PQ100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5

PQ160 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8

VQ80 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

PQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13

PQ240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17

VQ100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20

TQ176 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2

Revision 3

iii

1 – 40MX and 42MX Automotive FPGA Families

General Description

Microsemi’s automotive-grade MX families provide a high-performance, single-chip solution for

shortening the system design and development cycle, offering a cost-effective alternative to ASICs for in-

cabin telematics and automobile interconnect applications. The 40MX and 42MX devices are excellent

choices for integrating logic that is currently implemented in multiple PALs, CPLDs, and FPGAs.

The MX device architecture is based on Microsemi’s patented antifuse technology implemented in a

0.45µm triple-metal CMOS process. With capacities ranging from 3,000 to 54,000 system gates, the MX

devices are live on power-up and have one-fifth the standby power consumption of comparable FPGAs.

MX FPGAs provide up to 202 user I/Os and are available in a wide variety of packages and speed

grades.

The automotive-grade 42MX24 and 42MX36 include system-level features such as IEEE Standard

1149.1 (JTAG) Boundary Scan Testing and fast wide-decode modules. In addition, the A42MX36 device

offers dual-port SRAM for implementing fast FIFOs, LIFOs, and temporary data storage. The storage

elements can efficiently address applications requiring wide datapath manipulation.

MX Architectural Overview

The MX devices are composed of fine-grained building blocks that enable fast, efficient logic designs. All

devices within these families are composed of logic modules, I/O modules, routing resources and clock

networks, which are the building blocks for fast logic designs. In addition, the A42MX36 device contains

embedded dual-port SRAM modules, which are optimized for high-speed datapath functions such as

FIFOs, LIFOs and scratchpad memory. A42MX24 and A42MX36 also contain wide-decode modules.

Logic Modules

The 40MX logic module is an eight-input, one-output logic circuit designed to implement a wide range of

logic functions with efficient use of interconnect routing resources (Figure

1-1).

Figure 1-1 •

40MX Logic Module

The logic module can implement the four basic logic functions (NAND, AND, OR and NOR) in gates of

two, three, or four inputs. The logic module can also implement a variety of D-latches, exclusivity

functions, AND-ORs and OR-ANDs. No dedicated hardwired latches or flip-flops are required in the

array; latches and flip-flops can be constructed from logic modules whenever required in the

application.

Revision 3

1 -1

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