MH8S72DBFD-8 datasheet, PDF - EEWORLD Datasheet

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MH8S72DBFD-8: Description603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM; Categorystorage storage; File Size971KB，56 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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MH8S72DBFD-8 Overview

603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

MH8S72DBFD-8 Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
package instruction	DIMM, DIMM168
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	6 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	603979776 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
self refresh	YES
Maximum standby current	0.034 A
Maximum slew rate	1.015 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL

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Preliminary Spec.

Some contents are subject to change without notice.

MITSUBISHI LSIs

MH8S72DBFD-7,-8

603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION

The MH8S72DBFD is 8388608 - word x 72-bit Sy nchronous

DRAM module. This consist of nine industry standard

8M x 8 Sy nchronous DRAMs in TSOP.

The TSOP on a card edge dual in-line package prov ides any

application where high densities and large of quantities memory

are required.

This is a socket-ty pe memory m odule ,suitable f or easy

interchange or addition of m odule.

85pin

1pin

FEATURES

Type name

Max.

Frequency

CLK

Access Time

[component level]

94pin

95pin

10pin

11pin

MH8S72DBFD-7

MH8S72DBFD-8

100MHz

6ns (CL = 2, 3)

6ns (CL = 3)

Utilizes industry standard 8M X 8 Synchronous DRAMs in

TSOP package , industry standard Resistered buffer in TSSOP

package and industry standard PLL in TSSOP package

Single 3.3V +/- 0.3V supply

LVTTL Interface

Burst length 1/2/4/8/Full Page(programmable)

Burst W rite / Single W rite(programmable)

Auto precharge / All bank precharge controlled by A10

Auto refresh and Self refresh

4096 refresh cycles every 64ms

Discrete IC and module design conform to

PC/100 specification.

(module Spec. Rev. 1.2 and SPD 1.2A)

124pin

125pin

40pin

41pin

APPLICATION

Main memory or graphic memory in computer systems

168pin

84pin

MIT-DS-0351-0.0

MITSUBISHI

ELECTRIC

30/Sep. /1999

MH8S72DBFD-8 Related Products

	MH8S72DBFD-8	MH8S72DBFD-7
Description	603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM	603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Maker	Mitsubishi	Mitsubishi
package instruction	DIMM, DIMM168	DIMM, DIMM168
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	6 ns	6 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz	100 MHz
I/O type	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168
memory density	603979776 bit	603979776 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	72	72
Number of functions	1	1
Number of ports	1	1
Number of terminals	168	168
word count	8388608 words	8388608 words
character code	8000000	8000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	8MX72	8MX72
Output characteristics	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
refresh cycle	4096	4096
self refresh	YES	YES
Maximum standby current	0.034 A	0.034 A
Maximum slew rate	1.015 mA	1.015 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL

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