MH32S72APHB-8 datasheet, PDF - EEWORLD Datasheet

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MH32S72APHB-8: Description2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM; Categorystorage storage; File Size712KB，55 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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MH32S72APHB-8 Overview

2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM

MH32S72APHB-8 Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
package instruction	DIMM, DIMM168
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	6 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	2415919104 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
self refresh	YES
Maximum standby current	0.018 A
Maximum slew rate	2.88 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL

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Preliminary Spec.

Some contents are subject to change without notice.

MITSUBISHI LSIs

MH32S72APHB -6,-7,-8

2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM

DESCRIPTION

The MH32S72APHB is 33554432 - word by 72-bit

Synchronous DRAM module. This consists of

eighteen industry standard 16Mx8 Synchronous

DRAMs in TSOP and one industory standard

EEPROM in TSSOP.

The mounting of TSOP on a card edge Dual

Inline package provides any application where

high densities and large quantities of memory are

required.

This is a socket type - memory modules, suitable

for easy interchange or addition of modules.

85pin

1pin

94pin

95pin

10pin

11pin

FEATURES

Frequency

-6

-7

-8

133MHz

100MHz

CLK Access Time

(Component SDRAM)

5.4ns(CL=3)

6.0ns(CL=2)

6.0ns(CL=3)

124pin

125pin

40pin

41pin

Utilizes industry standard 16M x 8 Sy nchronous DRAMs

TSOP and industry standard EEPROM in TSSOP

168-pin (84-pin dual in-line package)

single 3.3V±0.3V power supply

Max. Clock frequency -6:133MHz,-7,8:100MHz

Fully synchronous operation referenced to clock

rising edge

4 bank operation controlled by BA0,1(Bank Address)

/CAS latency- 2/3(programmable)

Burst length- 1/2/4/8/Full Page(programmable)

Burst type- sequential / interleave(programmable)

Column access - random

Auto precharge / All bank precharge controlled by A10

Auto refresh and Self refresh

4096 refresh cycle /64ms

LVTTL Interface

Discrete IC and module design conform to

PC100/PC133 specification.

168pin

84pin

APPLICATION

PC main memory

MIT-DS-0380-0.1

MITSUBISHI

ELECTRIC

( 1 / 55 )

17.Mar.2000

MH32S72APHB-8 Related Products

	MH32S72APHB-8	MH32S72APHB-6	MH32S72APHB-7
Description	2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM	2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM	2,415,919,104-BIT (33,554,432 - WORD BY 72-BIT)Synchronous DRAM
Maker	Mitsubishi	Mitsubishi	Mitsubishi
package instruction	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168
Reach Compliance Code	unknow	unknow	unknow
ECCN code	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	6 ns	5.4 ns	6 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz	133 MHz	100 MHz
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168
memory density	2415919104 bi	2415919104 bi	2415919104 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	72	72	72
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	168	168	168
word count	33554432 words	33554432 words	33554432 words
character code	32000000	32000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	32MX72	32MX72	32MX72
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096
self refresh	YES	YES	YES
Maximum standby current	0.018 A	0.018 A	0.018 A
Maximum slew rate	2.88 mA	2.88 mA	2.88 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Parts packaging code	-	DIMM	DIMM
Contacts	-	168	168

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