MH32S72DBFA-8 datasheet, PDF - EEWORLD Datasheet

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MH32S72DBFA-8: Description2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM; Categorystorage storage; File Size981KB，56 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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MH32S72DBFA-8 Overview

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

MH32S72DBFA-8 Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
package instruction	DIMM, DIMM168
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	MULTI BANK PAGE BURST
Maximum access time	6 ns
Other features	AUTO REFRESH AND SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	2415919104 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
self refresh	YES
Maximum standby current	0.071 A
Maximum slew rate	3.995 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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Preliminary Spec.

Some contents are subject to change without notice.

MITSUBISHI LSIs

MH32S72DBFA -7,-8

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION

The MH32S72DBFA is 33554432 - word x 72-bit

Sy nchronous DRAM stacked structural module. This

consist of t hirty -six industry standard 16M x 4

Sy nchronous DRAMs in TSOP.

The stacked structure of TSOP on a card edge dual in-

line package prov ides any application where high

densities and large of quantities memory are required.

This is a socket-ty pe memory m odule ,suitable f or

easy interchange or addition of m odule.

85pin

1pin

FEATURES

Type name

Max.

Frequency

CLK

Access Time

[latch mode]

(CL = 4)

94pin

95pin

10pin

11pin

MH32S72DBFA-7

MH32S72DBFA-8

100MHz

6ns

124pin

Utilizes industry standard 16M X 4 Synchronous DRAMs in

TSOP package , industry standard Resister in TSSOP package ,

and industry standard PLL in TSSOP package.

Single 3.3V +/- 0.3V supply

Burst length 1/2/4/8/Full Page (programmable)

Burst type sequential / interleave (programmable)

Column access random

Burst W rite / Single W rite (programmable)

Auto precharge / Auto bank precharge controlled by A10

Auto refresh and Self refresh

LVTTL Interface

4096 refresh cycles every 64ms

Intel specifiation(rev. 1.2)compliant PCB and SPD 1.2A

40pin

41pin

125pin

APPLICATION

Main memory unit for computers, Microcomputer memory.

168pin

84pin

MIT-DS-348-0.0

MITSUBISHI

ELECTRIC

29/Sep. /1999

MH32S72DBFA-8 Related Products

	MH32S72DBFA-8	MH32S72DBFA-7
Description	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Maker	Mitsubishi	Mitsubishi
package instruction	DIMM, DIMM168	DIMM, DIMM168
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
access mode	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
Maximum access time	6 ns	6 ns
Other features	AUTO REFRESH AND SELF REFRESH	AUTO REFRESH AND SELF REFRESH
Maximum clock frequency (fCLK)	100 MHz	100 MHz
I/O type	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168
memory density	2415919104 bit	2415919104 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	72	72
Number of functions	1	1
Number of ports	1	1
Number of terminals	168	168
word count	33554432 words	33554432 words
character code	32000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	32MX72	32MX72
Output characteristics	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
refresh cycle	4096	4096
self refresh	YES	YES
Maximum standby current	0.071 A	0.071 A
Maximum slew rate	3.995 mA	3.995 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL
Base Number Matches	1	1

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