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MH32S72DBFA-7

Description
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Categorystorage    storage   
File Size981KB,56 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric Compare View All

MH32S72DBFA-7 Overview

2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

MH32S72DBFA-7 Parametric

Parameter NameAttribute value
MakerMitsubishi
package instructionDIMM, DIMM168
Reach Compliance Codeunknown
ECCN codeEAR99
access modeMULTI BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO REFRESH AND SELF REFRESH
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density2415919104 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals168
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX72
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
self refreshYES
Maximum standby current0.071 A
Maximum slew rate3.995 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH32S72DBFA -7,-8
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
DESCRIPTION
The MH32S72DBFA is 33554432 - word x 72-bit
Sy nchronous DRAM stacked structural module. This
consist of t hirty -six industry standard 16M x 4
Sy nchronous DRAMs in TSOP.
The stacked structure of TSOP on a card edge dual in-
line package prov ides any application where high
densities and large of quantities memory are required.
This is a socket-ty pe memory m odule ,suitable f or
easy interchange or addition of m odule.
85pin
1pin
FEATURES
Type name
Max.
Frequency
CLK
Access Time
[latch mode]
(CL = 4)
94pin
95pin
10pin
11pin
MH32S72DBFA-7
MH32S72DBFA-8
100MHz
100MHz
6ns
6ns
124pin
Utilizes industry standard 16M X 4 Synchronous DRAMs in
TSOP package , industry standard Resister in TSSOP package ,
and industry standard PLL in TSSOP package.
Single 3.3V +/- 0.3V supply
Burst length 1/2/4/8/Full Page (programmable)
Burst type sequential / interleave (programmable)
Column access random
Burst W rite / Single W rite (programmable)
Auto precharge / Auto bank precharge controlled by A10
Auto refresh and Self refresh
LVTTL Interface
4096 refresh cycles every 64ms
Intel specifiation(rev. 1.2)compliant PCB and SPD 1.2A
40pin
41pin
125pin
APPLICATION
Main memory unit for computers, Microcomputer memory.
168pin
84pin
MIT-DS-348-0.0
MITSUBISHI
ELECTRIC
29/Sep. /1999
1

MH32S72DBFA-7 Related Products

MH32S72DBFA-7 MH32S72DBFA-8
Description 2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM 2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Maker Mitsubishi Mitsubishi
package instruction DIMM, DIMM168 DIMM, DIMM168
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Maximum access time 6 ns 6 ns
Other features AUTO REFRESH AND SELF REFRESH AUTO REFRESH AND SELF REFRESH
Maximum clock frequency (fCLK) 100 MHz 100 MHz
I/O type COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168
memory density 2415919104 bit 2415919104 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 72 72
Number of functions 1 1
Number of ports 1 1
Number of terminals 168 168
word count 33554432 words 33554432 words
character code 32000000 32000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 32MX72 32MX72
Output characteristics 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
refresh cycle 4096 4096
self refresh YES YES
Maximum standby current 0.071 A 0.071 A
Maximum slew rate 3.995 mA 3.995 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm
Terminal location DUAL DUAL
Base Number Matches 1 1
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