SpecNo.JENF243J-0004B-01
Reference Only
NFZ32BW□□□HN10L
REFERENCE SPECIFICATION
P1/8
CHIP NOISE FILTER
1.Scope
This reference specification applies to NFZ32BW_HN10L Series, Chip Noise Filter.
2.Part Numbering
(ex)
NF
Z
32
BW
3R6
H
N
1
0
L
Product ID Structure Dimension Features Impedance Performance Category Numbers Other Packaging
(L×W)
of Circuit
L:Taping
3.Rating
・Operating
Temperature Range.
(Ambient temperature; Self-temperature rise is not included)
(Product temperature; Self- temperature rise is included)
・Storage
Temperature Range.
Impedance at 1MHz
Customer Part Number
MURATA Part Number
(Ω)
Tolerance
(Ω)
Tolerance
-40 to +105°C
-40 to +125°C
-40 to +125°C
DC Resistance
∗1
Rated Current(mA)
∗2
Ambient
temperature
85℃
∗3
Ambient
temperature
105℃
NFZ32BW3R6HN10L
NFZ32BW7R4HN10L
NFZ32BW9R0HN10L
NFZ32BW150HN10L
NFZ32BW210HN10L
NFZ32BW320HN10L
NFZ32BW420HN10L
NFZ32BW700HN10L
NFZ32BW111HN10L
NFZ32BW151HN10L
NFZ32BW221HN10L
NFZ32BW291HN10L
NFZ32BW451HN10L
NFZ32BW621HN10L
NFZ32BW881HN10L
3.6
7.4
9.0
15
21
32
42
70
110
150
220
290
450
620
880
±30%
0.030
0.045
0.057
0.076
0.12
0.18
0.24
0.38
0.57
0.81
1.15
1.78
2.28
2.70
4.38
±20%
2550
2050
1750
1600
1200
1000
850
700
520
450
390
310
275
250
200
1600
1320
1010
970
670
530
510
380
320
240
190
140
120
110
80
∗1:
As for the rated current, rated current derated as figure.1 depending on the operating temperature.
∗2:
When applied rated current to the Products, temperature rise caused by self heating will be 40°C or less.
∗3:
When applied rated current to the Products, temperature rise caused by self heating will be 20°C or less.
Fugure. 1
Rated
Current
at 85℃
Rated Current [mA]
Rated
Current
at 105℃
85
Operating Temperature
(
Ambient temperature
)[℃]
105
MURATA MFG.CO., LTD
SpecNo.JENF243J-0004B-01
Reference Only
《In
case of doubt》
Temperature
: 20 ± 2°C
Humidity
: 60 to 70%(RH)
Atmospheric Pressure : 86 to 106 kPa
P2/8
4. Testing Conditions
《Unless
otherwise specified》
Temperature : Ordinary Temperature (15 to 35°C)
Humidity
: Ordinary Humidity (25 to 85 %(RH))
5.Appearance and Dimensions
2.7±0.2
1.55±0.15
2.5±0.2
Ａ
Ａ
2.5±0.2
3.2±0.3
Ａ ：2.8 以 下
※½品本½への表示はありません。
※
No marking.
(
(in mm)
単 ½
■Unit
Mass（Typical value）
0.044½
mm)
0.9±0.3 1.3±0.2 0.9±0.3
6.Electrical Performance
No.
6.1
6.2
Item
Impedance
DC Resistance
Specification
Impedance shall meet item 3.
DC Resistance shall meet item 3.
Test Method
Measuring Equipment :
KEYSIGHT 4192A
or equivalent
Measuring Frequency: 1MHz
Measuring Equipment: Digital multi meter
7.Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip Noise Filter shall not be
damaged.
Test Method
Substrate: Glass-epoxy substrate
Force: 10N
Hold Duration: 5±1s
Coil
Chip
Ｆ
Substrate
7.2
Bending Test
Substrate: Glass-epoxy substrate
(100×40×1.0mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5s
Pressure jig
R230
F
Deflection
45
45
Product
(in mm)
7.3
Vibration
Chip Noise Filter shall not be
damaged.
Oscillation Frequency : 10 to 2000 to 10Hz for 20 min
Total amplitude : 1.5 mm or Acceleration amplitude
98 m/s
2
whichever is smaller.
Testing Time: A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6 hours)
MURATA MFG.CO., LTD
SpecNo.JENF243J-0004B-01
No.
7.4
Item
Solderability
Reference Only
Test Method
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
P3/8
Specification
The wetting area of the electrode shall
be at least 90% covered with new
solder coating.
7.5
Resistance to
Soldering Heat
Appearance: No damage
Impedance Change: within ± 10%
8.Environmental Performance (It shall be soldered on the substrate.)
No.
8.1
Item
Heat Resistance
Specification
Appearance: No damage
Impedance Change: within ± 10%
DC Resistance Change: within ± 10%
Test Method
Temperature: 105±2°C
Time:
1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
Temperature: -40±2°C
Time:
1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
Temperature: 40±2°C
Humidity: 90~95%(RH)
Time:
1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
1 cycle:
1 step: -40±2°C / 30±3 min
2 step: Ordinary temp. / 10 to 15 min
3 step: +105±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
8.2
Cold Resistance
8.3
Humidity
8.4
Temperature
Cycle
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
φ
1.5
-0
+0.1
※
Lead- in/out wire
1.75±0.1
(
0.2
)
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
Dimension of the Cavity is measured
at the bottom side.
3.5±0.05
3.6±0.2
8.0±0.2
4.0±0.1
2.9±0.2
4.0±0.1
1.7±0.2
Direction of feed
(in mm)
2.0±0.05
MURATA MFG.CO., LTD
SpecNo.JENF243J-0004B-01
Reference Only
P4/8
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape
Cover tape
9.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
300mm/min
0.2 to 0.7N
(minimum value is typical)
Plastic tape
165 to 180 degree
F
Cover tape
10N min.
5N min.
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
Trailer
:
160 min.
2.0±0.5
Label
190 min
Empty tape
210 min
Cover tape
Leader
φ
60± 1
0
9±1
0
13±1.4
φ
13.0±0.2
φ
21.0±0.8
Direction of feed
φ
180
±
3
0
(in mm)
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc
½½½
∗1)
<Expression of Inspection No.>
(1) Factory Code
(2) Date
□□
OOOO
×××
(1)
(2)
(3
)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep.
→
1 to 9, Oct. to Dec.
→
O, N, D
Third, Fourth digit : Day
ROHS – Y (△)
(1) (2)
(3) Serial No.
∗2)
« Expression of RoHS marking »
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (∗2) ,Quantity, etc
½½½
MURATA MFG.CO., LTD
SpecNo.JENF243J-0004B-01
9.8. Specification of Outer Case
Reference Only
Outer Case Dimensions (mm)
Label
P5/8
W
186
D
186
H
93
Standard Reel Quantity
in Outer Case (Reel)
5
H
D
W
∗
Above Outer Case size is typical. It depends on a quantity
of an order.
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
(5) Medical equipment
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land pattern for flow and reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
(Reflow)
Land
Chip Noise Filter
Solder Resist
(Flow)
Chip Noise Filter
Land
Solder Resist
2.5
0.8
(in mm)
(in mm)
2.2
4.8
1.3
(in mm)
(Distance between the products for Flow)
(in mm)
11.2 Flux, Solder
・Use
rosin-based flux.
Flux
・Don’t
use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
・Don’t
use water-soluble flux.
・Use
Sn-3.0Ag-0.5Cu solder
Solder
・Standard
thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
MURATA MFG.CO., LTD
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