EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AA-01-6650-D

Description
Resistor Networks u0026 Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-B0202AA-01-6650-D Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AA-01-6650-D - - View Buy Now

WBC-B0202AA-01-6650-D Overview

Resistor Networks u0026 Arrays

WBC-B0202AA-01-6650-D Parametric

Parameter NameAttribute value
Product CategoryResistor Networks & Arrays
ManufacturerTT Electronics plc
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
6.27 Saturday Beijing: Best-selling author, senior engineer of foreign company, Embedded Linux Technology Salon
Best-selling author, senior engineer of foreign enterprise, experience of embedded Linux example development technology (free) —— Development experts and best-selling author will have face-to-face tec...
tope Linux and Android
【Drive circuit technology summary】
《Friends who don’t need it or already have it can skip it. File format: PDF》 "I will post them in this order" 1 IGBT drive circuit 3 pages 2 IGBT drive and protection 9 pages 3 Detailed design of IGBT...
szwbrf1 Integrated technical exchanges
Channel misalignment: ghosts linger and cause great harm
The problem of STM32 ADC being prone to channel misalignment in sequential scan DMA transfer mode has been around for a long time. In the product I made, this mode was used because 7 channels were use...
wangkj22 stm32/stm8
How to identify the three poles of thyristor
The method of identifying the three poles of the thyristor is very simple. According to the principle of PN junction, just use a multimeter to measure the resistance value between the three poles......
zzzzer16 MCU
Application of single chip microcomputer in medical signal detector
1 Introduction Traditional testing instruments are mostly completed by hardware circuits, which not only have single functions, but also have long development cycles and are difficult to maintain. Wit...
小丸子 Medical Electronics
PCF8576CT IIC 4X40 LCD Driver
PCF8576 is a character LCD driver/controller with I2C bus interface. It has 4 backplane outputs and 40 display segment outputs, so it can drive up to 160 LCD display segments. PCF8576 can be cascaded ...
rain Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 622  1192  1658  822  2843  13  24  34  17  58 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号