EEWORLDEEWORLDEEWORLD

Part Number

Search

38-9513-10TLTL

Description
IC Socket, DIP38, 38 Contact(s),
CategoryThe connector    socket   
File Size189KB,1 Pages
ManufacturerAries Electronics
Download Datasheet Parametric View All

38-9513-10TLTL Overview

IC Socket, DIP38, 38 Contact(s),

38-9513-10TLTL Parametric

Parameter NameAttribute value
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresLOW PROFILE; UL 94V-0
Device slot typeIC SOCKET
Type of equipment usedDIP38
Shell materialGLASS FILLED POLYAMIDE46
Number of contacts38
Base Number Matches1
Series 513 LO-PRO
®
file Collet
Sockets with Solder Tail Pins
FEATURES:
• LO-PRO
®
file Collet Sockets are available with solder tail or wire wrap
pins. Consult Data Sheet No. 12012 for wire wrap pins.
• Choose from several size and plating options.
SPECIFICATIONS:
• Body material is black UL 94V-0 Glass-filled 4/6 Nylon.
• Pin body is Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-00.
• Pin body plating is either 10μ [.25μm] min. Gold per MIL-G-45204 or
200μ [5.08μm] min. 93/7 Tin/Lead per ASTM B545 or 200μ [5.08μm]
min. Tin per ASTM B545 Type 1 over 100μ [2.54μm] min. Nickel per
SAE-AMS-QQ-N-290.
• 4-fingered collet contact is Beryllium Copper Alloy per UNS C17200
ASTM-B194-01.
• Contact plating is either 200μ [5.08μm] min. 93/7 Tin/Lead per ASTM
B545 or 200μ [5.08μm] min Tin per ASTM B545 Type 1 or 10μ [.25μm]
Gold per MIL-G-45204 over 50μ min. [1.27μm] Nickel per SAE-AMS-
Note: Aries specializes in custom design and production. In addition to the
standard products shown on this page, special materials, platings, sizes, and
QQ-N-290. Heavy 30μ [.76μm] Gold Plating also available.
configurations can be furnished, depending on quantities. Aries reserves the
• Contact current rating=3 Amps.
right to change product specifications without notice.
• Insertion Force=180 grams/pin; Withdrawal Force=90 grams/pin; Normal
ORDERING INFORMATION
Force=140 grams/pin; based on a .018 [.46] dia. test lead.
• Operating temperature=221°F [105°C] Tin & Tin/Lead plating
XX-X513-1XXX XX
No. of pins
=257°F [125°C] Gold plating.
(see table)
• Accepts leads .015-.025 [.38-.64] in diameter,
Optional plating suffix:
Row-to-row spacing:
.100-.146 [2.54-3.71] long.
H=Heavy Gold on collet
2: “Y”=.200 [5.08]
MOUNTING CONSIDERATIONS:
T=Tin collet/Tin shell
3
: “Y”=.300 [7.62]
•Suggested PCB hole size=.030 ± .002 [.76 ± .05] dia.
TL=Tin/Lead Collet/
A
LL DIMENSIONS
:
INCHES
[
MILLIMETERS
]
“W”=NO. OF PINS PER ROW X .100 [2.54]
“X”=(NO. OF PINS PER ROW - 1) X .100 [2.54]
4: “Y”=.400 [10.16]
6: “Y”=.600 [15.24]
9: “Y”=.900 [22.86]
Series:
Tin/Lead Shell
Plating:
0=Gold collet/Tin shell
0TL=Gold collet/Tin/Lead
shell
1=Gold collet/Gold shell
Solder tail pin
All tolerances ± .005 [.13]
unless otherwise specified
SOLDER TAIL PIN
Centers “Y”
.200 [5.08]
.300 [7.62]
.400 [10.16]
.600 [15.24]
Dim. “Z”
.300 [5.08]
.400 [10.16
.500 [12.70]
.700 [17.78]
Body Style Available Sizes
A
2 thru 10
C
B
C
C
B
B
2 thru 20
22 thru 40
2 thru 22
2 thru 40
42 thru 48
2 thru 64
.900 [22.86] 1.000 [25.40]
Consult Data Sheet No.
12012 for LO-PRO
®
file
collet sockets with wire
wrap pins.
http://www.arieselec.com • info@arieselec.com
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
NORTH AMERICA
Frenchtown, NJ USA
TEL:(908) 996-6841
FAX:(908) 996-3891
abc
EUROPE
TEL: +44 870 240 0249
FAX: +44 871 919 6033
europe@arieselec.com
12011
REV.G
Design and implementation of virtual digital oscilloscope based on LabVIEW
The design and implementation of a virtual digital oscilloscope based on LabVIEW is provided for your reference...
zzfd97 DIY/Open Source Hardware
Fujitsu FRAM experience submission ---- The same program cannot run on STM32 but can run on MSP430
[i=s]This post was last edited by upc_arm on 2014-1-6 23:22[/i] The same program cannot be run on STM32 but can be run on MSP430. The two codes are very similar, but the status register read out by MS...
upc_arm Integrated technical exchanges
What IC is this???
How knowledgeable are you? What kind of electronic device is this (the IC circled in the picture below)? It is used in the power supply. Is it an inductor? I've seen it before, don't know what it was....
weiiaser Power technology
Why can my USB to serial cable only virtualize com5, com6,..., that is, ports above com4?
But the software ttermpro.exe I need to use can only select from com1 to com4 to let the USB to serial port virtualize com1 and com2?...
563876287 Embedded System
mcbsp data acquisition and DMA issues
I used mcbsp to collect AD, and I need to put the collected data into the memory card, so I used the ping-pong cache method. Every time I collected a number, I used DMA to move it to the memory. When ...
ziweidoushu DSP and ARM Processors
Beijing Mobile Municipal Cooperation Enables Mobile Card Payment for Public Transportation
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:03[/i] [b]The promotion of NFC in mobile phones has actually encountered great resistance. For example, the iPhone does not support NFC...
wstt Mobile and portable

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 268  554  2924  1834  322  6  12  59  37  7 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号