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BZX84C12ET1G

Description
Zener Diodes 12V 225mW
CategoryDiscrete semiconductor    diode   
File Size160KB,6 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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BZX84C12ET1G Overview

Zener Diodes 12V 225mW

BZX84C12ET1G Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerON Semiconductor
Parts packaging codeSOT-23
package instructionPLASTIC PACKAGE-3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresUL RECOGNIZED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance25 Ω
JEDEC-95 codeTO-236AB
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.225 W
Certification statusNot Qualified
Nominal reference voltage12 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature40
Maximum voltage tolerance5.39%
Working test current5 mA
BZX84CxxxET1G Series,
SZBZX84CxxxET1G Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features
http://onsemi.com
225 mW Rating on FR−4 or FR−5 Board
Zener Breakdown Voltage Range
2.4 V to 75 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Peak Power
225 W (8
X
20
ms)
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available*
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
SOT−23
CASE 318
STYLE 8
3
Cathode
1
Anode
MARKING DIAGRAM
xxx M
G
G
1
xxx
M
G
= Device Code
= Date Code*
= Pb−Free Package
260C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20
ms
(Note 1)
@ T
L
25C
Total Power Dissipation on FR−5 Board,
(Note 2) @ T
A
= 25C
Derated above 25C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina
Substrate, (Note 3) @ T
A
= 25C
Derated above 25C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Symbol
P
pk
P
D
R
qJA
P
D
R
qJA
T
J
, T
stg
Max
225
Unit
W
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
10,000 /
Tape & Reel
225
1.8
556
300
2.4
417
−65
to
+150
mW
mW/C
C/W
mW
mW/C
C/W
C
BZX84CxxxET1G
SZBZX84CxxxET1G
BZX84CxxxET3G
SZBZX84CxxxET3G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 9.
2. FR−5 = 1.0 X 0.75 X 0.62 in.
3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
January, 2012
Rev. 8
1
Publication Order Number:
BZX84C2V4ET1/D

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Description Zener Diodes 12V 225mW Energy Rated Zeners in SOT-23 225 W, SOT-23 (TO-236) 3 LEAD, 10000-REEL Zener Diodes 5.6V 225mW Energy Rated Zeners in SOT-23 225 W, SOT-23 (TO-236) 3 LEAD, 10000-REEL Zener Diodes 7.5V 225mW Zener Diodes 24V 225mW Zener Diodes 4.7V 225mW Zener Diodes 10V 225mW
Is it lead-free? Lead free Lead free Lead free Lead free Contains lead Lead free Contains lead Contains lead
Parts packaging code SOT-23 SOT-23 (TO-236) 3 LEAD SOT-23 SOT-23 (TO-236) 3 LEAD SOT-23 SOT-23 SOT-23 SOT-23
package instruction PLASTIC PACKAGE-3 PLASTIC PACKAGE-3 PLASTIC PACKAGE-3 PLASTIC PACKAGE-3 R-PDSO-G3 PLASTIC PACKAGE-3 R-PDSO-G3 R-PDSO-G3
Contacts 3 3 3 3 3 3 3 3
Reach Compliance Code compliant unknown compliant unknown not_compliant compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Configuration SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Diode type ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE ZENER DIODE
Maximum dynamic impedance 25 Ω 10 Ω 40 Ω 15 Ω 15 Ω 70 Ω 80 Ω 20 Ω
JEDEC-95 code TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB TO-236AB
JESD-30 code R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3 R-PDSO-G3
JESD-609 code e3 e3 e3 e3 e0 e3 e0 e0
Number of components 1 1 1 1 1 1 1 1
Number of terminals 3 3 3 3 3 3 3 3
Maximum operating temperature 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 260 240 260 240 240
polarity UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL
Maximum power dissipation 0.225 W 0.225 W 0.225 W 0.225 W 0.225 W 0.225 W 0.225 W 0.225 W
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal reference voltage 12 V 6.2 V 5.6 V 9.1 V 7.5 V 24 V 4.7 V 10 V
surface mount YES YES YES YES YES YES YES YES
technology ZENER ZENER ZENER ZENER ZENER ZENER ZENER ZENER
Terminal surface Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn) Tin/Lead (Sn/Pb) Tin (Sn) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40 30 40 30 30
Maximum voltage tolerance 5.39% 6.45% 7.14% 6.08% 6.04% 5.79% 6.38% 6%
Working test current 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA
Is it Rohs certified? conform to - conform to - incompatible conform to incompatible incompatible
Maker ON Semiconductor - ON Semiconductor - ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor
Other features UL RECOGNIZED UL RECOGNIZED UL RECOGNIZED - UL RECOGNIZED UL RECOGNIZED UL RECOGNIZED UL RECOGNIZED
Humidity sensitivity level 1 - 1 - 1 1 1 1

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