AMIS-30623
Micro-stepping Motor Driver
INTRODUCTION
The AMIS−30623 is a single−chip micro−stepping motordriver with
position controller and control/diagnostic interface. It is ready to build
dedicated mechatronics solutions connected remotely with a LIN master.
The chip receives positioning instructions through the bus and
subsequently drives the motor coils to the desired position. The
on−chip position controller is configurable (OTP or RAM) for
different motor types, positioning ranges and parameters for speed,
acceleration and deceleration. The AMIS−30623 acts as a slave on the
LIN bus and the master can fetch specific status information like
actual position, error flags, etc. from each individual slave node.
An integrated sensor−less step−loss detection prevents the
positioner from loosing steps and stops the motor when running into
stall. This enables silent, yet accurate position calibrations during a
referencing run and allows semi−closed loop operation when
approaching the mechanical end−stops.
The chip is implemented in I2T100 technology, enabling both high
voltage analog circuitry and digital functionality on the same chip.
The AMIS−30623 is fully compatible with the automotive voltage
requirements.
PRODUCT FEATURES
Motordriver
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SOIC−20
8 or 9 SUFFIX
CASE 751AQ
•
•
•
•
•
•
•
Micro−stepping Technology
Sensorless Step−loss Detection
Peak Current up to 800 mA
Fixed Frequency PWM Current−control
Automatic Selection of Fast and Slow Decay Mode
No external Fly−back Diodes Required
NQFP−32
A or B SUFFIX
CASE 560AA
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Compliant with 14 V Automotive Systems and
Industrial Systems up to 24 V
•
Motion Qualification Mode (Note 1)
Controller with RAM and OTP Memory
•
Position Controller
•
Configurable Speeds and Acceleration
•
Input to Connect Optional Motion Switch
LIN Interface
•
•
•
•
•
Open−circuit Detection
High Temperature Warning and Management
Low Temperature Flag
LIN Bus Short−circuit Protection to Supply and Ground
Lost LIN Safe Operation
Power Saving
•
Physical Layer Compliant to LIN rev. 2.0. Data−link
Layer Compatible with LIN rev. 1.3 (Note 2)
•
Field−programmable Node Addresses
•
Dynamically Allocated Identifiers
•
Diagnostics and Status Information
Protection
•
Powerdown Supply Current < 100
mA
•
5 V Regulator with Wake−up On LIN Activity
EMI Compatibility
•
LIN Bus Integrated Slope Control
•
HV Outputs with Slope Control
Patents
•
Overcurrent Protection
•
Undervoltage Management
•
US 7,271,993
•
US 7,288,956
•
This is a Pb−Free Device
1. Not applicable for “Product Versions AMIS30623C6238(R)G, AMIS30623C623B(R)G”
2. Minor exceptions to the conformance of the data−link layer to LIN rev. 1.3.
©
Semiconductor Components Industries, LLC, 2009
May, 2009
−
Rev. 7
1
Publication Order Number:
AMIS−30623/D
AMIS−30623
APPLICATIONS
The AMIS−30623 is ideally suited for small positioning
applications. Target markets include: automotive (headlamp
alignment, HVAC, idle control, cruise control), industrial
equipment (lighting, fluid control, labeling, process control,
XYZ tables, robots...) and building automation (HVAC,
Table 1. ORDERING INFORMATION
Part No.
AMIS30623C6239G
AMIS30623C6239RG
AMIS30623C623AG
AMIS30623C623ARG
AMIS30623C6238G
AMIS30623C6238RG
AMIS30623C623BG
AMIS30623C623BRG
Peak Current
800 mA
800 mA
800 mA
800 mA
800 mA
800 mA
800 mA
800 mA
Industrial
High Voltage Version
End Market/Version
Package*
SOIC−20
(Pb−Free)
SOIC−20
(Pb−Free)
NQFP−32 (7 x 7 mm)
(Pb−Free)
NQFP−32 (7 x 7 mm)
(Pb−Free)
SOIC−20
(Pb−Free)
Automotive
High Temperature
Version
SOIC−20
(Pb−Free)
NQFP−32 (7 x 7 mm)
(Pb−Free)
NQFP−32 (7 x 7 mm)
(Pb−Free)
Shipping
†
Tube/Tray
Tape & Reel
Tube/Tray
Tape & Reel
Tube/Tray
Tape & Reel
Tube/Tray
Tape & Reel
surveillance, satellite dish, renewable energy systems).
Suitable applications typically have multiple axes or require
mechatronics solutions with the driver chip mounted
directly on the motor.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
QUICK REFERENCE DATA
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
V
BB
, VHW2, VSWI
Vlin
T
J
Tst
Vesd (Note 5)
Supply voltage, hardwired address and SWI pins
Bus input voltage
Junction temperature range (Note 4)
Storage temperature
HBM Electrostatic discharge voltage on LIN pin
HBM Electrostatic discharge voltage on other pins (Note 6)
MM Electrostatic discharge voltage on other pins (Note 7)
Min
−0.3
−40
−50
−55
−4
−2
−200
Max
+40 (Note 3)
+40
+175
+160
+4
+2
+200
Unit
V
V
°C
°C
kV
kV
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. OPERATING RANGES
Parameter
V
BB
T
J
3.
4.
5.
6.
7.
Supply voltage
Operating temperature range
Min
+6.5
−40
Max
+29
+165
Unit
V
°C
For limited time: V
BB
<0.5 s, SWI and HW2 pins <1.0 s.
The circuit functionality is not guaranteed.
HBM according to AEC−Q100: EIA−JESD22−A114−B (100 pF via 1.5 kW) and MM according to AEC−Q100: EIA−JESD22−A115−A.
Tested on AMIS30623C6238(R)G version.
Tested on AMIS30623C623B(R)G version.
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2
AMIS−30623
Table of Contents
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick Reference Data . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package Thermal Resistance . . . . . . . . . . . . . . . . . . . . . 5
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Typical Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Positioning Parameters . . . . . . . . . . . . . . . . . . . . . . . . 10
SWI
AMIS−30623
LIN
BUS
Interface
Position
Controller
HW[2:0]
TST
Controller
Structural Description . . . . . . . . . . . . . . . . . . . . . . . . .
Functions Description . . . . . . . . . . . . . . . . . . . . . . . . .
Position Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Main Control and Register . . . . . . . . . . . . . . . . . . . . . .
Autarkic Functionality in Undervoltage Condition . . .
OTP Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Priority Encoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Motordriver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Lost Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Application Commands . . . . . . . . . . . . . . . . . . . .
Application Commands . . . . . . . . . . . . . . . . . . . . . . . .
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13
14
14
21
23
24
29
31
36
41
44
45
59
I−sense
PWM
regulator
X
MOTXP
MOTXN
Decoder
Main Control
Registers
OTP
−
ROM
Sinewave
Table
DAC’s
4 MHz
Vref
Temp
sense
Oscillator
I−sense
Voltage
Regulator
Charge Pump
Motion detection
PWM
regulator
Y
MOTYP
MOTYN
VBB
VDD
CPN CPP VCP
GND
Figure 1. Block Diagram
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3
AMIS−30623
GND
32
XP
XP
VBB
VBB
VBB
SWI
NC
HW0
9
HW1
VDD
GND
TST
LIN
GND
HW2
NC
1
2
3
4
5
6
7
8
AMIS−30623
(Top View)
31 30 29 28 27 26 24
23
22
21
20
19
18
10 11 12 13 14 15 17
16
GND
GND
GND
XN
YP
YP
XN
HW0
HW1
VDD
GND
TST
LIN
GND
HW2
CPN
CPP
1
2
3
4
5
6
7
8
9
10
SOIC−20
AMIS−30623
20
19
18
17
16
15
14
13
12
11
SWI
VBB
MOTXP
GND
MOTXN
MOTYP
GND
MOTYN
VBB
VCP
25
YN
YN
VBB
VBB
VBB
VCP
CPP
CPN
Figure 2. SOIC−20 and NQFP−32 Pin−out
Table 4. PIN DESCRIPTION
Pin Name
HW0
HW1
VDD
GND
TST
LIN
HW2
CPN
CPP
VCP
V
BB
MOTYN
MOTYP
MOTXN
MOTXP
SWI
NC
Bit 0 of LIN−ADD
Bit 1 of LIN−ADD
Pin Description
To be tied to GND or V
DD
SOIC−20
1
2
3
4, 7, 14, 17
5
6
8
9
10
11
12,19
13
15
16
18
20
NQFP−32
8
9
10
11, 14, 25, 26, 31, 32
12
13
15
17
18
19
3, 4, 5, 20, 21, 22
23, 24
27, 28
29, 30
1, 2
6
7, 16
Internal supply (needs external decoupling capacitor)
Ground, heat sink
Test pin (to be tied to ground in normal operation)
LIN−bus connection
Bit 2 LIN−ADD
Negative connection of pump−capacitor (charge pump)
Positive connection of pump−capacitor (charge pump)
Charge−pump filter−capacitor
Battery voltage supply
Negative end of phase Y coil
Positive end of phase Y coil
Negative end of phase X coil
Positive end of phase X coil
Switch input
Not connected (to be tied to ground)
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AMIS−30623
PACKAGE THERMAL RESISTANCE
The AMIS−30623 is available in SOIC−20 and optimized
NQFP−32 packages. For cooling optimizations, the NQFP
has an exposed thermal pad which has to be soldered to the
PCB ground plane. The ground plane needs thermal vias to
conduct the head to the bottom layer. Figures 3 and 4 give
examples for good power distribution solutions.
For precise thermal cooling calculations the major
thermal resistances of the devices are given. The thermal
media to which the power of the devices has to be given are:
•
Static environmental air (via the case)
•
PCB board copper area (via the device pins and
exposed pad)
The thermal resistances are presented in Table 5: DC
Parameters.
Rth
Junction−to−Leads and
Exposed Pad
−
Rthjp
Rth
Junction−to−Leads
Rthjp
19
0,95
The major thermal resistances of the device are the Rth
from the junction to the ambient (Rthja) and the overall Rth
from the junction to the leads (Rthjp).
The NQFP device is designed to provide superior thermal
performance. Using an exposed die pad on the bottom
surface of the package is mainly contributing to this
performance. In order to take full advantage of the exposed
pad, it is most important that the PCB has features to conduct
heat away from the package. A thermal grounded pad with
thermal vias can achieve this.
In the table below, one can find the values for the Rthja and
Rthjp, simulated according to the JESD−51 norm:
Package
SOIC−20
NQFP−32
Rth
Junction−to−Ambient
Rthja (1S0P)
62
60
Rth
Junction−to−Ambient
Rthja (2S2P)
39
30
The Rthja for 2S2P is simulated conform to JESD−51 as
follows:
•
A 4−layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
•
Board thickness is 1.46 mm (FR4 PCB material)
•
The 2 signal layers: 70
mm
thick copper with an area of
5500 mm
2
copper and 20% conductivity
•
The 2 power internal planes: 36
mm
thick copper with
an area of 5500 mm
2
copper and 90% conductivity
The Rthja for 1S0P is simulated conform to JESD−51 as
follows:
•
A 1−layer printed circuit board with only 1 layer
•
Board thickness is 1.46 mm (FR4 PCB material)
•
The layer has a thickness of 70
mm
copper with an area
of 5500 mm
2
copper and 20% conductivity
Figure 3. Example of SOIC−20 PCB Ground Plane
Layout (preferred layout at top and bottom)
Figure 4. Example of NQFP−32 PCB Ground Plane
Layout (preferred layout at top and bottom)
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5
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