AD8392ARE datasheet, PDF - EEWORLD Datasheet

Low Power, High Output Current, Quad Op Amp,

Dual-Channel ADSL/ADSL2+ Line Driver

AD8392

FEATURES

Four current feedback, high current amplifiers

Ideal for use as ADSL/ADSL2+ dual-channel Central Office

(CO) line drivers

Low power operation

Power supply operation from ±5 V (+10 V) up to ±12 V (+24 V)

Less than 3 mA/Amp quiescent supply current for full

power ADSL/ADSL2+ CO applications (20.4 dBm line

power, 5.5 CF)

Three active power modes plus shutdown

High output voltage and current drive

400 mA peak output drive current

44 V p-p differential output voltage

Low distortion

−72 dBc @1 MHz second harmonic

−82 dBc @ 1 MHz third harmonic

High speed: 900 V/µs differential slew rate

Additional functionality of AD8392ACP

On-chip common-mode voltage generation

PIN CONFIGURATIONS

V

EE

1, 2

1

PD0 1, 2

PD1 1, 2

+V

IN

1

–V

IN

1

V

OUT

1

V

CC

1, 2

NC

V

OUT

3

2

3

4

5

6

7

8

9

28

GND

27

NC

26

NC

1

2

25

+V

IN

2

24

–V

IN

2

23

V

OUT

2

AD8392

22

NC

21

V

CC

3, 4

20

V

OUT

4

–V

IN

3

10

+V

IN

3

11

NC

12

NC

13

GND

14

3

4

19

–V

IN

4

18

+V

IN

4

PD0 3, 4

V

EE

3, 4

04802-0-001

17

PD1 3, 4

16

15

NC = NO CONNECT

Figure 1. AD8392ARE, 28-Lead TSSOP/EP

V

COM

1, 2

PD1 1, 2

PD0 1, 2

V

EE

1, 2

+V

IN

1

+V

IN

2

24

GND

32 31 30 29 28 27 26 25

NC

APPLICATIONS

ADSL/ADSL2+ CO line drivers

XDSL line drives

High output current, low distortion amplifiers

DAC output buffer

NC

1

–V

IN

1

V

OUT

1

V

CC

1, 2

NC

V

OUT

3

–V

IN

3

NC

2

3

4

5

6

7

8

9

1

2

NC

–V

IN

2

V

OUT

2

NC

V

CC

3, 4

V

OUT

4

–V

IN

4

NC

23

22

21

AD8392

20

19

3

4

18

17

PD0 3, 4

V

COM

3, 4

PD1 3, 4

V

EE

3, 4

+V

IN

3

+V

IN

4

GND

NC

GENERAL DESCRIPTION

The AD8392 is comprised of four high output current, low

power consumption, operational amplifiers. It is particularly

well suited for the CO driver interface in digital subscriber line

systems, such as ADSL and ADSL2+. The driver is capable of

providing enough power to deliver 20.4 dBm to a line, while

compensating for losses due to hybrid insertion and back

termination resistors. In addition, the low distortion, fast slew

rate, and high output current capability make the AD8392 ideal

for many other applications, including medical, instrumenta-

tion, DAC output drivers, and other high peak current circuits.

The AD8392 is available in two thermally enhanced packages, a

28-lead TSSOP EP (AD8392ARE) and a 5 mm × 5 mm 32-lead

LFCSP (AD8392ACP). Four bias modes are available via the use

of two digital bits (PD1, PD0).

10 11 12 13 14 15 16

04802-0-002

Figure 2. AD8392ACP, 32-Lead LFCSP 5 mm × 5 mm

Additionally, the AD8392ACP provides V

COM

pins for on-chip

common mode voltage generation.

The low power consumption, high output current, high output

voltage swing, and robust thermal packaging enable the AD8392

to be used as the CO line drivers in ADSL and other xDSL sys-

tems, as well as other high current, single-ended or differential

amplifier applications.

Rev. 0

Information furnished by Analog Devices is believed to be accurate and reliable.

However, no responsibility is assumed by Analog Devices for its use, nor for any

infringements of patents or other rights of third parties that may result from its use.

Specifications subject to change without notice. No license is granted by implication

or otherwise under any patent or patent rights of Analog Devices. Trademarks and

registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781.329.4700

www.analog.com

Fax: 781.326.8703

AD8392

TABLE OF CONTENTS

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 5

Thermal Resistance ...................................................................... 5

ESD Caution.................................................................................. 5

Typical Performance Characteristics ............................................. 6

Theory of Operation ...................................................................... 11

Applications..................................................................................... 12

Supplies, Grounding, and Layout ............................................. 12

Resistor Selection........................................................................ 12

Power Management ................................................................... 12

Driving Capacitive Loads.......................................................... 12

Thermal Considerations............................................................ 13

Typical ADSL/ADSL2+ Application ........................................ 13

Multitone Power Ratio............................................................... 14

Lightning and AC Power Fault ................................................. 15

Outline Dimensions ....................................................................... 16

Ordering Guide .......................................................................... 16

REVISION HISTORY

7/04—Revision 0: Initial Version

Rev. 0 | Page 2 of 16

AD8392

SPECIFICATIONS

V

S

= ±12 V or +24 V, R

L

= 100 Ω, G = +5, PD = (0, 0), T = 25°C, unless otherwise noted.

Table 1.

Parameter

DYNAMIC PERFORMANCE

−3 dB Small Signal Bandwidth

−3 dB Large Signal Bandwidth

Peaking

Slew Rate

NOISE/DISTORTION PERFORMANCE

Second Harmonic Distortion

Third Harmonic Distortion

Multitone Input Power Ratio

Voltage Noise (RTI)

+Input Current Noise

−Input Current Noise

INPUT CHARACTERISTICS

RTI Offset Voltage

+Input Bias Current

−Input Bias Current

Input Resistance

Input Capacitance

Common-Mode Rejection Ratio

OUTPUT CHARACTERISTICS

Differential Output Voltage Swing

Single-Ended Output Voltage Swing

Linear Output Current

POWER SUPPLY

Operating Range (Dual Supply)

Operating Range (Single Supply)

Total Quiescent Current

PD1, PD0 = (0, 0)

PD1, PD0 = (0, 1)

PD1, PD0 = (1, 0)

PD1, PD0 = (1, 1) (Shutdown State)

PD = 0 Threshold

PD = 1 Threshold

+Power Supply Rejection Ratio

−Power Supply Rejection Ratio

Min

30

20

850

Typ

40

25

0.05

900

−72

−82

−70

4.3

10

13

−5.0

±3.0

5.0

10.0

400

2.0

68

44.0

22.0

400

+5.0

10.0

15.0

Max

Unit

MHz

dB

V/µs

dBc

nV/√Hz

pA/√Hz

mV

µA

kΩ

pF

dB

V

mA

V

mA/Amp

V

dB

Test Conditions/Comments

V

OUT

= 0.1 V p-p, R

F

= 2 kΩ

V

OUT

= 4 V p-p, R

F

= 2 kΩ

V

OUT

= 0.1 V p-p, R

F

= 2 kΩ

V

OUT

= 20 V p-p, R

F

= 2 kΩ

f

C

= 1 MHz, V

OUT

= 2 V p-p

f

C

= 1 MHz, V

OUT

= 2 V p-p

26 kHz to 2.2 MHz, Z

LINE

= 100 Ω Differential Load

f = 10 kHz

V

+IN

− V

−IN

64

42.0

21.0

(∆V

OS, DM (RTI)

)/(∆V

IN, CM

)

∆V

OUT

∆V

OUT

R

L

= 10 Ω, f

C

= 100 kHz

46.0

23.0

±5

10

6.0

3.6

2.8

0.4

1.8

64

76

±12

24

7.0

4.0

3.3

1.2

0.8

68

79

∆V

OS, DM (RTI)

/∆V

CC

, ∆V

CC

= ±1 V

∆V

OS, DM (RTI)

/∆V

EE

, ∆V

EE

= ±1 V

Rev. 0 | Page 3 of 16

AD8392

V

S

= ±5 V or +10 V, R

L

= 100 Ω, G = +5, PD = (0, 0), T = 25°C, unless otherwise noted.

Table 2.

Parameter

DYNAMIC PERFORMANCE

−3 dB Small Signal Bandwidth

−3 dB Large signal Bandwidth

Peaking

Slew Rate (Rise)

Slew Rate (Fall)

NOISE/DISTORTION PERFORMANCE

Second Harmonic Distortion

Third Harmonic Distortion

Voltage Noise (RTI)

+Input Current Noise

−Input Current Noise

INPUT CHARACTERISTICS

RTI Offset Voltage

+Input Bias Current

−Input Bias Current

Input Resistance

Input Capacitance

Common-Mode Rejection Ratio

OUTPUT CHARACTERISTICS

Differential Output Voltage Swing

Single-Ended Output Voltage Swing

Linear Output Current

POWER SUPPLY

Operating Range (Dual Supply)

Operating Range (Single Supply)

Total Quiescent Current

PD1, PD0 = (0, 0)

PD1, PD0 = (0, 1)

PD1, PD0 = (1, 0)

PD1, PD0 = (1, 1) (Shutdown State)

PD = 0 Threshold

PD = 1 Threshold

+Power Supply Rejection Ratio

−Power Supply Rejection Ratio

Min

30

20

300

400

Typ

40

25

0.05

350

450

−72

−82

4.3

10

13

−5.0

±3.0

5.0

10.0

400

2.0

66

16.0

8.0

400

+5.0

10.0

15.0

Max

Unit

MHz

dB

V/µs

dBc

nV/√Hz

pA/√Hz

mV

µA

kΩ

pF

dB

V

mA

V

mA/Amp

V

dB

Test Conditions/Comments

V

OUT

= 0.1 V p-p, R

F

= 2 kΩ

V

OUT

= 4 V p-p, R

F

= 2 kΩ

V

OUT

= 0.1 V p-p, R

F

= 2 kΩ

V

OUT

= 7 V p-p, R

F

= 2 kΩ

V

OUT

= 7 V p-p, R

F

= 2 kΩ

f

C

= 1 MHz, V

OUT

= 2 V p-p

f

C

= 1 MHz, V

OUT

= 2 V p-p

f = 10 kHz

V

+IN

− V

−IN

62

14.0

7.0

(∆V

OS, DM (RTI)

)/(∆V

IN, CM

)

∆V

OUT

∆V

OUT

R

L

= 10 Ω, f

C

= 100 kHz

18.0

9.0

±5

+10

5.4

3.5

2.6

0.4

1.8

72

64

±12

+24

6.0

4.0

3.0

1.0

0.8

76

68

∆V

OS, DM (RTI)

/∆V

CC

, ∆V

CC

= ±1 V

∆V

OS, DM (RTI)

/∆V

EE

, ∆V

EE

= ±1 V

Rev. 0 | Page 4 of 16

AD8392

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Supply Voltage

Power Dissipation

Storage Temperature

Operating Temperature Range

Lead Temperature Range (Soldering 10 sec)

Junction Temperature

Rating

±13 V (+26 V)

See Figure 3

−65°C to +150°C

−40°C to +85°C

300°C

150°C

RMS output voltages should be considered. If R

L

is referenced

to V

S−

as in single-supply operation, the total power is V

S

× I

OUT

.

In single supply with R

L

to V

S−

, worst case is V

OUT

= V

S

/2.

Airflow increases heat dissipation, effectively reducing θ

JA

. Also,

more metal directly in contact with the package leads from

metal traces, through holes, ground, and power planes reduces

the θ

JA

.

Figure 3 shows the maximum safe power dissipation in the

package versus the ambient temperature for the LFCSP-32 and

TSSOP-28/EP packages on a JEDEC standard 4-layer board. θ

JA

values are approximations.

7

T

J

= 150°C

6

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θ

JA

is specified for the worst-case conditions, i.e., θ

JA

is specified

for device soldered in circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

LFCSP-32 (CP)

TSSOP-28/EP (RE)

θ

JA

27.27

35.33

Unit

°C/W

MAXIMUM POWER DISSIPATION (W)

5

LFCSP-32

4

TSSOP-28/EP

3

2

1

0

–40 –30 –20 –10

04802-0-003

Maximum Power Dissipation

The power dissipated in the package (P

D

) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (V

S

) times the

quiescent current (I

S

). Assuming that the load (R

L

) is midsupply,

the total drive power is V

S

/2 × I

OUT

, some of which is

dissipated in the package and some in the load (V

OUT

× I

OUT

).

0

10 20 30 40 50

TEMPERATURE (°C)

60

70

80

90

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

See the Thermal Considerations section for additional thermal

design guidance.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprie-

tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic

discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.

Rev. 0 | Page 5 of 16

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