30HS26 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> 30HS26

30HS26: DescriptionCeramic Capacitor, Multilayer, Ceramic, Through Hole Mount, RADIAL LEADED; CategoryPassive components capacitor; File Size79KB，5 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

30HS26 Overview

Ceramic Capacitor, Multilayer, Ceramic, Through Hole Mount, RADIAL LEADED

30HS26 Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	compliant
ECCN code	EAR99
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
Manufacturer's serial number	HS
Installation features	THROUGH HOLE MOUNT
multi-layer	Yes
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
surface mount	NO
Terminal shape	WIRE
Base Number Matches	1

Preview

Download Datasheet

View All

High Voltage

Space Quality MLC (-55° to +125°C)

HS Series

FEATURES

1. Conforms to MIL-PRF-49467. (Group A Screening,

Subgroup 1)

2. 100% Corona tested.

3. No IR degradation over life.

4. High density, low DF ceramic.

5. Conservative and proven design is recommended for

non-repairable applications such as spacecraft.

6. CSAM inspection is available and is recommended for

space applications.

7. Burn-in in a non-contaminating inert fluid is standard for

>2KV; optional for 500V or 1 KV parts.

CAPACITOR OUTLINE DRAWING

1.25

Min.

.025 (22 ga.) solder plated

Cu-clad Steel (CCFE)

DIMENSIONS

Style

HS20

HS21

HS22

HS30

HS23

HS31

HS24

HS25

HS26

HS33

HS34

HS35

HS36

Sizes in Inches (mm) max.

Length (L)

.250 (6.35)

.320 (8.13)

.370 (9.40)

.450 (11.43)

.470 (11.94)

.550 (13.97)

.570 (14.48)

.670 (17.02)

.770 (19.56)

.850 (21.59)

1.050 (26.67)

1.250 (31.75)

1.450 (36.83)

Width (W)

.220 (5.59)

.280 (7.11)

.300 (7.62)

.220 (5.59)

.400 (10.16)

.280 (7.11)

.500 (12.70)

.600 (15.24)

.720 (18.29)

.400 (10.16)

.500 (12.70)

.600 (15.24)

.720 (18.29)

Thickness (T)

.200 (5.08)

.250 (6.35)

.200 (5.08)

.270 (6.89)

.250 (6.35)

.270 (6.89)

Lead Spacing

±0.030 (S)

.170 (4.32)

.220 (5.59)

.275 (6.98)

.300 (7.62)

.375 (9.52)

.400 (10.16)

.475 (12.06)

.575 (14.60)

.675 (17.14)

.700 (17.78)

.975 (24.76)

1.175 (29.84)

1.375 (34.92)

PART NUMBER AND ORDERING INFORMATION

VOLTAGE

05 = 500V

10 = 1000V

20 = 2000V

30 = 3000V

STYLE

HS24, etc.

DIELECTRIC

B = X7R

N = BP C0G (NP0)

CAPACITANCE VALUE

First two digits are significant,

last digit is number of zeros,

i.e., 103=10000pF

40 = 4000V

50 = 5000V

75 = 7500V

100 = 10,000V

HS24

103

INERT LIQUID (BURN-IN)

Std. for >2kV;

Add “F” if required

for 500V or 1kV parts

C=CSAM

MARKING

(HS20, HV21)

(All Other Sizes)

103K

HS24B103K

1 kV

KEC

Date Code

TOLERANCE

J = ±5%

K = ±10%

M = ±20%

P = 0/+100%

Z = -20%/+80%

Recommended Resources

Yarn dyeing machine automatic control circuit a

Lightning protection wiring for direct-match generators of 300kW and below a

Humidity control circuit using NAND gate and transistor

Proximity switch circuit diagram of tca205a

25Hz sine wave oscillation circuit

Computer motherboard circuit diagram 810 2_25

EEWorld is hiring! Fuzhou (work from home)/Beijing (work in a busy business district): [size=2][color=#696969][font=微软雅黑][size=2][color=#696969][font=微软雅黑] [/font][/color][/size] Electronic Engineering World is a professional portal website that provides information on electronic techno...; eric_wang Recruitment

Help! Help! WTP WSP Send MMS How to use WTP SAP cutting: I want to use the WTP protocol to split and call PDU to send MMS files, but I don't know how to encode. Please give me some guidance if you know how. . . . . . . . . ....; yygy Embedded System

[Serial] [ALIENTEK Battleship STM32 Development Board] STM32 Development Guide--Chapter 24 DAC Experiment: Chapter 24 DAC Experiment In the previous two chapters, we introduced the use of STM32 ADC. In this chapter, we will introduce the DAC function of STM32. In this chapter, we will use the key (or USMAR...; 正点原子 stm32/stm8

The models currently promoted by TI are:: The models currently promoted by TI are:BQ27541, BQ27741, BQ27510, BQ27520, BQ27531/530, BQ27421/441, and BQ27425.1. Consider the package BQ27741 BQ27520 BQ27425BQ27530/BQ27531 are CSP packages, which...; qwqwqw2088 Analogue and Mixed Signal

VHDL Program and Simulation of Stepper Motor Positioning Control System: [font=Verdana]Stepper motor positioning control system VHDL program and simulation library IEEE; use IEEE.std_logic_1164.all; use IEEE.std_logic_arith.all; use IEEE.std_logic_unsigned.all;[/font] [fon...; aimyself FPGA/CPLD

MSP430: Hey guys, I want to ask about the MSP430 serial port and the computer program. It seems that there is a problem. But when debugging, I found that the COM port used for MSP430 debugging and downloading...; 付经辉 Microcontroller MCU

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components