5962-9461107HXX datasheet, PDF

5962-9461107HXX: DescriptionSRAM Module, 2MX8, 35ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size316KB，10 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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5962-9461107HXX Overview

SRAM Module, 2MX8, 35ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	PGA
package instruction	PGA,
Contacts	66
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	35 ns
Other features	CONFIGURABLE AS 512K X 32 OR 1M X 16; TTL COMPATIBLE INPUT OUTPUT
JESD-30 code	S-CPGA-P66
JESD-609 code	e4
length	35.2 mm
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2MX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.7 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	35.2 mm
Base Number Matches	1

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